1
Alan G Wood, Tim J Corbett: Packaging for semiconductor logic devices. Micron Technology, Stanley N Protigal, August 11, 1992: US05138434 (217 worldwide citation)

A logic module design is disclosed which incorporates an unencapsulated wafer section or sections. The disclosed module is an improvement over previous designs in that it is less expensive and easier to manufacture due to the reduced number of components and the complexity of the components, is fast ...


2
Tim J Corbett, Alan G Wood: Discrete die burn-in for nonpackaged die. Micron Technology, Stanley N Protigal, Angus C Fox III, Jon P Busack, February 6, 1990: US04899107 (196 worldwide citation)

A reusable burn-in/test fixture for discrete TAB die consists of two halves. The first half of the test fixture is a die cavity plate for receiving semiconductor dice, and contains cavities in which die are inserted. The second half establishes electrical contact with the dice and with a burn-in ove ...


3
Alan G Wood, Tim J Corbett, Gary L Chadwick, Chender Huang, Larry D Kinsman: Discrete die burn-in for non-packaged die. Micron Technology, Stanley N Protigal, April 12, 1994: US05302891 (143 worldwide citation)

A reusable burn-in/test fixture for discrete die consists of two halves. The first half of the test fixture contains cavity in which die is inserted. When the two halves are assembled, the fixture establishes electrical contact with the die and with a burn-in oven. The test fixture need not be opene ...


4
Tim J Corbett, Alan G Wood: Directly bonded simm module. Micron Technology, Stanley N Protigal, Angus C Fox III, February 12, 1991: US04992850 (129 worldwide citation)

A leadframe interconnect package is tape automated bond (TAB) bonded to circuitry on the chip and which provides a circuit connection for subsequent connection to a printed circuit board. The encapsulated chips will replace both the leadframe and printed circuit board (electrical only) as we now kno ...


5
Alan G Wood, Tim J Corbett, Gary L Chadwick, Chender Huang, Larry D Kinsman: Discrete die burn-in for nonpackaged die. Stephen A Gratton, July 18, 2000: US06091251 (91 worldwide citation)

A reusable burn-in/test fixture for discrete TAB die consists of two halves. The first half of the test fixture contains cavity in which die is inserted. When the two halves are assembled, the fixture establishes electrical contact with the die and with a burn-in oven. The test fixture need not be o ...


6
Tim J Corbett, Alan G Wood: Directly bonded board multiple integrated circuit module. Micron Technology, Stanley N Protigal, Angus C Fox III, February 12, 1991: US04992849 (85 worldwide citation)

A leadframe interconnect package is tape automated bond (TAB) bonded to circuitry on the chip and which provides a circuit connection for subsequent connection to a printed circuit board.


7
Alan G Wood, Tim J Corbett: Universal wafer carrier for wafer level die burn-in. Micron Technology, Stanley N Protigal, Stephen A Gratton, July 23, 1996: US05539324 (52 worldwide citation)

A reusable burn-in/test fixture for testing unsingulated dice on a semiconductor wafer consists of two halves. The first half of the test fixture is a wafer cavity plate for receiving the wafer, and the second half establishes electrical communication between the wafer and electrical test equipment. ...


8
Tim J Corbett: Laser marking techniques. Micron Technology, Trask Britt & Rossa, November 16, 1999: US05985377 (47 worldwide citation)

A laser marking apparatus and method for marking the surface of a semiconductor chip are described herein. A laser beam is directed to a location on the surface of the chip where a laser reactive material, such as a pigment containing epoxy, is present. The heat associated with the laser beam causes ...


9
Tim J Corbett, Walter L Moden: Method and structure for attaching a semiconductor die to a lead frame. Micron Technology, Kevin D Martin, August 20, 1996: US05548160 (42 worldwide citation)

A structure for attaching a semiconductor wafer section to a lead frame comprises a carrier having an outside surface and an adhesive coating the carrier. Prior to use, the structure can be placed onto spools for easy shipment and storage.


10
Alan G Wood, Tim J Corbett, Warren M Farnworth: Universal wafer carrier for wafer level die burn-in. Micron Technology, Trask Britt & Rossa, July 11, 2000: US06087845 (39 worldwide citation)

A reusable burn-in/test fixture for testing unsingulated dice on a semiconductor wafer consists of two halves. The first half of the test fixture is a wafer cavity plate for receiving the wafer, and the second half establishes electrical communication between the wafer and electrical test equipment. ...