1
Tsuneshi Nakamura, Tatsuro Kikuchi: Hybrid integrated circuit component and printed circuit board mounting said component. Matsushita Electric Industrial, Wenderoth Lind & Ponack, January 22, 1985: US04495546 (82 worldwide citation)

A hybrid integrated circuit component for insertion in a slit of a mother printed circuit board, and a method of mounting the hybrid integrated circuit component. The circuit component includes a flexible circuit board composed of a flexible insulated substrate, a circuit conductor formed on one sid ...


2
Satoshi Kuwano, Shun ichi Yabuzaki, Satoshi Kitaichi, Seiichi Takesawa, Hitoshi Minabe, Tsuneshi Nakamura: Method for mounting chip type circuit elements on a printed circuit board and apparatus for performing the same. Matsushita Electric Industrial, November 28, 1978: US04127432 (44 worldwide citation)

Chip type circuit elements are mounted on adhesive layers provided on predetermined positions of a printed circuit board by pushing up each circuit element stack inserted in a magazine which is vertically held just below the corresponding adhesive layer and which is inserted through a corresponding ...


3
Tsuneshi Nakamura: Plating method and method for producing a multi-layered printed wiring board using the same. Matsushita Electric Industrial, Renner Otto Boisselle & Sklar, May 21, 1996: US05517758 (38 worldwide citation)

A dry sandblasting treatment for spraying abrasives onto a surface of an insulating resin layer, a chemical etching for chemically etching the surface, and a plating process for plating a conductive layer on the resulting insulating resin layer are successively performed. Since the surface of the in ...


4
Yoshihisa Takase, Tsuneshi Nakamura: Laminating double-side circuit board, manufacturing method thereof, and multilayer printed circuit board using same. Matsushita Electric Industrial, Steptoe & Johnson, December 19, 2006: US07151228 (16 worldwide citation)

The present invention comprises a plurality of laminating double-side circuit boards and a plurality sheets of prepreg for interlayer connection that are placed one on another. Via holes extend from the circuit on one side of each laminating double-side circuit board to the circuit on the other side ...


5
Yoshitsugu Uenishi, Tsuneshi Nakamura, Minoru Omori, Masashi Kadoya, Yoshihiro Higuchi, Tsuyoshi Yoshino: Solid electrolytic capacitor and method of manufacturing same. Matsushita Electric Industrial, McDermott Will & Emery, May 6, 2003: US06560090 (7 worldwide citation)

A solid electrolytic capacitor having excellent solder wettability and heat resisting adhesion and a method of manufacturing same are obtained by a simple plating configuration. The capacitor includes a capacitor element, positive electrode terminal and negative electrode terminal. The positive elec ...


6
Yoshitsugu Uenishi, Tsuneshi Nakamura, Noboru Hisada, Yoshiyuki Makino: Electroplating apparatus for coating a dielectric resonator. Matsushita Electric Industrial, Panitch Schwarze Jacobs & Nadel, August 10, 1993: US05234562 (3 worldwide citation)

A resonator of dielectric ceramic includes a cylindrical body (40) having a bore (50) extending axially through the body, wherein the outside surface of the body (40) and the inside surface of the bore (50) covered with a deposited electrode (80), thereby enhancing the Q characteristics. This princi ...


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Yoshihisa Takase, Tsuneshi Nakamura: It laminating double-side circuit board, and production method therefor and multilayer printed circuit board using. Parkhurst & Wendel, June 3, 2004: US20040104042-A1

The present invention comprises a plurality of laminating double-side circuit boards and a plurality sheets of prepreg for interlayer connection that are placed one on another. Via holes extend from the circuit on one side of each laminating double-side circuit board to the circuit on the other side ...


9
Yoshitsugu Uenishi, Tsuneshi Nakamura, Minoru Omori, Masashi Kadoya, Yoshihiro Higuchi, Tsuyoshi Yoshino: Solid electrolytic capacitor and method of manufacturing same. Mcdermott Will & Emery, June 20, 2002: US20020075634-A1

A solid electrolytic capacitor having excellent solder wettability and heat resisting adhesion and a method of manufacturing same are obtained by a simple plating configuration. The capacitor includes a capacitor element, positive electrode terminal and negative electrode terminal. The positive elec ...