1
Tsuji Kazuto, Yoneda Yoshiyuki, Kachi Takuya: Packaged semiconductor device having an optimized heat dissipation.. Fujitsu, Fujitsu Vlsi, May 6, 1992: EP0484180-A1 (13 worldwide citation)

A packaged semiconductor device comprises a semiconductor chip (1), a heat dissipating block (10) having a first major surface (B) of a first surface area and establishing a contact with said semiconductor chip and a second major surface (A) of a second surface area substantially larger than the fir ...


2
Yoneda Yoshiyuki, Tsuji Kazuto, Orimo Seiichi, Sakoda Hideharu, Nomoto Ryuji, Onodera Masanori, Kasai Junichi: Device having resin package and method of producing the same. Fujitsu, May 14, 1997: EP0773584-A2 (11 worldwide citation)

A device includes a chip (111), and a resin package (112, 151, 314) sealing the chip, the resin package having resin projections (117, 154, 318) located on a mount-side surface of the resin package. Metallic films (113, 155, 315) are respectively provided to the resin projections. Connecting parts ( ...


3
Honda Toshiyuki, Tsuji Kazuto, Onodera Masanori, Aoki Hiroshi, Kobayashi Izumi, Moriya Susumu, Kaiya Hiroshi: Semiconductor device and method for making the same. Fujitsu, September 4, 2002: EP1237202-A2 (8 worldwide citation)

A semiconductor device includes a resin housing (14, 14A, 14B, 14C)provided with a functional part, a wire pattern (12a) made of a conductive material and molded in the resin housing (14, 14A, 14B, 14C), a part of the wire pattern (12a) being exposed from the resin housing (14, 14A, 14B, 14C), an el ...


4
Yota Shiro, Kubota Yoshihiro, Tsuji Kazuto: Heat dissipation structure of electronic component and semiconductor device. Fujitsu, October 2, 2008: JP2008-235576 (8 worldwide citation)

PROBLEM TO BE SOLVED: To provide a versatile heat dissipation structure of electronic components of improved heat dissipation characteristics, as well as a semiconductor device.SOLUTION: Relating to the heat dissipation structure of an electronic component 35 that is mounted on a wiring substrate 31 ...


5
Yoda Toshiyuki, Tsuji Kazuto, Onodera Masanori, Moriya Susumu, Kobayashi Izumi, Aoki Hiroshi: Semiconductor device, imaging semiconductor device, and its manufacturing method. Fujitsu, July 4, 2003: JP2003-189195 (6 worldwide citation)

PROBLEM TO BE SOLVED: To provide a packaged semiconductor device with a thinner thickness and a smaller area than those of a conventional device and to provide its manufacturing method.SOLUTION: A wire pattern 12a is molded in a resin housing 14A with an imaging lens 3 fitted thereto. A part of the ...


6
Ooyama Nobuo, Maki Shinichiro, Fujisaki Fumitoshi, Kuramoto Syunichi, Saigo Yukio, Yatsuda Yasuo, Matae Youichi, Yano Atsushi, Tetaka Masafumi, Tsuji Kazuto: Semiconductor device and method of producing the same. Fujitsu, February 2, 2000: EP0977259-A2 (5 worldwide citation)

A semiconductor device (1) and a method of producing the same are provided. The semiconductor device includes: a semiconductor chip (2); a resin package (3) which seals the semiconductor chip; signal passages which guide the signal terminals of the semiconductor chip outward from the resin package; ...


7
Taniguchi Norio, Kasai Junichi, Tsuji Kazuto, Sono Michio, Yoshimoto Masanori: Semiconductor device unit having holder and method of mounting semiconductor devices using holder.. Fujitsu, December 2, 1992: EP0516096-A2 (5 worldwide citation)

A semiconductor device unit includes a holder (3, 13, 63, 73, 83) having a plurality of holding parts (6, 16, 66, 76, 86), and a plurality of semiconductor devices (2, 21-23) held by the holding parts of the holder. Each of the semiconductor devices have a generally parallelepiped shape with top and ...


8
Kasai Junichi, Tsuji Kazuto, Taniguchi Norio, Yoneda Yoshiyuki, Takenaka Masashi, Mashiko Takashi, Sakuma Masao, Saigo Yukio: Semiconductor package, a holder, a method of production and testing for the same.. Fujitsu, Kyushu Fujitsu Electronic, Fujitsu Automation, April 21, 1993: EP0538010-A2 (4 worldwide citation)

A semiconductor device comprises a plurality of leads (225) respectively made up of an inner lead (5, 93a, 225a) and an outer lead (8, 93b, 225b), a semiconductor chip (4, 223) electrically connected to the inner leads of the leads, and a package (7, 221) encapsulating at least the inner leads of th ...


9
Tsuji Kazuto Fujitsu Limited, Yoneda Yoshiyuki Fujitsu Limit, Kasai Junichi Fujitsu Limited: Semiconductor device and its manufacturing process.. Fujitsu, September 16, 1992: EP0503072-A1 (3 worldwide citation)

A semiconductor device is manufactured by using a lead frame having a die pad (24) and a plurality of leads (25) arranged outside the die pad, mounting a semiconductor chip (11) on the die pad, and covering the die pad and its peripheral portion with resin. The die pad (24) is formed separately from ...


10
Tsuji Kazuto, Hiraoka Tetsuya, Aoki Tsuyoshi, Kasai Junichi: Packaged semiconductor device and a manufacturing process therefor.. Fujitsu, January 2, 1992: EP0463559-A2 (3 worldwide citation)

A semiconductor device accommodated in a package includes a semiconductor chip (35), a package body (32) for accommodating the semiconductor chip, and a plurality of terminal members (33) embedded in the package body in electrical connection to the semiconductor chip and projecting from a bottom sur ...



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