1
Katsuaki Matsumoto, Yoshifumi Saeki, Osamu Tazawa, Minoru Kosaka, Masaki Saito, Hiroki Uemura, Tetuo Kanazashi, Seiji Hashimoto, Tsuyoshi Fujiwara, Tsutomu Fukui, Saburo Takaoka, Tsutomu Suzuki, Shozo Nakamuta, Toshihiko Hosaka, Kuniaki Shiratori, Youichiro Tsuda, Takashi Morii, Sumitaka Matsumura, Morihisa Oka: Interactive CATV system. Pioneer Electronic Corporation, Fraser and Bogucki, January 13, 1981: US04245245 (278 worldwide citation)

A two-way CATV system having a substantial number of terminals incorporates a central processor and transmitter system which continually interrogates the terminals at high speed, monitoring changes of usage of premium programs and other data while also permitting central control of access to restric ...


2
Toshiro Koyanagi, Koji Hiramatsu, Tsuyoshi Fujiwara, Yoshinobu Sawamoto, Toshiaki Iwasaki, Atsushi Hiroshige, Shunichi Katsumata: Child seat. Takata Corporation, Toyota Motor Corporation, Kanesaka & Takeuchi, February 6, 2001: US06183044 (26 worldwide citation)

A child seat is formed of a child seat main portion for holding a child having an engaging member, and a base on which the child seat main portion is detachably mounted. The base has a connecting portion to be connected to a vehicle, and a fixing member to be engageable with the engaging member of t ...


3
Junji Noguchi, Tsuyoshi Fujiwara: Semiconductor device including an interconnect having copper as a main component. Renesas Technology, Antonelli Terry Stout and Kraus, May 9, 2006: US07042095 (20 worldwide citation)

Provided are a semiconductor device comprising a semiconductor substrate, a first insulating film formed thereover, interconnects formed over the first insulating film and having copper as a main component, a second insulating film formed over the upper surface and side surfaces of each of the inter ...


4
Tsuyoshi Fujiwara: Cushion for protection of a vehicle occupants head. Takata Corporation, Foley & Lardner, April 26, 2005: US06883826 (16 worldwide citation)

A cushion for protecting a vehicle occupant's head. The cushion inflates and deploys smoothly and is configured so that gas leakage out of the cushion is reduced in order to maintain the inner pressure high for an extended period of time. The cushion includes a protective cushion element and outer s ...


5
Tsuyoshi Fujiwara: Device for massaging the sole of foot. Pearne Gordon Sessions McCoy & Granger, June 3, 1980: US04205663 (14 worldwide citation)

A device for massaging the sole of foot comprises a plurality of rows of projection rollers having projections extending in substantially radial directions of the respective rollers. The positions of the rollers and the lengths of the projections are so determined that a surface connecting the upper ...


6
Junji Noguchi, Toshinori Imai, Tsuyoshi Fujiwara: Semiconductor device manufacturing method. Renesas Technology Corporation, Reed Smith, Stanley P Fisher Esq, Juan Carlos A Marquez Esq, January 3, 2006: US06982200 (10 worldwide citation)

Disclosed is a method of manufacturing a semiconductor device which has reliable buried interconnects (wirings) and a reliable MIM capacitor. An interconnect and a capacitor bottom electrode are formed inside a hole made in six insulation films. Then a barrier insulation film is formed on the upperm ...


7
Tsuyoshi Fujiwara, Osamu Sugimoto, Chuzo Isoda: Production of polyisocyanurate foam. Dai Ichi Kogyo Seiyaku, Haight & Associates, June 22, 1982: US04336341 (10 worldwide citation)

Polyisocyanurate foam is produced by reacting a polyisocyanate component with an anhydrous reaction product between a dibasic acid anhydride and a partially alcoholated polyether-polyol with an alkali metal hydroxide and/or alkaline earth metal hydroxide. The reaction product acts as a catalyst for ...


8
Toshinori Imai, Tsuyoshi Fujiwara, Tomohiro Shiraishi, Hiroshi Ashihara, Masaaki Yoshida: Method for manufacturing semiconductor integrated circuit devices using a conductive layer to prevent peeling between a bonding pad and an underlying insulating film. Renesas Technology Corporation, Miles & Stockbridge P C, February 24, 2004: US06696357 (9 worldwide citation)

Peeling between a bonding pad and an insulating film which underlies the bonding pad is to be prevented. A laminate film constituted mainly by W which is higher in mechanical strength than a wiring layer using an Al alloy film as a main conductive layer and than a bonding pad, is formed within an ap ...


9
Tsuyoshi Fujiwara, Yoshihiro Manabe, Taishi Ogawa, Yoshiaki Meguro: Door sash for vehicle and method of manufacturing the same. Katayama Kogyo, Honda Giken Kogyo, Osha • Liang, July 27, 2010: US07762021 (7 worldwide citation)

A vehicular door sash includes a sash frame formed by subjecting a predetermined metal sheet to a roll molding process to have a predetermined cross section. The sash frame includes a groove portion for retaining a glass-run channel, a retainer portion for retaining a weather strip, a flange portion ...


10
Kenichi Takeda, Tsuyoshi Fujiwara, Toshinori Imai, Tsuyoshi Ishikawa, Toshiyuki Mine, Makoto Miura: Semiconductor device comprising metal insulator metal (MIM) capacitor. Hitachi, Brundidge & Stanger P C, September 1, 2009: US07582901 (7 worldwide citation)

An MIM capacitor using a high-permittivity dielectric film such as tantalum oxide. The MIM capacitor includes an upper electrode, a dielectric film, and a lower electrode. A second dielectric film and the dielectric film are formed between the upper electrode and the lower electrode, at the end of t ...