1
Kurt Raab, Thomas Pickett, Thomas H Di Stefano: Multiple part compliant interface for packaging of a semiconductor chip and method therefor. Tessera, Lerner David Littenberg Krumholz & Mentlik, June 22, 1999: US05915170 (52 worldwide citation)

A method of making a multiple part compliant interface for a microelectronic package including the steps of providing a first microelectronic element having electrically conductive parts, providing an array of curable elastomer support pads in contact with the first microelectronic element, curing t ...


2
Thomas H Di Stefano, Arnold Halperin: Nonlinearity detection using fault-generated second harmonic. International Business Machines Corporation, Carl C Kling, January 29, 1985: US04496900 (50 worldwide citation)

The tester and method for nondestructively detecting nonlinearity faults in conductors includes the application of a composite AC and DC drive signal to the device under test in such manner that nonlinearities in the device under test produce fault signals including second harmonics, due to local ch ...


3
Thomas H Di Stefano: Compliant probe apparatus. Decision Track, Kenneth R Allen, Townsend and Townsend and Crew, July 30, 2002: US06426638 (50 worldwide citation)

A mechanically compliant probe for electrically connecting to contact pads on microelectronic devices. The probe is used for burn-in of integrated circuits at the wafer level. Additional applications include probe cards for testing integrated circuits and sockets for flip-chips. One embodiment of th ...


4
Thomas H Di Stefano: Single-sided compliant probe apparatus. Decision Track, Kenneth R Allen, Townsend and Townsend and Crew, August 3, 2004: US06771084 (32 worldwide citation)

A small single-sided compliant probe is provided that includes a conductive tip, which is positioned on a supporting surface in a manner that allows a tip on the probe to move flexibly with respect to the supporting surface in close proximity to adjacent probes in an array. The probe tip moves verti ...


5
Thomas H Di Stefano: Axially compliant microelectronic contactor. Centipede Systems, Michael B Einschlag, June 7, 2011: US07955088 (30 worldwide citation)

One embodiment is an axially compliant electrical contactor for interconnecting microelectronic devices, the contactor including: an insulative sleeve having a hole therethrough; and a metal tube having a cylindrical wall being slidably disposed in the hole; wherein: (a) two or more elongated slots ...


6
Thomas H Di Stefano, Anthony B Faraci, Konstantine Karavakis, Peter T Di Stefano: Self-cleaning socket for microelectronic devices. Centipede Systems, Townsend and Townsend and Crew, Kenneth R Allen, February 17, 2009: US07491069 (23 worldwide citation)

A self-cleaning socket for contacting terminals on a microelectronic device wherein the first end of compliant tubular contactors rotate and wipe against terminals urged downwardly against the first end of the contactors. A rotational wipe of a contactor against a mating terminal breaks through any ...


7
Thomas H Di Stefano, Halil B Bakoglu: Optical sensor for servo position control. International Business Machines Corporation, Jackson E Stanland, February 11, 1986: US04570191 (22 worldwide citation)

This optical sensor has cylindrical symmetry and is comprised of a semiconductor light source/light detector combination and an optical element comprising a single lens, where the sensor is particularly suitable for uses in accurate position detection in data recording systems. In a preferred embodi ...


8
Thomas H Di Stefano: Miniature electrical ball and tube socket with self-capturing multiple-contact-point coupling. Centipede Systems, Townsend and Townsend and Crew, Kenneth R Allen, October 28, 2008: US07442045 (19 worldwide citation)

A socket connector for connecting a bulbous terminal or ball wherein the female element grips the terminal with resilient prongs with end tips at low insertion force but positive contact is maintained and wherein attempted withdrawal is normally inhibited by increasing force applied to the post by t ...


9
Thomas H Di Stefano: Thin package for stacking integrated circuits. Palo Alto Research Center, Kent Chen, February 14, 2006: US06998703 (16 worldwide citation)

An improved structure and method for making interconnects for a thin package of stacked integrated circuits is described. The structure uses a spring contact to replace traditional solder balls in a stacked structure. The spring contacts are incorporated in an integrated circuit layer and may be mad ...


10
Konstantine N Karavakis, Thomas H Di Stefano, Peter T Di Stefano: Compliant thermal contactor. Centipede Systems, Michael B Einschlag, November 16, 2010: US07834447 (13 worldwide citation)

One embodiment of the present invention is a compliant thermal contactor that includes a resilient metal film having a plurality of first thermally conductive, compliant posts disposed in an array on a top side thereof and a plurality of second thermally conductive, compliant posts disposed in an ar ...