1
Tetsuya Fujisawa, Mitsutaka Sato, Seiichi Orimo, Kazuhiko Mitobe, Masaaki Seki, Masaki Waki, Toshio Hamano, Katsuhiro Hayashida, Yoshitsugu Katoh, Hiroshi Inoue: Apparatus for a vertically accumulable semiconductor device with external leads secured by a positioning mechanism. Fujitsu, Armstrong Westerman & Hattori, August 13, 2002: US06433418 (116 worldwide citation)

A semiconductor device includes a resin package in which a semiconductor chip is sealed, the resin package having a first surface and a second surface opposite to the first surface; a plurality of leads having inner lead parts connected to the semiconductor chip and outer lead parts extending outsid ...


2
Makoto Iijima, Tetsushi Wakabayashi, Toshio Hamano, Masaharu Minamizawa, Masashi Takenaka, Taturou Yamashita, Masataka Mizukoshi, Masaru Nukiwa, Takao Akai: Semiconductor device and method of forming the same. Fujitsu, Armstrong Westerman Hattori McLeland & Naughton, February 12, 2002: US06347037 (54 worldwide citation)

A semiconductor device includes a board and a semiconductor chip which is connected to an upper surface of the board via face-down bonding. The semiconductor device further includes a frame-shape member which is connected to the upper surface of the board with first adhesive, and has an opening to a ...


3
Mitsuo Abe, Yoshihiro Kubota, Yoshitsugu Katoh, Michio Hayakawa, Ryuji Nomoto, Mitsutaka Sato, Seiichi Orimo, Hiroshi Inoue, Toshio Hamano: Semiconductor device and method of producing the same. Fujitsu, Armstrong Westerman Hattori Mcleland & Naughton, September 11, 2001: US06288444 (52 worldwide citation)

A semiconductor device and a method of producing the semiconductor device are provided. This semiconductor device includes a semiconductor chip, a printed wiring board, a heat spreader, a sealing resin, and solder balls. The printed wiring board is provided with the solder balls on an outer portion ...


4
Yoshitaka Aiba, Mitsutaka Sato, Toshio Hamano: Semiconductor device having a plurality of semiconductor elements interconnected by a redistribution layer. Fujitsu, Armstrong Westerman Hattori McLeland & Naughton, February 19, 2002: US06348728 (38 worldwide citation)

A plurality of semiconductor chips are incorporated in a one-piece package so as to substantially increase a mounting area of a semiconductor device so that the semiconductor device can be provided with the projection electrodes having a structure which enable the semiconductor device to be mounted ...


5
Toshio Hamano, Kaoru Tachibana, Hideji Aoki: Semiconductor device having soldered bond between base and cap thereof. Fujitsu, Armstrong Nikaido Marmelstein & Kubovcik, December 2, 1986: US04626960 (33 worldwide citation)

A semiconductor device including a ceramic base having a cavity carrying a semiconductor chip, and a ceramic cap covering and sealing the ceramic base. The cap has a metallization pattern covering not only a region where it contacts the base but also the four side surfaces of the cap, which is provi ...


6
Yoshitsugu Katoh, Mitsutaka Sato, Hiroshi Inoue, Seiichi Orimo, Akira Okada, Yoshihiro Kubota, Mitsuo Abe, Toshio Hamano, Yoshitaka Aiba, Tetsuya Fujisawa, Masaaki Seki, Noriaki Shiba: Surface mount type semiconductor device and method of producing the same having an interposing layer electrically connecting the semiconductor chip with protrusion electrodes. Fujitsu, Armstrong Westerman Hattori McLeland & Naughton, December 25, 2001: US06333564 (32 worldwide citation)

A semiconductor device and a method of producing the same, the device including a semiconductor chip; balls which function as external connecting terminals; a substrate which electrically connects the semiconductor chip and the balls; a mold resin which seals at least a part of the semiconductor chi ...


7
Kazuto Tsuji, Yoshiyuki Yoneda, Hideharu Sakoda, Michio Sono, Ichiro Yamaguchi, Toshio Hamano, Yoshihiro Kubota, Michio Hayakawa, Yoshihiko Ikemoto, Yukio Saigo, Naomi Miyaji: Process for manufacturing a packaged semiconductor having a divided leadframe stage. Fujitsu, Kyushu Fujitsu Electronics, Nikaido Marmelstein Murray & Oram, September 8, 1998: US05804468 (30 worldwide citation)

A process for manufacturing semiconductor device having a package in which a semiconductor device is sealed includes a base, and a metallic film is formed on a surface of the base. The semiconductor chip is formed on the metallic film. A pad formed on the semiconductor chip is connected to the metal ...


8
Kazuto Tsuji, Yoshiyuki Yoneda, Hideharu Sakoda, Michio Sono, Ichiro Yamaguchi, Toshio Hamano, Yoshihiro Kubota, Michio Hayakawa, Yoshihiko Ikemoto, Yukio Saigo, Naomi Miyaji: Semiconductor device and lead frame therefore. Fujitsu, Kyushu Fujitsu Electronics, Nikaido Marmelstein Murray & Oram, March 5, 1996: US05497032 (30 worldwide citation)

A semiconductor device having a package in which a semiconductor device is sealed includes a base, and a metallic film is formed on a surface of the base. The semiconductor chip is formed on the metallic film. A pad formed on the semiconductor chip is connected to the metallic film by a wire. A seal ...


9
Takeshi Takenaka, Toshio Hamano, Takekiyo Saito: Semiconductor device having improved adhesive structure and method of producing same. Fujitsu, Nikaido Marmelstein Murray & Oram, January 11, 1994: US05278429 (27 worldwide citation)

A semiconductor device includes a package, a semiconductor chip provided on the package, an intermediate layer formed on the package, an adhesive layer formed on the intermediate layer, and a lid formed on the adhesive layer and sealing the semiconductor chip. The intermediate layer contains a major ...


10
Mitsutaka Sato, Tetsuya Fujisawa, Shigeyuki Maruyama, Junichi Kasai, Toshimi Kawahara, Toshio Hamano, Yoshihiro Kubota, Mitsunada Osawa, Yoshiyuki Yoneda, Kazuto Tsuji, Hirohisa Matsuki: Semiconductor module including a plurality of semiconductor devices detachably. Fujitsu, Armstrong Westerman & Hattori, October 29, 2002: US06472744 (18 worldwide citation)

A semiconductor module includes a plurality of semiconductor devices each including a circuit substrate carrying thereon a single memory semiconductor chip and a socket for holding the semiconductor devices detachably.