1
Vernon C Gregory: Metal substrated printed circuit. Akzo America, Louis A Morris, August 15, 1989: US04858073 (76 worldwide citation)

A semiconductor fabrication having thermal characteristics comparable to hybrid ceramic packages comprises a flexible copper foil printed circuit on a thin polyimide film layer thermally laminated to a metal surface, such as aluminum, with a high temperature thermal plastic, such as polyetherimide. ...


2
Vernon C Gregory: In-mold process for fabrication of molded plastic printed circuit boards. Ostrolenk Faber Gerb & Soffen, April 29, 1986: US04584767 (44 worldwide citation)

A molding process and resulting product is disclosed in which a printed circuit pattern carrier is placed in a mold and is molded to an insulation carrier. The insulation carrier is disclosed as a printed circuit board or the interior of the insulation housing for an electrical product. Plural lamin ...


3
Vernon C Gregory: In-mold process for fabrication of molded plastic printed circuit boards. Ostrolenk Faber Gerb & Soffen, December 1, 1987: US04710419 (37 worldwide citation)

A molding process and resulting product is disclosed in which a printed circuit pattern carrier is placed in a mold and is molded to an insulation carrier. The insulation carrier is disclosed as a printed circuit board or the interior of the insulation housing for an electrical product. Plural lamin ...


4
Vernon C Gregory: Industrial control processor. Motorola, Joe E Barbee, May 8, 1979: US04153942 (8 worldwide citation)

A one bit industrial control unit for executing a program of non-arithmetic instructions includes a one-bit bidirectional data conductor, a 4-bit instruction register and instruction decoder, and control logic coupled to the instruction decoder for generating control signals to effect execution of t ...