1
Christopher G Angulas, Patrick T Flynn, Joseph Funari, Thomas E Kindl, Randy L Orr: Method of bonding flexible circuit to cicuitized substrate to provide electrical connection therebetween using different solders. Inernational Business Machines, Lawrence R Fraley, April 20, 1993: US05203075 (201 worldwide citation)

A method of bonding a flexible circuitized substrate to a circuitized substrate (e.g., printed circuit board) to interconnect selected circuitry of both substrates using solder. Solder paste is applied over conductive pads on the circuitized substrate and organic dewetting material (e.g., epoxy coat ...


2
Christopher G Angulas, Patrick T Flynn, Thomas E Kindl, Orr Randy L: Method of bonding flexible circuit to circuitized substrate to provide electrical connection therebetween. International Business Machines Corporation, Lawrence R Fraley, July 28, 1992: US05133495 (115 worldwide citation)

A method of bonding a flexible circuitized substrate to a circuitized substrate (e.g., printed circuit board) to interconnect selected circuitry of both substrates using solder. Solder paste is applied over conductive pads on the circuitized substrate and organic dewetting material (e.g., epoxy coat ...


3
Christopher G Angulas, Patrick T Flynn, Joseph Funari, Thomas E Kindl, Randy L Orr: Method for bonding flexible circuit to circuitized substrate to provide electrical connection therebetween using different solders. International Business Machines Corporation, Lawrence R Fraley, November 16, 1993: US05261155 (113 worldwide citation)

A method of bonding a flexible circuitized substrate to a circuitized substrate (e.g., printed circuit board) to interconnect selected circuitry of both substrates using solder. Solder paste is applied over conductive pads on the circuitized substrate and organic dewetting material (e.g., epoxy coat ...


4
Christopher G Angulas, Patrick T Flynn, Joseph Funari, Thomas E Kindl, Randy L Orr: Flexible circuit member. International Business Machines Corporation, Lawrence R Fraley, July 25, 1995: US05435732 (44 worldwide citation)

A flexible circuit member including a circuitized substrate of a dielectric material having a plurality of apertures therein. Located within and/or bridging selected ones of the apertures are electrical conductors, the conductors having a solder member secured thereto. A frame is also used, the circ ...


5
Christopher G Angulas, Thomas E Kindl: Electronic package and method of making same. International Business Machines Corporation, Lawrence R Fraley, January 11, 1994: US05278724 (31 worldwide citation)

An electronic package and method of making same wherein the package includes a first substrate (e.g., printed circuit board), a second, flexible circuitized substrate (e.g., polyimide dielectric with conductors thereon) having a semiconductor device (chip) electrically coupled thereto. The outer por ...


6
Thomas E Kindl, Ronald J Moore, Paul G Rickerl: Method for forming a patterned layer on a substrate. International Business Machines Corporation, Calfee Halter & Griswold, August 2, 1994: US05334487 (17 worldwide citation)

The present invention provides a method of forming a pattern of conductive material on dielectric material with access openings or vias through said dielectric material and such a structure. A sheet of conductive material, which is to be circuitized, is provided with a layer of a first photoimageabl ...


7
Thomas E Kindl, Paul G Rickerl, David J Russell: Method of etching polyimides and resulting passivation structure. International Business Machines Corporation, March 27, 1990: US04911786 (14 worldwide citation)

A method of etching polyimide having metallization patterned thereon in which an epoxy resin system provides the etch mask for etching the polyimide and provides a resulting passivation structure overlying the metallization. The polyimide having a metallization pattern thereon is coated with the pho ...


8
Stanley M Albrechta, Robert J Clementi, Thomas E Kindl: Method of making a flexible circuit member. International Business Machines Corporation, Lawrence R Fraley, September 8, 1992: US05145553 (11 worldwide citation)

A method of making a flexible circuit member including a stainless steel base member, a dielectric layer (polyimide) on the base member and a conductive circuit (copper) on the dielectric. The circuit member may be first formed as a laminate structure wherein the dielectric polyimide is coated on th ...


9
Frank D Egitto, Elizabeth Foster, Raymond T Galasco, David E Houser, Mark L Janecek, Thomas E Kindl, Jeffrey A Knight, Stephen W MacQuarrie, Voya R Markovich, Luis J Matienzo, Amarjit S Rai, David J Russell, William T Wike: Fabrication of a metalized blind via. International Business Machines Corporation, Lawrence R Fraley, Schmeiser Olsen & Watts, February 18, 2003: US06522014 (7 worldwide citation)

A method and structure for forming a metalized blind via. A dielectric layer is formed on a metallic layer, followed by laser drilling a depression in the dielectric layer such that a carbon film that includes the carbon is formed on a sidewall of the depression. If the laser drilling does not expos ...


10
Pei C Chen, Thomas E Kindl, Paul G Rickerl, Mark J Schadt, John G Stephanie: Method of laminating polyimide to thin sheet metal. International Business Machines Corporation, Lawrence R Fraley, October 20, 1992: US05156710 (6 worldwide citation)

An improved method of laminating a metal foil or sheet to a polyimide material is provided. A solution of a precursor of an intractable (i.e. thermosetting) polyimide is applied to a substrate and the solvent is removed to form a dry tack-free film. Thereafter, a solution of a precursor of a thermop ...