1
Jun Zhao, Tom Cho, Charles Dornfest, Stefan Wolff, Kevin Fairbairn, Xin S Guo, Alex Schreiber, John M White: CVD Processing chamber. Applied Materials, Janis Biksa, September 24, 1996: US05558717 (339 worldwide citation)

A process chamber is disclosed which provides a 360.degree. circular gas/vacuum distribution over a substrate being processed. The substrate being processed is supported on a heated and optionally cooled pedestal assembly. The substrate faces a one-piece gas distribution faceplate being connected to ...


2
Jun Zhao, Tom Cho, Charles Dornfest, Stefan Wolff, Kevin Fairbairn, Xin Sheng Guo, Alex Schreiber, John M White: CVD processing chamber. Applied Materials, Peters Verney Jones & Biksa, December 29, 1998: US05853607 (56 worldwide citation)

A process chamber is disclosed which provides a 360.degree. circular gas/vacuum distribution over a substrate being processed. The substrate being processed is supported on a heated and optionally cooled pedestal assembly. The substrate faces a one-piece gas distribution faceplate being connected to ...


3
Jun Zhao, Tom Cho, Xin Sheng Guo, Atsushi Tabata, Jianmin Qiao, Alex Schreiber: Method of reducing residue accumulation in CVD chamber using ceramic lining. Applied Materials, Townsend & Townsend & Crew, March 23, 1999: US05885356 (55 worldwide citation)

The present invention provides a method and apparatus for limiting residue build-up by lining with a ceramic material the exhaust plenun and exhaust manifold of a processing chamber. In another aspect of the invention, the inventors have used an air gap between the ceramic liner and the processing c ...


4
Tom Cho, Christopher Ngai: Exhaust baffle for uniform gas flow pattern. Applied Materials, Michael A Glenn, August 15, 1995: US05441568 (25 worldwide citation)

An arc shaped exhaust baffle having two ends that define a gap therebetween that is not directly accessible by the exhaust plenum, that provides improved process gas flow distribution in a semiconductor process chamber, has a plurality of apertures formed therethrough and distributed about a baffle ...


5
Thomas Nowak, Juan Carlos Rocha Alvarez, Andrzej Kaszuba, Scott A Hendrickson, Dustin W Ho, Sanjeev Baluja, Tom Cho, Josephine Chang, Hichem M Saad: High efficiency UV curing system. Applied Materials, Patterson & Sheridan, February 16, 2010: US07663121 (14 worldwide citation)

An ultraviolet (UV) cure chamber enables curing a dielectric material disposed on a substrate and in situ cleaning thereof. A tandem process chamber provides two separate and adjacent process regions defined by a body covered with a lid having windows aligned respectively above each process region. ...


6
Michael P Karazim, Tetsuya Ishikawa, Rudolf Gujer, Thomas Kring, Pavel Staryuk, Abhi Desai, Tom Cho, Michael Douglas: Antenna coil assemblies for substrate processing chambers. Applied Materials, Townsend & Townsend & Crew, February 27, 2001: US06192829 (7 worldwide citation)

The present invention provides exemplary antenna coil assemblies and substrate processing chambers using such assemblies. In one embodiment, an antenna coil assembly (


7
Jennifer Y Sun, Biraja P Kanungo, Tom Cho: Rare-earth oxide based erosion resistant coatings for semiconductor application. Applied Materials, Lowenstein Sandler, January 9, 2018: US09865434

An article includes a body that is coated with a ceramic coating. The ceramic coating may include Y2O3 in a range between about 45 mol % to about 99 mol %, ZrO2 in a range between about 0 mol % to about 55 mol %, and Al2O3 in range between about 0 mol % to about 10 mol %. The ceramic coating may alt ...


8
Jennifer Y Sun, Biraja P Kanungo, Vahid Firouzdor, Tom Cho: Plasma erosion resistant rare-earth oxide based thin film coatings. Applied Materials, Lowenstein Sandler, December 26, 2017: US09850568

An article comprises a body and at least one protective layer on at least one surface of the body. The at least one protective layer is a thin film having a thickness of less than approximately 20 microns that comprises a ceramic selected from a group consisting of Y3Al5O12, Y4Al2O9, Er2O3, Gd2O3, E ...


9
Jennifer Y Sun, Biraja Kanungo, Tom Cho, Ying Zhang: Aerosol deposition coating for semiconductor chamber components. Applied Materials, Lowenstein Sandler, July 18, 2017: US09708713

A method for coating a component for use in a semiconductor chamber for plasma etching includes providing the component and loading the component in a deposition chamber. A pressure in the deposition chamber is reduced to below atmospheric pressure. A coating is deposited on the component by sprayin ...


10
Thomas Nowak, Juan Carlos Rocha Alvarez, Andrzej Kaszuba, Scott A Hendrickson, Dustin W Ho, Sanjeev Baluja, Tom Cho, Josephine Chang, Hichem M Saad: High efficiency UV curing system. Applied Materials, Patterson & Sheridan, November 9, 2006: US20060249175-A1

An ultraviolet (UV) cure chamber enables curing a dielectric material disposed on a substrate and in situ cleaning thereof. A tandem process chamber provides two separate and adjacent process regions defined by a body covered with a lid having windows aligned respectively above each process region. ...



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