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Tatsuya Shimoda, Satoshi Inoue, Wakao Miyazawa: Separating method, method for transferring thin film device, thin film device, thin film integrated circuit device, and liquid crystal display device manufactured by using the transferring method. Seiko Epson Corporation, Oliff & Berridge, April 16, 2002: US06372608 (570 worldwide citation)

A method for transferring a thin film device on a substrate onto a transfer member, includes a step for forming a separation layer on the substrate, a step for forming a transferred layer including the thin film device on the separation layer, a step for adhering the transferred layer including the ...


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Tatsuya Shimoda, Satoshi Inoue, Wakao Miyazawa: Exfoliating method, transferring method of thin film device, and thin film device, thin film integrated circuit device and liquid crystal display device produced by the same. Seiko Epson Corporation, Oliff & Berridge, November 11, 2003: US06645830 (423 worldwide citation)

A method for transferring a thin film device on a substrate onto a transfer member, includes a step for forming a separation layer on the substrate, a step for forming a transferred layer including the thin film device on the separation layer, a step for adhering the transferred layer including the ...


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Tatsuya Shimoda, Satoshi Inoue, Wakao Miyazawa: Exfoliating method, transferring method of thin film device, and thin film device, thin film integrated circuit device, and liquid crystal display device produced by the same. Seiko Epson Corporation, Oliff & Berridge, November 16, 2004: US06818530 (381 worldwide citation)

A transferring method including providing a substrate, forming a transferred layer over the substrate, joining a transfer member to the transferred layer, and removing the transferred layer from the substrate. The transferring method further includes transferring the transferred layer to the transfe ...


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Satoshi Inoue, Tatsuya Shimoda: Manufacturing method of active matrix substrate, active matrix substrate and liquid crystal display device. Seiko Epson Corporation, Oliff & Berridge, October 3, 2000: US06127199 (293 worldwide citation)

A method of manufacturing an active matrix substrate is provided that uses a technique of transferring a thin film device. In forming thin film transistors and pixel electrodes on an original substrate before transfer, an insulator film such as an interlayer insulation film or the like, is previousl ...


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Satoshi Inoue, Tatsuya Shimoda, Wakao Miyazawa: Thin film device transfer method, thin film device, thin film integrated circuit device, active matrix board, liquid crystal display, and electronic apparatus. Seiko Epson Corporation, Oliff & Berridge, February 18, 2003: US06521511 (268 worldwide citation)

A thin film device fabrication method in which a thin film device formed on a substrate are transferred to a primary destination-of-transfer part and then the thin film device is transferred to a secondary destination-of-transfer part. A first separation layer (


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Mutsumi Kimura, Tatsuya Shimoda, Hiroshi Kiguchi: Pixel circuit display apparatus and electronic apparatus equipped with current driving type light-emitting device. Seiko Epson Corporation, Oliff & Berridge, February 11, 2003: US06518962 (257 worldwide citation)

A display apparatus is provided with a current driving type light-emitting device and a driving device for controlling a driving current flowing through the light-emitting device for each pixel of the display apparatus. The display apparatus consists of power source units for supplying power for cau ...


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Satoshi Inoue, Tatsuya Shimoda: Method for making three-dimensional device. Seiko Epson Corporation, Oliff & Berridge, September 30, 2003: US06627518 (185 worldwide citation)

A method for making a three-dimensional device is disclosed. The method includes a step of forming a first cleaving layer, a first intermediate layer, and a first transferred layer on a first translucent substrate and forming a second cleaving layer, a second intermediate layer, and a second transfe ...


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Satoshi Inoue, Tatsuya Shimoda, Wakao Miyazawa: Thin film device transfer method, thin film device, thin film integrated circuit device, active matrix board, liquid crystal display, and electronic apparatus. Seiko Epson Corporation, Oliff & Berridge, April 12, 2005: US06878607 (180 worldwide citation)

A thin film device fabrication method in which a thin film device formed on a substrate are transferred to a primary destination-of-transfer part and then the thin film device is transferred to a secondary destination-of-transfer part. A first separation layer (120) made of such a material as amorph ...


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Takayuki Kondo, Tatsuya Shimoda, Atsushi Sato: Process for mounting device and optical transmission apparatus. Seiko Epson Corporation, Harness Dickey & Pierce, July 29, 2003: US06599769 (139 worldwide citation)

An optical transmission apparatus applicable to an optical interconnection apparatus for interconnection between stacked IC chips, and a process of mounting elements for manufacturing such an apparatus are disclosed. For example, light emitting elements (


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