1
Katsuhiro Hayashida, Mitsutaka Sato, Tadashi Uno, Tetsuya Fujisawa, Masaki Waki: Semiconductor device, method of manufacturing the semiconductor device, and method of manufacturing lead frame. Fujitsu, Armstrong Westerman Hattori McLeland & Naughton, May 9, 2000: US06060768 (131 worldwide citation)

A semiconductor device includes a semiconductor chip in which electrode pads are formed with a first pitch, leads electrically connected with the electrode pads through lines, and sealing plastic sealing the semiconductor chip. In the semiconductor device, projections used for external connection po ...


2
Kazuyuki Imamura, Yasunori Fujimoto, Masaaki Seki, Tetsuya Fujisawa, Mitsutaka Sato, Ryuji Nomoto, Junichi Kasai, Yoshitaka Aiba, Noriaki Shiba: Semiconductor device having columnar electrode and method of manufacturing same. Fujitsu, Armstrong Westerman & Hattori, November 5, 2002: US06476503 (124 worldwide citation)

A semiconductor device including a semiconductor chip sealed with an encapsulating resin. Columnar electrodes are connected to electrode pads of the semiconductor chip, and extend through the encapsulating resin. The columnar electrodes are made from bonding wires and include enlarged outer ends. So ...


3
Tetsuya Fujisawa, Mitsutaka Sato, Seiichi Orimo, Kazuhiko Mitobe, Masaaki Seki, Masaki Waki, Toshio Hamano, Katsuhiro Hayashida, Yoshitsugu Katoh, Hiroshi Inoue: Apparatus for a vertically accumulable semiconductor device with external leads secured by a positioning mechanism. Fujitsu, Armstrong Westerman & Hattori, August 13, 2002: US06433418 (116 worldwide citation)

A semiconductor device includes a resin package in which a semiconductor chip is sealed, the resin package having a first surface and a second surface opposite to the first surface; a plurality of leads having inner lead parts connected to the semiconductor chip and outer lead parts extending outsid ...


4
Tetsuya Fujisawa, Mitsutaka Sato, Junichi Kasai, Masataka Mizukoshi, Kosuke Otokita, Hiroshi Yoshimura, Katsuhiro Hayashida, Akira Takashima, Masahiko Ishiguri, Michio Sono: Semiconductor device and semiconductor device unit for a stack arrangement. Fujitsu, Armstrong Westerman Hattori McLeland & Naughton, September 1, 1998: US05801439 (96 worldwide citation)

A semiconductor device includes a semiconductor element, a package sealing the semiconductor element, and leads for passing signals between the semiconductor element and an external device. Each of the leads has an inner-lead part sealed within the package and connected with the semiconductor elemen ...


5
Hirohisa Matsuki, Yutaka Makino, Masamitsu Ikumo, Mitsutaka Sato, Tetsuya Fujisawa, Yoshitaka Aiba: External connection terminal and semiconductor device. Fujitsu, Armstrong Westerman & Hattori, April 15, 2003: US06548898 (46 worldwide citation)

A structure in which a phosphorus-nickel layer, a rich phosphorus nickel layer that contains phosphorus or boron higher than this phosphorus-nickel layer, a nickel-tin ally layer, a tin-rich tin alloy layer, and a tin alloy solder layer are formed in sequence on an electrode. Accordingly, adhesivene ...


6
Tetsuya Fujisawa, Mitsutaka Sato, Junichi Kasai, Masataka Mizukoshi, Kousuke Otokita, Hiroshi Yoshimura, Katsuhiro Hayashida, Akira Takashima, Masahiko Ishiguri, Michio Sono: Semiconductor device having an inner lead extending over a central portion of a semiconductor device sealed in a plastic package and an outer lead exposed to the outside of a side face of the plastic package. Fujitsu, Armstrong Westerman Hattori McLeland & Naughton, June 2, 1998: US05760471 (40 worldwide citation)

A semiconductor device including a semiconductor element, and leads connected with the semiconductor element. Each of the leads includes an outer lead part for being connected externally. The semiconductor device further includes a plastic package sealing the semiconductor element and the leads. In ...


7
Yoshitsugu Katoh, Mitsutaka Sato, Hiroshi Inoue, Seiichi Orimo, Akira Okada, Yoshihiro Kubota, Mitsuo Abe, Toshio Hamano, Yoshitaka Aiba, Tetsuya Fujisawa, Masaaki Seki, Noriaki Shiba: Surface mount type semiconductor device and method of producing the same having an interposing layer electrically connecting the semiconductor chip with protrusion electrodes. Fujitsu, Armstrong Westerman Hattori McLeland & Naughton, December 25, 2001: US06333564 (31 worldwide citation)

A semiconductor device and a method of producing the same, the device including a semiconductor chip; balls which function as external connecting terminals; a substrate which electrically connects the semiconductor chip and the balls; a mold resin which seals at least a part of the semiconductor chi ...


8
Tetsuya Fujisawa, Hirohisa Matsuki, Osamu Igawa, Yoshitaka Aiba, Masamitsu Ikumo, Mitsutaka Sato: Semiconductor device configured to be surface mountable. Fujitsu, Westerman Hattori Daniels & Adrian, December 28, 2004: US06836025 (30 worldwide citation)

In a semiconductor device circuit formation surfaces of each of a plurality of semiconductor chips can be easily located at even level when the semiconductor chips are arranged side by side so that a process of forming rearrangement wiring is simplified. The semiconductor chips are mounted on a subs ...


9
Yutaka Makino, Eiji Watanabe, Hirohisa Matsuki, Tetsuya Fujisawa: Semiconductor device manufacturing method having a step of forming a post terminal on a wiring by electroless plating. Fujitsu, Armstrong Westerman & Hattori, May 20, 2003: US06566239 (20 worldwide citation)

A method of manufacturing a semiconductor device is provided. The method includes the steps of forming a wiring layer on an underlying metal film formed on a substrate, the wiring layer being electrically connected to an electrode pad formed on a substrate, removing a part of the wiring layer so as ...


10
Mitsutaka Sato, Tetsuya Fujisawa, Shigeyuki Maruyama, Junichi Kasai, Toshimi Kawahara, Toshio Hamano, Yoshihiro Kubota, Mitsunada Osawa, Yoshiyuki Yoneda, Kazuto Tsuji, Hirohisa Matsuki: Semiconductor module including a plurality of semiconductor devices detachably. Fujitsu, Armstrong Westerman & Hattori, October 29, 2002: US06472744 (18 worldwide citation)

A semiconductor module includes a plurality of semiconductor devices each including a circuit substrate carrying thereon a single memory semiconductor chip and a socket for holding the semiconductor devices detachably.