1
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Ilyas Mohammed, Vage Oganesian, David Ovrutsky, Laura Wills Mirkarimi: Reconstituted wafer level stacking. Tessera, Lerner David Littenberg Krumholz & Mentlik, March 8, 2011: US07901989 (66 worldwide citation)

A stacked microelectronic assembly is fabricated from a structure which includes a plurality of first microelectronic elements having front faces bonded to a carrier. Each first microelectronic element may have a first edge and a plurality of first traces extending along the front face towards the f ...


2
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Ilyas Mohammed, Vage Oganesian, David Ovrutsky, Laura Mirkarimi: Off-chip vias in stacked chips. Tessera, Lerner David Littenberg Krumholz & Mentlik, December 13, 2011: US08076788 (45 worldwide citation)

A microelectronic assembly includes first and second stacked microelectronic elements, each having spaced apart traces extending along a front face and beyond at least a first edge thereof. An insulating region can contact the edges of each microelectronic element and at least portions of the traces ...


3
Belgacem Haba Belgacem (Bel) Haba
Vage Oganesian, David Ovrutsky, Charles Rosenstein, Belgacem Haba, Giles Humpston: Wafer-level fabrication of lidded chips with electrodeposited dielectric coating. Tessera Technologies Ireland, Lerner David Littenberg Krumholz & Mentlik, May 3, 2011: US07935568 (37 worldwide citation)

A method is provided for fabricating a unit including a semiconductor element such as a sensor unit, e.g., for optical imaging. A semiconductor element has plurality of conductive features exposed at the front surface and semiconductive or conductive material exposed at least one of the front and re ...


4
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Vage Oganesian: Edge connect wafer level stacking. Tessera, Lerner David Littenberg Krumholz & Mentlik, November 9, 2010: US07829438 (34 worldwide citation)

In accordance with an aspect of the invention, a stacked microelectronic package is provided which may include a plurality of subassemblies, e.g., a first subassembly and a second subassembly underlying the first subassembly. A front face of the second subassembly may confront the rear face of the f ...


5
Belgacem Haba Belgacem (Bel) Haba
Andrey Grinman, David Ovrutsky, Charles Rosenstein, Belgacem Haba, Vage Oganesian: Packaged semiconductor chips. Tessera, Lerner David Littenberg Krumholz & Mentlik, September 7, 2010: US07791199 (33 worldwide citation)

A chip-sized wafer level packaged device including a portion of a semiconductor wafer including a device, a packaging layer formed over the portion of the semiconductor wafer, the packaging layer including a material having thermal expansion characteristics similar to those of the semiconductor wafe ...


6
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Vage Oganesian: Edge connect wafer level stacking. Tessera, Lerner David Littenberg Krumholz & Mentlik, September 20, 2011: US08022527 (32 worldwide citation)

In accordance with an aspect of the invention, a stacked microelectronic package is provided which may include a plurality of subassemblies, e.g., a first subassembly and a second subassembly underlying the first subassembly. A front face of the second subassembly may confront the rear face of the f ...


7
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Kenneth Allen Honer, David B Tuckerman, Vage Oganesian: Chips having rear contacts connected by through vias to front contacts. DigitalOptics Corporation Europe, Lerner David Littenberg Krumholz & Mentlik, March 26, 2013: US08405196 (21 worldwide citation)

A microelectronic unit is provided in which front and rear surfaces of a semiconductor element may define a thin region which has a first thickness and a thicker region having a thickness at least about twice the first thickness. A semiconductor device may be present at the front surface, with a plu ...


8
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Kenneth Allen Honer, David B Tuckerman, Vage Oganesian: Chips having rear contacts connected by through vias to front contacts. DigitalOptics Corporation Europe, Lerner David Littenberg Krumholz & Mentlik, November 13, 2012: US08310036 (18 worldwide citation)

A microelectronic unit is provided in which front and rear surfaces of a semiconductor element may define a thin region which has a first thickness and a thicker region having a thickness at least about twice the first thickness. A semiconductor device may be present at the front surface, with a plu ...


9
Belgacem Haba Belgacem (Bel) Haba
Vage Oganesian, Ilyas Mohammed, Craig Mitchell, Belgacem Haba, Piyush Savalia: Active chip on carrier or laminated chip having microelectronic element embedded therein. Tessera, Lerner David Littenberg Krumholz & Mentlik, December 3, 2013: US08598695 (18 worldwide citation)

A structure including a first semiconductor chip with front and rear surfaces and a cavity in the rear surface. A second semiconductor chip is mounted within the cavity. The first chip may have vias extending from the cavity to the front surface and via conductors within these vias serving to connec ...


10
Belgacem Haba Belgacem (Bel) Haba
Vage Oganesian, Belgacem Haba, Craig Mitchell, Ilyas Mohammed, Piyush Savalia: Microelectronic elements with post-assembly planarization. Tessera, Lerner David Littenberg Krumholz & Mentlik, September 30, 2014: US08847376 (8 worldwide citation)

A microelectronic unit includes a carrier structure having a front surface, a rear surface remote from the front surface, and a recess having an opening at the front surface and an inner surface located below the front surface of the carrier structure. The microelectronic unit can include a microele ...



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