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Belgacem Haba Belgacem (Bel) Haba
Young Kim, Belgacem Haba, Vernon Solberg: Stacked microelectronic assembly and method therefor. Tessera, Lerner David Littenberg Krumholz & Mentlik, May 1, 2001: US06225688 (230 worldwide citation)

A stacked microelectronic assembly and its resulting structure includes a flexible substrate having a plurality of attachment sites, test contacts and conductive terminals, and including a wiring layer with leads extending to the attachment sites. The assembly includes a plurality of microelectronic ...


2
Belgacem Haba Belgacem (Bel) Haba
Young Kim, Belgacem Haba, Vernon Solberg: Stacked microelectronic assembly and method therefor. Tessers, Lerner David Littenberg Krumholz & Mentlik, March 2, 2004: US06699730 (172 worldwide citation)

A method of making a stacked microelectronic assembly includes providing a flexible substrate having a plurality of attachment sites, test contacts and conductive terminals, and including a wiring layer with leads extending to the attachment sites. The method includes assembling a plurality of micro ...


3
Belgacem Haba Belgacem (Bel) Haba
Michael Warner, Philip Damberg, John B Riley, David Gibson, Young Gon Kim, Belgacem Haba, Vernon Solberg: Stacked microelectronic assemblies. Tessera, Lerner David Littenberg Krumholz & Mentlik, December 12, 2006: US07149095 (41 worldwide citation)

A stacked microelectronic assembly includes a plurality of microelectronic subassemblies. Each subassembly includes a substrate having at least one site, a plurality of first contacts and a plurality of second contacts. Each subassembly also has at least one microelectronic element assembled to the ...


4
Belgacem Haba Belgacem (Bel) Haba
Michael Warner, Philip Damberg, John B Riley, David Gibson, Young Gon Kim, Belgacem Haba, Vernon Solberg: Methods of making microelectronic assemblies including folded substrates. Tessera, Lerner David Littenberg Krumholz & Mentlik, September 11, 2003: US20030168725-A1 (1 worldwide citation)

A stacked microelectronic assembly comprises a plurality of subassemblies including folded substrates and at least one microelectronic element. The subassemblies are stacked substantially vertically.


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Belgacem Haba Belgacem (Bel) Haba
Young Kim, Belgacem Haba, Vernon Solberg: Stacked microelectronic assembly and method therefor. Lerner David Littenberg Krumholz & Mentlik, July 5, 2001: US20010006252-A1 (1 worldwide citation)

A method of making a stacked microelectronic assembly includes providing a flexible substrate having a plurality of attachment sites, test contacts and conductive terminals, and including a wiring layer with leads extending to the attachment sites. The method includes assembling a plurality of micro ...


6
Belgacem Haba Belgacem (Bel) Haba
Vernon Solberg, Pieter H Bellaar, Young Gon Kim, Belgacem Haba: Stacked microelectronic assemblies having basal compliant layers. Tessera, Tessera, LERNER DAVID et al, December 21, 2006: US20060286717-A1

A method of making a stacked microelectronic assembly includes providing a flexible substrate having first and second ends, the flexible substrate having a plurality of attachment sites located between the first and second ends thereof including a first one of the attachment sites located adjacent t ...


7
Vernon Solberg: Stacked microelectronic assembly and method therefor. Tessera, Lerner David Littenberg Krumholz & Mentlik, September 19, 2000: US06121676 (216 worldwide citation)

A method of making a stacked microelectronic assembly such as a semiconductor chip assembly and its resulting structure includes providing a flexible substrate having a plurality of attachment sites and conductive terminals and including a wiring layer with leads extending to the attachment sites. T ...


8
Vernon Solberg: Compliant multichip package. Tessera, Lerner David Littenberg Krumholz & Mentlik, November 6, 2001: US06313528 (146 worldwide citation)

A multichip package includes a substrate including a plurality of conductive traces and flexible leads connected to outer ends of at least some of the conductive traces adjacent the periphery of said flexible substrate, the substrate including conductive terminals accessible at a surface thereof con ...


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Vernon Solberg: Method of making a compliant multichip package. Tessera, Lerner David Littenberg Krumholz & Mentlik, April 25, 2000: US06054337 (105 worldwide citation)

A method of making a multichip package includes providing a flexible substrate having a plurality of conductive traces and flexible leads connected to outer ends of the conductive traces adjacent the periphery of said flexible substrate. The flexible substrate includes conductive terminals accessibl ...


10
Vernon Solberg: Compliant multichip package. Tessera, Lerner David Littenberg Krumholz & Mentlik, November 14, 2000: US06147401 (60 worldwide citation)

A multichip package includes a substrate including a plurality of conductive traces and flexible leads connected to outer ends of at least some of the conductive traces adjacent the periphery of said flexible substrate, the substrate including conductive terminals accessible at a surface thereof con ...



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