1
Thomas H Dozier II, Benjamin N Eldridge, Gary W Grube, Igor Y Khandros, Gaetan L Mathieu: Sockets for electronic components and methods of connecting to electronic components. Form Factor, David J Larwood, Gerald E Linden, June 30, 1998: US05772451 (372 worldwide citation)

Surface-mount, solder-down sockets permit electronic components such as semiconductor packages to be releasably mounted to a circuit board. Resilient contact structures extend from a top surface of a support substrate, and solder-ball (or other suitable) contact structures are disposed on a bottom s ...


2
Igor Y Khandros, Benjamin N Eldridge, Gaetan L Mathieu, Thomas H Dozier, William D Smith: Contact carriers (tiles) for populating larger substrates with spring contacts. FormFactor, Gerald E Linden, Fenwick & West, September 15, 1998: US05806181 (235 worldwide citation)

The invention relates to making temporary, pressure connections between electronic components and, more particularly, to techniques for performing test and burn-in procedures on semiconductor devices prior to their packaging, preferably prior to the individual semiconductor devices being singulated ...


3
Thomas H Dozier II, Igor Y Khandros: Solder preforms. Form Factor, David J Larwood, Gerald E Linden, October 13, 1998: US05820014 (122 worldwide citation)

Method and apparatus for forming solder balls on electronic components and for forming solder joints between electronic components is described. A preform is fabricated having relatively large cross-section solder masses connected to one another by relatively small cross-section solder bridges. Upon ...


4
Thomas H Dozier II, Benjamin N Eldridge, Gary W Grube, Igor Y Khandros, Gaetan L Mathieu: Interposer, socket and assembly for socketing an electronic component and method of making and using same. FormFactor, N Kenneth Burraston, Stuart L Merkadeau, December 30, 2003: US06669489 (117 worldwide citation)

Surface-mount, solder-down sockets permit electronic components such as semiconductor packages to be releasably mounted to a circuit board or other electronic component. In an embodiment, resilient contact structures extend through a support substrate, and solder-ball (or other suitable) contact str ...


5
Igor Y Khandros, Benjamin N Eldridge, Gaetan L Mathieu, Thomas H Dozier, William D Smith: Contact carriers (tiles) for populating larger substrates with spring contacts. FormFactor, N Kenneth Burraston, Stuart L Merkadeau, May 25, 2004: US06741085 (107 worldwide citation)

A plurality of contact elements, such as contact bumps or free-standing spring contacts including both monolithic and composite interconnection elements, are mounted to relatively small tile substrates which, in turn, are mounted and connected to a relatively large electronic component substrate, th ...


6
Thomas H Dozier II, Benjamin N Eldridge, Gary W Grube, Igor Y Khandros, Gaetan L Mathieu, David V Pedersen, Michael A Stadt: Sockets for "springed" semiconductor devices. FormFactor, David Larwood, March 7, 2000: US06033935 (102 worldwide citation)

Temporary connections to spring contact elements extending from an electronic component such as a semiconductor device are made by urging the electronic component, consequently the ends of the spring contact elements, vertically against terminals of an interconnection substrate, or by horizontally u ...


7
Jimmy Kuo Wei Chen, Benjamin N Eldridge, Thomas H Dozier, Junjye J Yeh, Gayle J Herman: Method of making a product with improved material properties by moderate heat-treatment of a metal incorporating a dilute additive. FormFactor, David Larwood, November 21, 2000: US06150186 (101 worldwide citation)

Deposition of metal in a preferred shape, including coatings on parts, or stand-alone materials, and subsequent heat treatment to provide improved mechanical properties. In particular, the method gives products with relatively high yield strength. The products often have relatively high elastic modu ...


8
Thomas H Dozier II, Benjamin N Eldridge, Gary W Grube, Igor Y Khandros, Gaetan L Mathieu: Methods of removably mounting electronic components to a circuit board, and sockets formed by the methods. FormFactor, N Kenneth Burraston, July 5, 2005: US06913468 (98 worldwide citation)

Surface-mount, solder-down sockets are described which permit electronic components such as semiconductor packages to be releasably mounted to a circuit board. Generally, the socket includes resilient contact structures extending from a top surface of a support substrate, and solder-ball (or other s ...


9
Igor Y Khandros, Thomas H Dozier, Gary W Grube, Gaetan L Mathieu: Method and apparatus for shaping spring elements. FormFactor, Stuart L Merkadeau, N Kenneth Burraston, March 9, 2004: US06701612 (90 worldwide citation)

Interconnection elements for electronic components, exhibiting desirable mechanical characteristic (such as resiliency, for making pressure contacts) are formed by using a shaping tool (


10
Thomas H Dozier II, Benjamin N Eldridge, Gary W Grube, Igor Y Khandros, Gaetan L Mathieu, David V Pedersen, Michael A Stadt: Sockets for “springed” semiconductor devices. FormFactor, N Kenneth Burraston, Stuart L Merkadeau, March 18, 2003: US06534856 (89 worldwide citation)

Temporary connections to spring contact elements extending from an electronic component such as a semiconductor device are made by urging the electronic component, consequently the ends of the spring contact elements, vertically against terminals of an interconnection substrate, or by horizontally u ...