1
Uchiyama Kunio, Takahashi Yosuke, Uda Yutaka, Hoshino Susumu, Yamamoto Eiichi: Polishing device. Nikon Engineering, Nikon, July 16, 2002: JP2002-200553 (7 worldwide citation)

PROBLEM TO BE SOLVED: To prevent the contact pressure in a contact part between the surface of a substrate and a polishing face from becoming excessive even if the polishing face is protruded from the external edge of the substrate or the surface of the substrate is protruded from the external edge ...


2
Uda Yutaka: Polishing device, semiconductor device-manufacturing method using the same, and semiconductor device manufactured by the manufacturing method. Nikon, August 30, 2002: JP2002-246343 (6 worldwide citation)

PROBLEM TO BE SOLVED: To restrain edge exclusion to a narrow range by reducing edge sagging generated at the edge section of a substrate and at the same time, reducing the amount of overshoot.SOLUTION: Pluralities of first grooves 61 that are the abrasive channels for spreading abrasive to the polis ...


3
Hoshino Susumu, Yamamoto Eiichi, Hayashi Yutaka, Uda Yutaka, Shimoda Osamu, Takezawa Akihiro: Polishing equipment, polishing method, semiconductor device and its manufacturing method. Nikon, August 15, 2003: JP2003-229388 (3 worldwide citation)

PROBLEM TO BE SOLVED: To reduce edge exclusion.SOLUTION: A supporting section 14a supports the circumferential projecting part of a wafer 2 at the time of polishing. A height adjusting mechanism 18 adjusts and sets the height of the supporting section 14a. A displacement gauge 23 measures the height ...


4
Totsu Masahiro, Ono Kazuya, Uda Yutaka: Linear-motor apparatus, stage and aligner using the same driving methods of linear-motor and stage apparatus, exposure method, and manufacturing method of device. Nikon, April 27, 2001: JP2001-119916 (2 worldwide citation)

PROBLEM TO BE SOLVED: To provide a linear motor which can suppress its consumption of excess power and heat generation. SOLUTION: In a linear motor 100, a plurality of coils 111, etc., 112, etc., are arranged on the side of a stator 100. A plurality of switches S01-S30 are interposed between the coi ...


5
Uda Yutaka, Kobayashi Hitoshi, Sugaya Isao: Throwaway polishing pad plate. Nikon, November 30, 2006: JP2006-324498 (2 worldwide citation)

PROBLEM TO BE SOLVED: To provide a pad plate to be easily controlled.SOLUTION: An adapter 7 is fitted to a dummy rotary platen 6 by a bolt or the like, and a hole 8 is bored at the center of these parts. The hole 9 for a vacuum suction is formed. A throwaway polishing pad plate 1 is vacuum-sucked an ...


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7
Uda Yutaka: Method and apparatus for adjusting mold clamping force for toggle type injection molding machine. Japan Steel Works The, January 18, 2000: JP2000-015677 (1 worldwide citation)

PROBLEM TO BE SOLVED: To provide a method for adjusting automatically mold clamping force of a toggle type injection molding machine with a wide adjusting range of the mold clamping force. SOLUTION: When mold clamping force of a toggle type injection molding machine is adjusted, at first, position o ...


8
Hayashi Yutaka, Uda Yutaka: Polishing apparatus, semiconductor device manufacturing method using the polishing apparatus, and semiconductor device manufactured by the manufacturing method. Nikon Corporation, February 11, 2004: TW575475 (1 worldwide citation)

The present invention provides a polishing apparatus with a construction which makes it possible to prevent the peripheral portions of a substrate from sloping downward as a result of the polishing member tilting at the peripheral portions of the substrate during the polishing of the substrate, and ...


9
Ono Kazuya, Uda Yutaka, Tanaka Toshihisa, Kominami Tadahiro: Linear motor, stage system, and aligner. Nikon, March 30, 2001: JP2001-086725 (1 worldwide citation)

PROBLEM TO BE SOLVED: To provide a linear motor for reducing calorific value and energy loss of the system as a whole, in a stage system which uses the linear motor. SOLUTION: A linear motor 100 includes a movable member 120, made of an annular permanent magnet 121 laid along an inner face of a tube ...


10
Uda Yutaka: Polishing apparatus, manufacturing method of semiconductor device and semiconductor device. Nikon, August 2, 2002: JP2002-217153 (1 worldwide citation)

PROBLEM TO BE SOLVED: To improve a uniform accuracy in polishing a substrate without accelerating deterioration of a polishing pad and increasing labor for maintenance.SOLUTION: Between a reference plate 51 fixed to a spindle 29 and a pad plate 52 sustained rocking freely by the spindle 29, a magnet ...