1
Harold J Hileman, Robert J Walsh, Thomas A Walsh: Semiconductor wafer polishing appartus and method. MEMC Electric Materials, Senninger Powers Leavitt & Roedel, February 25, 1997: US05605487 (35 worldwide citation)

Apparatus for polishing semiconductor wafers comprises a housing, a mounting apparatus within the housing for wax mounting a first face of a semiconductor wafer to a first face of a polishing block, and a first semiconductor wafer polisher within the housing for polishing a second face of the semico ...


2
Salman M Kassir, Thomas A Walsh: Grinding process and apparatus for planarizing sawed wafers. Strasbaugh, Daniel C McKown, October 12, 1999: US05964646 (28 worldwide citation)

A method and apparatus for planarizing silicon wafers initially having wavy surfaces, such as might result from having been cut from a boule by means of a wire saw. A vacuum is applied to one side of a porous ceramic plate, and a perforated resilient pad is applied to the opposite side of the porous ...


3
Thomas A Walsh, Salman Moudrek Kassir: Grinding apparatus and method. Strasbaugh a California corporation, Thomas F Lebens Sinsheimer Juhnke Lebens & McIvor, October 10, 2006: US07118446 (13 worldwide citation)

A grinding assembly for shaping work pieces that includes one or more grind spindles. Each of the grind spindles include two independent grinding wheels driven by a single spindle drive. The grind spindles translate horizontally to perform both edge and face grinding with a single grind spindle. A n ...


4
Thomas A Walsh, Alan E Strasbaugh: Lap milling machine. R Howard Strasbaugh, Howard L Johnson, October 19, 1976: US03986433 (13 worldwide citation)

A programmable machine for automatically cutting and/or resurfacing a selected arcuate pattern upon either a convex or concave lap, particularly such laps as may then be used for forming and polishing opthalmic lenses. A lap positioning unit and a cutter positioning unit are located respectively on ...


5
Thomas A Walsh: Lap shaping machine with oscillatable point cutter and selectively rotatable or oscillatable lap. R Howard Strasbaugh, Howard L Johnson, April 19, 1983: US04380412 (11 worldwide citation)

Programmable electric and hydraulic machine for shaping laps such as are used to form or polish opthalmic lenses, comprises vertically oscillatable, longitudinally displaceable arm carrying a point cutter which is functionally engageable by radially extensible, rotating lap carried by upstanding spi ...


6
Thomas A Walsh, Salman Moudrek Kassir: Grinding apparatus and method. Strasbaugh a California corporation, Thomas F Lebens, Sinsheimer Juhnke Lebens & Mclvor, December 2, 2008: US07458878 (6 worldwide citation)

The present embodiments provide methods, systems and apparatuses for use in grinding work pieces, such as wafers. Some embodiments provide methods that position a grind spindle to contact a first grinding spindle to a face of a work piece, remove a portion of the face, and control the removing of th ...


7
Michael Vogtmann, Thomas A Walsh: Grinding apparatus having an extendable wheel mount. Strasbaugh, Irving Keschner, March 13, 2012: US08133093 (4 worldwide citation)

A grinding machine wherein coarse and fine grind wheels are mounted to a single rotating spindle. A multiple grind wheel mount is attached to the lower portion of the rotating spindle, the coarse and fine wheels being supported by the wheel mount, the wheel mount containing the mechanism for moving ...


8
Thomas A Walsh, Michael R Vogtmann: Systems and methods of wafer grinding. Strasbaugh, Fitch Even Tabin & Flannery, March 3, 2015: US08968052 (3 worldwide citation)

Systems and methods are provided for use in processing and/or grinding wafers or other work products. Some embodiments provide a grinding apparatus that comprise a base casting; a rotary indexer configured to rotate within the base casting; a work spindle secured with the rotary indexer; a work chuc ...


9
Thomas A Walsh: Dip soldering apparatus and method. Hewlett Packard Company, Donald N Timbie, May 21, 1985: US04518114 (3 worldwide citation)

Method and apparatus for forming an electrical contact between mounting pins extending from an electrical component and insulated wires from the component that are wrapped around the pins in which the tips of the pins are held in a flowing pool of molten solder until the heat travelling up the pins ...


10
William Kalenian, Thomas A Walsh: Chemical-mechanical planarization tool force calibration method and system. Strasbaugh, Marc J Frechette Esq, K David Crockett Esq, Crockett & Crockett, May 9, 2006: US07040955 (2 worldwide citation)

The methods and devices described below allow users of CMP tools to quickly calibrate Spindle Force, Wafer Force, and Retaining Ring Force using mechanisms, load cells, a control computer, and force equations. The control computer can test a variety of pressures in the inflatable seal or the inflata ...