1
Tatsuro Kikuchi, Yoshitsugu Uenishi: Integrated circuit device and manufacturing method thereof. Matsushita Electric Industrial, Stevens Davis Miller & Mosher, June 16, 1992: US05122860 (198 worldwide citation)

Provided is an integrated circuit device is used in an IC card or the like, and a manufacturing method of the integrated circuit device, having a thin thickness so as to be capable of being manufactured highly accurately in dimensions and highly efficiently. The integrated circuit element (12) is mo ...


2
Tsuneshi Nakamura, Tatsuro Kikuchi: Hybrid integrated circuit component and printed circuit board mounting said component. Matsushita Electric Industrial, Wenderoth Lind & Ponack, January 22, 1985: US04495546 (82 worldwide citation)

A hybrid integrated circuit component for insertion in a slit of a mother printed circuit board, and a method of mounting the hybrid integrated circuit component. The circuit component includes a flexible circuit board composed of a flexible insulated substrate, a circuit conductor formed on one sid ...


3
Seiichi Nakatani, Satoru Yuhaku, Hideyuki Okinaka, Toru Ishida, Osamu Makino, Tatsuro Kikuchi: Conductor paste and method of manufacturing a multilayered ceramic body using the paste. Matsushita Electric Industrial, Wenderoth Lind & Ponack, December 22, 1987: US04714570 (21 worldwide citation)

A manufacturing method for a multilayered ceramic body using Cu, Ni, Co or Fe as a conductor material, and a conductor forming paste of a particular composition of CuO, NiO, CoO or Fe.sub.2 O.sub.3 as the main component, the paste being applied to the multilayered body. The manufacturing method comp ...


4
Seiichi Nakatani, Satoru Yuhaku, Hideyuki Okinaka, Toru Ishida, Osamu Makino, Tatsuro Kikuchi: Conductor paste and method of manufacturing a multilayered ceramic body using the paste. Matsushita Electric Industrial, Wenderoth Lind & Ponack, September 5, 1989: US04863683 (18 worldwide citation)

A manufacturing method for a multilayered ceramic body using Cu, Ni, Co or Fe as a conductor material, and a conductor forming paste of particular composition of CuO, NiO, CoO or Fe.sub.2 O.sub.3 as the main component, the paste being applied to the multilayered body. The manufacturing method compri ...


5
Tsutomu Nishimura, Seiichi Nakatani, Satoru Yuhaku, Yasuhiko Hakotani, Tatsuro Kikuchi: Laminated ceramic capacitor. Matsushita Electric Industrial, Wenderoth Lind & Ponack, May 7, 1991: US05014158 (12 worldwide citation)

A laminated ceramic capacitor comprises a plurality of inner electrode layers for developing a capacitance, dielectric layers sandwiched with the inner electrode layers, and a pair of outer electrodes coupled to their associated inner electrode layers for output of the capacitance. The inner electro ...


6
Tatsuro Kikuchi, Kenichi Fujimura, Hyogo Hirohata, Tetsuo Hino: Etchant for electrolytic etching of a ferrite for a magnetic head and method of producing a magnetic head. Matsushita Electric Industrial, Wenderoth Lind & Ponack, September 25, 1979: US04169026 (8 worldwide citation)

An etchant comprising an electrolytic liquid which comprises sulfuric acid as a main component and water in such amount that the weight ratio of sulfuric acid to water is between 9:1 and 2:1. The ferrite surface having been electrolytically etched by using this etchant is smooth. Thus, this etchant ...


7
Yukihito Yamashita, Akira Omi, Takeshi Iino, Shigeki Inagaki, Tatsuro Kikuchi, Yoshinori Tomita: Screening method for a multi-layered ceramic capacitor. Matsushita Electric Industrial, Wenderoth Lind & Ponack L, August 20, 2002: US06437579 (6 worldwide citation)

A method for screening multi-layered ceramic capacitors having internal defects at a high accuracy by superposing a direct-current constant current between external electrodes of a multi-layered ceramic capacitor having a defective part in an effective layer of the dielectric ceramic, raising the vo ...