1
Frank R Williams, Thomas G Ruttan: Coplanar transmission structure having spurious mode suppression. Tektronix, William K Bucher, July 6, 1993: US05225796 (60 worldwide citation)

An improved coplanar transmission structure has a coplanar transmission line formed on one surface of a substrate and a lossy resistive material formed on the opposite surface of the substrate for suppressing spurious electromagnetic modes propagating through the substrate. The lossy resistive mater ...


2
Thomas G Ruttan, Ed Stanford, Peter A Davison, Tony Harrison: System and method for connecting a power converter to a land grid array socket. Intel Corporation, Blakely Sokoloff Taylor & Zafman, March 23, 2004: US06709277 (17 worldwide citation)

A land grid array (LGA) socket is connected to a power converter using compression contact technology eliminating the need for an edge-card connector typically required in such applications. The LGA socket is mounted to the power converter in a single direction of assembly (i.e., the vertical axis).


3
Damion T Searls, Thomas G Ruttan, Jiteender P Manik: Comb-shaped land grid array (LGA) socket contact for improved power delivery. Intel Corporation, Blakely Sokoloff Taylor & Zafman, June 22, 2004: US06752635 (11 worldwide citation)

A conventional land grid array (LGA) socket assembly uses the same socket contact in the power delivery area and the signal delivery area. Using low current socket contacts in the power delivery area may create self-heating and limit power delivery from a printed circuit board (PCB) to an IC package ...


4
Chandrashekhar Ramaswamy, Thomas G Ruttan, Mark D Summers: Providing variable sized contacts for coupling with a semiconductor device. Intel Corporation, Trop Pruner & Hu P C, May 12, 2009: US07530814 (10 worldwide citation)

In one embodiment, the present invention includes a circuit board having integrated contacts to mate with corresponding pads of a semiconductor device. At least some of the integrated contacts are of varying sizes to enable different contact resistances between the corresponding integrated contacts ...


5
Robert R Martinson, Yupeng Li, Tieyu Zheng, Mandy G Mistakawi, Thomas G Ruttan: Lateral force countering load mechanism for LGA sockets. Intel Corporation, Blakely Sokoloff Taylor & Zafman, October 20, 2009: US07604486 (8 worldwide citation)

Apparatus including a body as an intermediary between a device and a printed circuit board, the body including a contact area defined by a plurality of openings each to accommodate a contact therethrough and an alignment feature adjacent the contact area and protruding from a plane defined by the co ...


6
John M Lynch, John C Schwartz, Robert Schum, Endre C Veka, Thomas G Ruttan: Dual serial ATA connector. Intel Corporation, Antonelli Terry Stout & Kraus, March 9, 2004: US06702620 (8 worldwide citation)

A dual serial advanced technology attachment (SATA) connector that includes a first SATA connector interface, a second SATA connector interface, and a housing. The first SATA connector interface and the second SATA connector interface may be mounted in the housing in a double stack configuration par ...


7
Joe A Harrison, Edward R Stanford, Thomas G Ruttan: Processor power delivery system. Intel Corporation, Trop Pruner & Hu P C, March 26, 2002: US06360431 (7 worldwide citation)

A system for delivering power to a processor enables a DC-to-DC converter substrate to be secured to the processor carrier in the Z-axis direction. The ability to assemble the converter to the processor in this way facilitates assembly compared to systems in which the converter is plugged in to the ...


8
Thomas G Ruttan, Tieyu Zheng: Socket assembly that includes improved contact arrangement. Intel Corporation, Schwegman Lundberg & Woessner P A, January 20, 2009: US07479015 (5 worldwide citation)

In some embodiments, a socket assembly, electronic assembly and electronic system provide current paths for supplying power and I/O signals to a processor. The socket assembly includes a base having an upper surface and a lower surface with a plurality of contacts extending from the upper surface of ...


9
Yun Ling, Thomas G Ruttan, Daniel T Tong: Low cost high speed board-to-board coaxial connector design with co-planar waveguide for PCB launch. Intel Corporation, Blakely Sokoloff Taylor & Zafman, March 2, 2004: US06700464 (4 worldwide citation)

An apparatus comprising a direct board-to-board coaxial connection fabricated from metal parts that have been stamped and formed is disclosed. The connection allows direct board-to-board coaxial connections with a low cost and ease of manufacturing.


10
Thomas G Ruttan, Ed Stanford, Peter A Davison, Tony Harrison: System and method for connecting a power converter to a land grid array socket. Intel Corporation, Blakely Sokoloff Taylor & Zafman, April 26, 2005: US06884086 (3 worldwide citation)

A land grid array (LGA) socket is connected to a power converter using compression contact technology eliminating the need for an edge-card connector typically required in such applications. The LGA socket is mounted to the power converter in a single direction of assembly (i.e., the vertical axis).