1
Madhav Datta, Terrence R O Toole: Electrochemical metal removal technique for planarization of surfaces. IBM Corporation, Ratner & Prestia, October 22, 1996: US05567300 (200 worldwide citation)

A high speed electrochemical metal removal technique provides for planarization of multilayer copper interconnection in thin film modules. The process uses a neutral salt solution, is compatible with the plating process and has minimum safety and waste disposal problems. The process offers tremendou ...


2
Eleftherios Adamopoulos, Jungihl Kim, Kang Wook Lee, Tae S Oh, Terrence R O Toole, Sampath Purushothaman, John J Ritsko, Jane M Shaw, Alfred Viehbeck, George F Walker: Adhesive layer in multi-level packaging and organic material as a metal diffusion barrier. International Business Machines Corporation, Scully Scott Murphy & Presser, December 10, 1996: US05582858 (77 worldwide citation)

The disclosure describes a multilayer article of manufacture comprising a substrate having adhered to it a terminally unsaturated adhesive polyimide, where the surface of the adhesive opposite the substrate is adhered to a polyimide, the article further characterized in having one set or a plurality ...


3
Harry R Bickford, Peter J Duke, Elizabeth Foster, Martin J Goldberg, Voya R Markovich, Linda C Matthew, Donald G McBride, Terrence R O Toole, Stephen L Tisdale, Alfred Viehbeck: Method for conditioning halogenated polymeric materials and structures fabricated therewith. International Business Machines Incorporated, Pollock Vande Sande & Priddy, December 20, 1994: US05374454 (60 worldwide citation)

A halogenated polymeric material is exposed to a reducing agent and/or an electrolyte and applied voltage to render exposed portions capable of being metallized and of being etched. The exposed portions can also be doped to thereby induce electrical conductivity therein. Also, new structures contain ...


4
Thomas J Meyer, Terrence R O Toole, Lawrence D Margerum, T David Westmoreland, William J Vining, Royce W Murray, B Patrick Sullivan: Chemically modified electrodes for the catalytic reduction of CO.sub.2. Gas Research Institute, Cushman Darby & Cushman, July 12, 1988: US04756807 (42 worldwide citation)

An electrode that has a film adsorbed to its surface by reductive electropolymerization of (vbpy)Re(CO).sub.3 Cl (4-vinyl-4'-methyl-2,2'-bipyridine tricarbonylchlororhenium(I)) or its acetonitrile analogue, [(vbpy)Re(CO).sub.3 (MeCN)].sup.+ (4-vinyl-4'-methyl-2,2'-bipyridine tricarbonylacetonitrile ...


5
Gary V Arbach, Terrence R O Toole, Alfred Viehbeck: Multilayer structures of different electroactive materials and methods of fabrication thereof. International Business Machines Corporation, Daniel P Morris, June 4, 1991: US05021129 (26 worldwide citation)

Structures and methods of fabrication thereof wherein the method selectively supplies electrons to a first electroactive material in the presence of a second electroactive material wherein the first and second electroactive materials have different redox potentials. The electrons are selectively sup ...


6
Eleftherios Adamopoulos, Jungihl Kim, Kang Wook Lee, Tae S Oh, Terrence R O Toole, Sampath Purushothaman, John J Ritsko, Jane M Shaw, Alfred Viehbeck, George F Walker: Adhesive layer in multi-level packaging and organic material as a metal diffusion barrier. International Business Machines Corporation, Scully Scott Murphy & Presser, July 5, 1994: US05326643 (23 worldwide citation)

The disclosure describes a multilayer article of manufacture comprising a substrate having adhered to it a terminally unsaturated adhesive polyimide, where the surface of the adhesive opposite the substrate is adhered to a polyimide, the article further characterized in having one set or a plurality ...


7
Eugene J O Sullivan, Terrence R O Toole, Judith M Roldan, Lubomyr T Romankiw, Carlos J Sambucetti, Ravi Saraf: Electroless metal adhesion to organic dielectric material with phase separated morphology. International Business Machines Corporation, Philip J Feig, Stephen C Kaufman, May 10, 1994: US05310580 (18 worldwide citation)

Improved adhesion of electroless metal deposited on an organic dielectric layer with phase separated morphology is accomplished by the spontaneous formation of a morphologically and topographically rough surface. In one embodiment a ternary solution of a polar solvent and two polymer precursors of t ...


8
Thomas H Baum, Shyama P Mukherjee, Terrence R O Toole, Alice F Tai, Alfred Viehbeck: Method for forming a thin film layer. International Business Machines Corporation, Ira David Blecker, October 31, 1995: US05462897 (16 worldwide citation)

A method for forming a thin film layer on a dielectric substrate. A nonconducting layer of material is blanket deposited on the dielectric substrate followed by a layer of polymeric dielectric material which is then patterned to partially expose the underlying layer of nonconducting material. The ex ...


9
Eleftherios Adamopoulos, Jungihl Kim, Kang Wook Lee, Tae S Oh, Terrence R O Toole, Sampath Purushothaman, John J Ritsko, Jane M Shaw, Alfred Viehbeck, George F Walker: Adhesive layer in multi-level packaging and organic material as a metal diffusion barrier. International Business Machines Corporation, Scully Scott Murphy & Presser, February 4, 1997: US05599582 (15 worldwide citation)

The disclosure describes a multilayer article of manufacture comprising a substrate having adhered to it a terminally unsaturated adhesive polyimide, where the surface of the adhesive opposite the substrate is adhered to a polyimide, the article further characterized in having one set or a plurality ...


10
Leena P Buchwalter, Stephen L Buchwalter, Terrence R O Toole, Richard R Thomas, Alfred Viehbeck: Surface midification of a polyimide. International Business Machines Corporation, Scully Scott Murphy & Presser, July 28, 1992: US05133840 (15 worldwide citation)

The surface modification of polyimide materials by a chemical process is disclosed to provide a variety of functional groups on the surface. The surface is treated to produce polyamic acid carboxyl groups which are subsequently reacted with epoxies, hydrazines, or alcohols. The carboxyl groups can b ...