1
Tiong C Go: High-density electronic modules--process and product. Irvine Sensors Corporation, Thomas J Plante, November 10, 1987: US04706166 (252 worldwide citation)

A high-density electronic module is disclosed, which is suitable for use as a DRAM, SRAM, ROM, logic unit, arithmetic unit, etc. It is formed by stacking integrated-circuit chips, each of which carries integrated circuitry. The chips are glued together, with their leads along one edge, so that all t ...


2
Tiong C Go deceased, Joseph A Minahan, Stuart N Shanken: Method of fabricating electronic circuitry unit containing stacked IC layers having lead rerouting. Irvine Sensors Corporation, Thomas J Plante, April 14, 1992: US05104820 (250 worldwide citation)

A process is disclosed which applies advanced concepts of Z-technology to the field of dense electronic packages. Starting with standard chip-containing silicon wafers, modification procedures are followed which create IC chips having second level metal conductors on top of passivation (which covers ...


3
Tiong C Go: High-density electronic modules - process and product. Irvine Sensors Corporation, Thomas J Plante, January 8, 1991: US04983533 (218 worldwide citation)

A high-density electronic module is disclosed, which is suitable for use as a DRAM, SRAM, ROM, logic unit, arithmetic unit, etc. It is formed by stacking integrated-circuit chips, each of which carries integrated circuitry. The chips are glued together, with their leads along one edge, so that all t ...


4
Tiong C Go: High density electronic package comprising stacked sub-modules. Irvine Sensors Corporation, Thomas J Plante, August 16, 1988: US04764846 (205 worldwide citation)

A high density electronic package is disclosed in which a stack of layer-like sub-modules have their edges secured to a stack-carrying substrate, the latter being in a plane perpendicular to the planes in which the sub-modules extend. Each sub-module has a cavity, inside which one or more IC chips a ...


5
Tiong C Go: Bonding of aligned conductive bumps on adjacent surfaces. Irvine Sensors Corporation, Thomas J Plante, March 27, 1990: US04912545 (34 worldwide citation)

A bump bonding process and product are disclosed in which both pressure and heating are used in situations where the temperature should not exceed a predetermined amount, e.g., bonding of a photoconductor array to a module containing electronic processing devices. The bonding process involves eutect ...