1
Timothy L Jackson, Tim E Murphy: Methods of fabrication of semiconductor dice having back side redistribution layer accessed using through-silicon vias and assemblies thereof. MicronTechnology, TraskBritt PC, November 8, 2005: US06962867 (435 worldwide citation)

An apparatus and method of rerouting redistribution lines from an active surface of a semiconductor substrate to a back surface thereof and assembling and packaging individual and multiple semiconductor dice with such rerouted redistribution lines formed thereon. The semiconductor substrate includes ...


2
Timothy L Jackson, Tim E Murphy: Semiconductor dice having back side redistribution layer accessed using through-silicon vias, and assemblies. Micron Technology, TraskBritt, October 5, 2004: US06800930 (425 worldwide citation)

An apparatus and method of rerouting redistribution lines from an active surface of a semiconductor substrate to a back surface thereof and assembling and packaging individual and multiple semiconductor dice with such rerouted redistribution lines formed thereon. The semiconductor substrate includes ...


3
Timothy L Jackson, Tim E Murphy: Semiconductor dice having back side redistribution layer accessed using through-silicon vias, methods. Micron Technology, TraskBritt PC, April 8, 2008: US07355273 (300 worldwide citation)

An apparatus and method of rerouting redistribution lines from an active surface of a semiconductor substrate to a back surface thereof and assembling and packaging individual and multiple semiconductor dice with such rerouted redistribution lines formed thereon. The semiconductor substrate includes ...


4
Ford B Grigg, Timothy L Jackson: Thin flip—chip method. Micron Technology, TraskBritt, January 14, 2003: US06506681 (91 worldwide citation)

Methods for thinning a bumped semiconductor wafer, as well as methods for producing flip-chips of very thin profiles, are disclosed. According to the methods of the present invention, a mold compound is interspersed between conductive bumps on the active face of a wafer to provide support and protec ...


5
Chad A Cobbley, Timothy L Jackson: Stacked die module and techniques for forming a stacked die module. Micron Technology, Fletcher Yoder, May 15, 2007: US07217596 (53 worldwide citation)

A technique for forming die stacks. Specifically, a stacking tip is provided to facilitate the stacking of die in a desired configuration. A first die is picked up by the stacking tip. The first die is coated with an adhesive on the underside of the die. The first die is brought in contact with a se ...


6
Timothy L Jackson: Deflectable interconnect. Micron Technology, Knobbe Martens Olson and Bear, September 4, 2001: US06285081 (33 worldwide citation)

A package for connecting an integrated circuit to a printed circuit board. The package includes an interconnect having a deflectable cantilever and a solder bump. When the integrated circuit is affixed to the interconnect, the solder bump deflects the cantilever. When the solder bump is heated such ...


7
Timothy L Jackson: Method of making ball grid array package with deflectable interconnect. Micron Technology, Knobbe Martens Olson & Bear, December 16, 2003: US06664131 (28 worldwide citation)

A package for connecting an integrated circuit to a printed circuit board. The package includes an interconnect having a deflectable cantilever and a solder bump. When the integrated circuit is affixed to the interconnect, the solder bump deflects the cantilever. When the solder bump is heated such ...


8
Arthur Powell, Melvin T Willis Sr, Maurice L Monroe, Timothy L Jackson, Benjamin Scandrett: Combination toolbox-cooler device. Barry E Kaplan Esq, Hughes & Kaplan, June 12, 2001: US06244064 (15 worldwide citation)

A tool box section and a cooler section are integrally formed as one device. The toolbox portion is a typical tool box having a plurality of stacking tool trays with a latching means for securing said trays together. The stacked and latched tool trays thereby form the upper portion of the toolbox se ...


9
Ford B Grigg, Timothy L Jackson: Thin flip-chip method. Micron Technology, TraskBritt, June 14, 2005: US06905946 (13 worldwide citation)

Methods for thinning a bumped semiconductor wafer, as well as methods for producing flip-chips of very thin profiles, are disclosed. According to the methods of the present invention, a mold compound is interspersed between conductive bumps on the active face of a wafer to provide support and protec ...


10
Chad A Cobbley, Timothy L Jackson: Stacked die module and techniques for forming a stacked die module. Micron Technology, Fletcher Yoder, January 27, 2004: US06682955 (12 worldwide citation)

A technique for forming die stacks. Specifically, a stacking tip is provided to facilitate the stacking of die in a desired configuration. A first die is picked up by the stacking tip. The first die is coated with an adhesive on the underside of the die. The first die is brought in contact with a se ...