1
Frank Djennas, Victor K Nomi, John R Pastore, Twila J Reeves, Les Postlethwait: Method for making semiconductor device having no die supporting surface. Motorola, Minh Hien N Clark, December 12, 1995: US05474958 (328 worldwide citation)

A wire bondable plastic encapsulated semiconductor device (58) having no die supporting surface can be manufactured. In one embodiment, a semiconductor die (22) and a plurality of conductors (12) extending toward the periphery of the die are provided. The die is rigidly held in place on a workholder ...


2
Victor Nomi, John R Pastore, Twila J Reeves: Method for plating using nested plating buses and semiconductor device having the same. Motorola, Patricia S Goddard, November 14, 1995: US05467252 (40 worldwide citation)

Routing density of a wiring substrate (10) is increased by providing a nested plating bus (18) as a supplement to an external plating bus (16). A first group of conductive traces (14) is connected to the nested plating bus, while another group of traces is connected to the external plating bus. Afte ...


3
Victor K Nomi, John R Pastore, Twila J Reeves: Method for plating using nested plating buses and semiconductor device having the same. Motorola, July 11, 2000: USRE036773 (1 worldwide citation)

Routing density of a wiring substrate (10) is increased by providing a nested plating bus (18) as a supplement to an external plating bus (16). A first group of conductive traces (14) is connected to the nested plating bus, while another group of traces is connected to the external plating bus. Afte ...