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Belgacem Haba Belgacem (Bel) Haba
Masud Beroz, Thomas H DiStefano, Anthony B Faraci, Joseph Fjelstad, Belgacem Haba: Components with releasable leads and methods of making releasable leads. Tessera, Lerner David Littenberg Krumholz & Mentlik, July 17, 2001: US06261863 (8 worldwide citation)

A connection component for a microelectronic device such as a semiconductor chip incorporates a support layer and conductive structures extending across a surface of the support layer. The conductive structures have anchors connecting them to the support layer, and releasable or unanchored portions. ...


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Belgacem Haba Belgacem (Bel) Haba
David Light, Belgacem Haba, Thomas H Distefano, Konstantine Karavakis: Manufacture of semiconductor connection components with frangible lead sections. Tessera, Lerner David Littenberg Krumholz & Mentlik, August 14, 2001: US06274822 (6 worldwide citation)

A semiconductor chip connection component having numerous leads extending side-by-side across a gap in a support structure, each lead having a frangible section to permit detachment of one end of the lead from the support structure in a bonding process. The frangible sections are formed by treating ...


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Belgacem Haba Belgacem (Bel) Haba
Thomas H DiStefano, Joseph Fjelstad, Belgacem Haba, Owais Jamil, Konstantine Karavakis, David Light, John W Smith: Connection component with peelable leads. Tessera, Lerner David Littenberg Krumholz & Mentlik, June 27, 2006: US07067742 (5 worldwide citation)

A connection component for use in making microelectronic element assemblies which has peelable leads that are formed on a dielectric support structure. One end of each lead is permanently connected to the support structure and the opposite end of the lead is releasably connected to the support struc ...


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Belgacem Haba Belgacem (Bel) Haba
Thomas H DiStefano, Joseph Fjelstad, Belgacem Haba, Owais Jamil, Konstantine Karavakis, David Light, John W Smith: Method of making connection component. Tessera, Lerner David Littenberg Krumholz & Mentlik, March 19, 2002: US06357112 (4 worldwide citation)

A connection component for use in making microelectronic element assemblies, has peelable leads that are formed on a dielectric support structure. One end of each lead is permanently connected to the support structure and the opposite end of the lead is releasably connected to the support structure. ...


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Belgacem Haba Belgacem (Bel) Haba
Thomas H Distefano, Joseph Fjelstad, Belgacem Haba: Coining tool and process of manufacturing same for making connection components. Tessera, Lerner David Littenberg Krumholz & Mentlik, March 6, 2001: US06196042 (3 worldwide citation)

A tool having a coining projection is operative for forming a frangible portion in a lead of a microelectronic connection component by application of a compressive force. The coining projection is supported on a pedestal formed from a tool body. In an alternative embodiment, the pedestal is formed o ...


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Belgacem Haba Belgacem (Bel) Haba
Masud Beroz, Thomas H DiStefano, Anthony B Faraci, Joseph Fjelstad, Belgacem Haba: Components with releasable leads and methods of making releasable leads. Tessera, Lerner David Littenberg Krumholz & Mentlik, April 1, 2003: US06541845 (3 worldwide citation)

A connection component for a microelectronic device such as a semiconductor chip incorporates a support layer and conductive structures extending across a surface of the support layer. The conductive structures have anchors connecting them to the support layer, and releasable or unanchored portions.


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Belgacem Haba Belgacem (Bel) Haba
Thomas H DiStefano, Joseph Fjelstad, Belgacem Haba, Owais Jamil, Konstantine Karavakis, David Light, John W Smith: Connection component with peelable leads. Lerner David Littenberg Krumholz & Mentlik, June 27, 2002: US20020081781-A1

A connection component for use in making microelectronic element assemblies which has peelable leads that are formed on a dielectric support structure. One end of each lead is permanently connected to the support structure and the opposite end of the lead is releasably connected to the support struc ...


8
Belgacem Haba Belgacem (Bel) Haba
Masud Beroz, Thomas H DiStefano, Anthony B Faraci, Joseph Fjelstad, Belgacem Haba: Components with releasable leads and methods of making releasable leads. Lerner David Littenberg Krumholz & Mentlik, July 5, 2001: US20010006253-A1

A connection component for a microelectronic device such as a semiconductor chip incorporates a support layer and conductive structures extending across a surface of the support layer. The conductive structures have anchors connecting them to the support layer, and releasable or unanchored portions.


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Igor Y Khandros, Thomas H DiStefano: Semiconductor chip assemblies with fan-in leads. IST Associates, Lerner David Littenberg Krumholz & Mentlik, September 15, 1992: US05148265 (516 worldwide citation)

A semiconductor chip having contacts on the periphery of its top surface is provided with an interposer overlying the central portion of the top surface. Peripheral contact leads extend inwardly from the peripheral contacts to central terminals on the interposer. The terminals on the interposer may ...


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Igor Y Khandros, Thomas H DiStefano: Semiconductor chip assemblies having interposer and flexible lead. IST Associates, Lerner David Littenberg Krumholz & Mentlik, September 15, 1992: US05148266 (481 worldwide citation)

A semiconductor chip assembly is mounted to contact pads in a compact area array. An interposer is disposed between the chip and the substrate. The contacts on the chip are connected to terminals on the interposer by flexible leads extending through apertures in the interposer. The terminals on the ...



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