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John R Pastore, Victor K Nomi, Howard P Wilson: Pad array semiconductor device with thermal conductor and process for making the same. Motorola, Patricia S Goddard, February 8, 1994: US05285352 (331 worldwide citation)

A pad array semiconductor device (35) includes a thermal conductor (28) integrated into a circuitized substrate (14). A semiconductor die (12) is mounted on the substrate overlying the thermal conductor to establish a thermal path away from the die. The thermal conductor may also be covered or surro ...


2
Frank Djennas, Victor K Nomi, John R Pastore, Twila J Reeves, Les Postlethwait: Method for making semiconductor device having no die supporting surface. Motorola, Minh Hien N Clark, December 12, 1995: US05474958 (321 worldwide citation)

A wire bondable plastic encapsulated semiconductor device (58) having no die supporting surface can be manufactured. In one embodiment, a semiconductor die (22) and a plurality of conductors (12) extending toward the periphery of the die are provided. The die is rigidly held in place on a workholder ...


3
John R Pastore, Victor K Nomi, Howard P Wilson: Method for testing a ball grid array semiconductor device and a device for such testing. Motorola, Patricia S Goddard, Jeffrey S Abel, March 24, 1998: US05731709 (134 worldwide citation)

A ball grid array semiconductor device (30) includes a plurality of conductive balls (36) and a plurality of conductive castellations (18) around its periphery as redundant electrical connections to a semiconductor die (12). During testing of the device in a test socket (50), the conductive castella ...


4
Victor K Nomi, John R Pastore: Vacuum seal indicator for flexible packaging material. Motorola, Minh Hien N Clark, February 22, 1994: US05287962 (6 worldwide citation)

Plastic encapsulated semiconductor devices are susceptible to moisture due to the permeability of molding compounds. Devices may be baked until dry before being shipped to the customer to reduce the risk of cracking. To retain this dry condition, devices are packaged and shipped in dry-packs. A vacu ...


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Victor K Nomi, John R Pastore, Charles G Bigler: Method for making an electronic component having an organic substrate. Motorola, Patricia S Goddard, November 25, 1997: US05691242 (6 worldwide citation)

A method for packaging an integrated circuit begins by providing an organic substrate (310) having at least one device site (312). Within each device site, one or more electronic devices (532) is mounted. Around the device site, slots (316) and corner holes (318) are formed. In one embodiment, a neg ...


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Victor K Nomi, John R Pastore, Twila J Reeves: Method for plating using nested plating buses and semiconductor device having the same. Motorola, July 11, 2000: USRE036773 (1 worldwide citation)

Routing density of a wiring substrate (10) is increased by providing a nested plating bus (18) as a supplement to an external plating bus (16). A first group of conductive traces (14) is connected to the nested plating bus, while another group of traces is connected to the external plating bus. Afte ...


7
Victor K Nomi, John R Pastore: Vacuum sealing indicator unit for the semiconductor device packaging material, particularly concerned with checking defect in vacuum sealing of a dry-pack bag. Motorola, February 5, 1999: KR1019930013426

PURPOSE: A vacuum sealing indicator unit for the semiconductor device packaging material is provided to check easily whether or not the vacuum sealing is damaged, by watching the contact between a dry-pack bag and the indicator unit which has holes (and/or protrusions) on the surface supposed to be ...


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