1
Michael Bauer, Peter Strobel, Gerald Ofner, Edward Fürgut, Simon Jerebic, Thomas Bemmerl, Markus Fink, Hermann Vilsmeier: Electronic component and semiconductor wafer, and method for producing the same. Infineon Technologies, Dicke Billig Czaja PLLC, September 2, 2008: US07420262 (20 worldwide citation)

The invention relates to an electronic component and a semiconductor wafer, and a method for producing them. The semiconductor wafer has strip-type separating regions. The separating regions are provided with through contacts in the direction of the rear side of the semiconductor wafer. The semicond ...


2
Thomas Bemmerl, Thomas Mende, Bernd Rakow: Electronic device. Infineon Technologies, Dicke Billig & Czaja PLLC, June 15, 2010: US07737537 (6 worldwide citation)

Embodiments provide an electronic device. The electronic device includes a leadframe having a first face that defines an island and multiple leads configured to communicate with a chip attached to the island, a first structure element separate from and coupled to a first face of the leadframe, at le ...


3
Michael Bauer, Thomas Bemmerl, Edward Fuergut, Simon Jerebic, Christian Stuempfl, Horst Theuss, Hermann Vilsmeier: Semiconductor device having through contacts through a plastic housing composition and method for the production thereof. Infineon Technologies, Dicke Billig & Czaja PLLC, May 17, 2011: US07944061 (4 worldwide citation)

The invention relates to a semiconductor device comprising through contacts through a plastic housing composition and a method for the production thereof. For this purpose, the wiring substrate has a solder deposit on which through contact elements are arranged vertically with respect to the wiring ...


4
Thomas Bemmerl, Holger Wörner, Bernd Waidhas: Electronic package having integrated cooling element with clearance for engaging package. Infineon Technologies, Laurence A Greenberg, Werner H Stemer, Ralph E Locher, June 20, 2006: US07064429 (4 worldwide citation)

An electronic component includes at least one semiconductor chip. The semiconductor chip is attached on a first side of a wiring board or a leadframe. The wiring board is provided with interconnect structures at least on a second side. The first side of the wiring board, with the semiconductor chip ...


5
Thomas Bemmerl, Thomas Mende, Bernd Rakow: Electronic device. Infineon Technologies, Dicke Billig & Czaja PLLC, October 4, 2011: US08030741 (2 worldwide citation)

One embodiment provides a semiconductor assembly including a printed circuit board and a semiconductor package. The semiconductor package includes a lead frame having a die pad and a plurality of leads spaced from the die pad, a chip attached to the die pad on a front face of the lead frame, at leas ...


6
Michael Bauer, Thomas Bemmerl, Edward Fuergut, Simon Jerebic, Herman Vilsmeier: Support with solder ball elements and a method for populating substrates with solder balls. Infineon Technologies, Dicke Billig & Czaja P L L C, May 3, 2011: US07935622 (2 worldwide citation)

A support with solder ball elements for loading substrates with ball contacts is disclosed. One embodiment provides a system for loading substrates with ball contacts and a method for loading substrates with ball contacts. The support has a layer of adhesive applied on one side, the layer of adhesiv ...


7
Michael Bauer, Thomas Bemmerl, Edward Fuergut, Simon Jerebic, Hermann Vilsmeier: Panel and semiconductor device having a composite plate with semiconductor chips. Infineon Technologies, Dicke Billig & Czaja PLLC, May 11, 2010: US07713791 (1 worldwide citation)

The invention relates to a panel and a semiconductor device including a composite plate with semiconductor chips and a plastic packaging compound, and to processes for producing them. For this purpose, the panel having a composite plate has semiconductor chips arranged in rows and columns on a top s ...


8
Joachim Mahler, Thomas Bemmerl, Anton Prueckl: Multichip power semiconductor device. Infineon Technologies, Slater & Matsil L, December 23, 2014: US08916968 (1 worldwide citation)

An electronic device includes a first chip carrier and a second chip carrier isolated from the first chip carrier. A first power semiconductor chip is mounted on and electrically connected to the first chip carrier. A second power semiconductor chip is mounted on and electrically connected to the se ...


9
Michael Bauer, Thomas Bemmerl, Edward Fuergut: Semiconductor device with semiconductor device components embedded in a plastics composition. Infineon Technologies, Dicke Billig & Czaja PLLC, September 21, 2010: US07800241 (1 worldwide citation)

A semiconductor device with semiconductor device components embedded in a plastics composition is disclosed. In one embodiment, organosilicon and organometallic compounds are used for producing an adhesion promoter layer. The adhesion promoter layer on the surfaces of the semiconductor device compon ...


10
Thomas Bemmerl, Simon Jerebic, Markus Pindl: Electronic arrangement and method for producing an electronic arrangement. OSRAM Opto Semiconductors, Cozen O Connor, June 13, 2017: US09681566

An electronic arrangement (1) comprising a carrier (2), on which at least one connecting area (6) is arranged. At least one electronic component (3a, 3b, 3c) is fixed on the connecting area (6) by means of a contact material (4). A covering area (5) surrounds the connecting area (6) on the carrier ( ...



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