1
Thomas B Lyden: Semiconductor die bonding with conductive adhesive. Motorola, John H Moore, March 7, 1989: US04811081 (104 worldwide citation)

An improved semiconductor assembly includes a semiconductor die that is mounted on a carrier, such as a tape or a substrate, by means of an anisotropically electrically conductive adhesive. The adhesive forms an electrically conductive path between electrical conductors on the carrier and other cond ...


2
Alexander Szyszko, Rick L Fuqua, Thomas B Lyden, Mariusz Smialek, Marek Dudek: Screen printing apparatus with data storage. Elexon, Fitch Even Tabin & Flannery, January 14, 1997: US05592877 (11 worldwide citation)

A system of control is disclosed for an oval printing machine comprising a plurality of travelling pallets sequentially moved in a first direction on an endless path through a plurality of screen printing stations during a printing mode of operation in which the pallets pause at the printing station ...


3
Thomas B Lyden: Deflection yoke assembly and mounting arrangement. RCA Corporation, Paul J Rasmussen, Joseph Laks, Scott J Stevens, October 7, 1986: US04616265 (5 worldwide citation)

A deflection yoke is mounted to a cathode ray tube by the use of two adhesives having different hardening rates. A first adhesive is applied between the yoke and the tube by a dispensing machine in a sufficient quantity to temporarily hold the yoke on the tube. A second adhesive having a hardening r ...