21
Taber H Smith, Vikas Mehrotra, David White: Dummy fill for integrated circuits. Praesagus, Fish & Richardson PC, September 8, 2005: US20050196964-A1

A method and system are described to reduce process variation as a result of the electrochemical deposition (ECD), also referred to as electrochemical plating (ECP), and chemical mechanical polishing (CMP) processing of films in integrated circuit manufacturing processes. The described methods use p ...


22
Taber H Smith, Vikas Mehrotra, David White: Use of models in integrated circuit fabrication. Praesagus a Massachusetts corporation, Fish & Richardson PC, October 20, 2005: US20050235246-A1

A method and system are described to reduce process variation as a result of the electrochemical deposition (ECD), also referred to as electrochemical plating (ECP), and chemical mechanical polishing (CMP) processing of films in integrated circuit manufacturing processes. The described methods use p ...


23
Taber H SMITH, Vikas MEHROTRA, David WHITE: Characterization and reduction of variation for integrated circuits. Cadence Design Systems, Vista Ip Law Group, January 29, 2009: US20090031261-A1

A method and system are described to reduce process variation as a result of the semiconductor processing of films in integrated circuit manufacturing processes. The described methods use process variation and electrical impact to modify the design and manufacture of integrated circuits.


24
Vikas Mehrotra, Rishi R Arora, Yun Jing, Apurv Mathur: Method for seamless transfer of a mobile station to a neighboring base station in an overload condition. Motorola, Motorola, May 13, 2010: US20100118705-A1

A method includes receiving a request from a mobile station (102) to initiate a call session with a base station (104). After receiving the request, the base station determines that it cannot process the call session with the mobile station because the base station is fully loaded and sends a busy i ...



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