1
Thomas L Angelucci Sr, Joseph L Angelucci: Printed circuit lead carrier tape. April 12, 1983: US04380042 (45 worldwide citation)

A printed circuit lead frame is provided as a carrier for integrated circuits. The conventional frame comprises a foil pattern that is provided with a plurality of fragile delicate lead fingers which are often bent and displaced laterally or vertically before they can be connected to the terminal pa ...


2
Thomas L Angelucci, Joseph L Angelucci: Multilayer flexible printed circuit tape. December 20, 1977: US04064552 (45 worldwide citation)

A multilayer flexible printed circuit tape that functions as a flexible printed circuit carrier for receiving one or more active circuit components and/or other inactive components to provide an electronic module. The multilayer flexible printed circuit tape comprises a plurality of etched foil patt ...


3
Thomas L Angelucci Sr, Joseph L Angelucci: Flexible lead bonding apparatus. September 27, 1977: US04050618 (16 worldwide citation)

An apparatus for bonding the flexible leads of a sprocketed lead frame tape to the terminals of an integrated circuit device is provided with a movable index station, movable bonding anvil means and a vertically moving bonding tool. The flexible leads on the lead frame tape are automatically positio ...


4
Thomas L Angelucci Sr: Multi-layer flexible printed circuit and method of making same. October 11, 1994: US05355105 (14 worldwide citation)

A novel multi-layer flexible printed circuit for tape automated bonding (TAB) is assembled from three components during the process of TAB bonding the circuit to a semiconductor device for burn in and testing prior to assembly into a system comprising a plurality of tested TAB circuit bonded devices ...


5
Thomas L Angelucci, Joseph L Angelucci: High force flexible lead bonding apparatus. March 22, 1977: US04013209 (4 worldwide citation)

An apparatus for bonding the flexible leads of a printed circuit pattern to the terminal pads of an integrated circuit device includes means for positioning the flexible leads juxtapose the terminal pads on the semiconductor device, means for rapidly positioning a thermode opposite said juxtapose fl ...