1
Osamu Kuwabara, Takeshi Wakabayashi, Ichiro Mihara: Mounting structure having columnar electrodes and a sealing film. Casio Computer, Frishauf Holtz Goodman & Chick P C, July 29, 2003: US06600234 (130 worldwide citation)

A semiconductor device includes a semiconductor substrate having bump electrodes and a sealing film formed thereon, the sealing film having laminated layers. The sealing film interposed between adjacent bump electrodes is prepared by laminating a protective film and each layer of the sealing film on ...


2
Takeshi Wakabayashi, Akira Suzuki, Shigeru Yokoyama: Method for forming a bump electrode for a semiconductor device. Casio Computer, Frishauf Holtz Goodman & Woodward, April 28, 1992: US05108950 (120 worldwide citation)

A bump electrode structure of a semiconductor device comprises an electrode pad formed of an aluminum alloy, an insulating oxide layer covering only the peripheral edge portion of the electrode pad, an under-bump layer formed of an alloy of titanium and tungsten, and a bump electrode formed of gold. ...


3
Yutaki Aoki, Ichiro Mihara, Takeshi Wakabayashi, Katsumi Watanabe: Semiconductor device having a barrier layer. Casio Computer, Frishauf Holtz Goodman & Chick P C, April 8, 2003: US06545354 (88 worldwide citation)

In a semiconductor device such as a CSP, re-wiring is provided on a circuit element formation region of a semiconductor substrate and a columnar electrode for connection with a circuit board is provided on the re-wiring. A first insulating film is provided over the semiconductor substrate excluding ...


4
Takeshi Wakabayashi: Semiconductor device and method of manufacturing the same. Casio Computer, Frishauf Holtz Goodman & Chick P C, August 19, 2003: US06607970 (65 worldwide citation)

A dicing tape is adhered to the lower surface of a silicon wafer that has pillar-shaped electrodes. The silicon wafer is cut along dicing streets, thereby making trenches among the chip-forming regions of the wafer. Next, a seal film is formed. The seal film is cut, substantially along the centerlin ...


5
Toshio Nishino, Yasuyuki Ishiguro, Takeshi Wakabayashi, Toshihide Ohgoshi: Use status detecting mechanism and image-producing unit. Sharp Kabushiki Kaisha, Birch Stewart Kolasch & Birch, September 14, 2004: US06792217 (34 worldwide citation)

A use status detecting mechanism includes a cover having an edge portion, in a portion of which a notch is formed, a moving member having a rod member, a spring portion, protrusions and grooves, and a shaft having a driving gear and ribs. In the unused state of a developing unit, the rod member is m ...


6
Takeshi Wakabayashi, Osamu Kuwabara: Semiconductor device and method of manufacturing the same. Casio Computer, Frishauf Holtz Goodman & Chick P C, August 5, 2003: US06603191 (25 worldwide citation)

The back surface of a semiconductor wafer having a plurality of chip-forming regions each provided with a plurality of connection pads on the surface is bonded to a dicing tape, followed by fully cutting the semiconductor wafer along a cut line so as to form a cutting groove. Then, a front side prot ...


7
Takao Kamei, Fuminobu Ono, Keiichi Komai, Takeshi Wakabayashi, Takayuki Ogawa, Hideaki Ito, Kiyoshi Shirakawa: Process for dewatering high moisture, porous organic solid. Kawasaki Jukogyo Kabushiki Kaisha, Electric Power Development, Leydig Voit & Mayer, October 27, 1987: US04702745 (23 worldwide citation)

A high moisture porous organic solid is dewatered by the steps of (1) heating the high moisture porous organic solid in a fluid medium having an elevated temperature and a high pressure, thereby reducing the moisture of the solid, (2) starting to compress the porous structure of the solid by mechani ...


8
Takeshi Wakabayashi, Kazuhiko Tani: Front wheel and rear wheel interlocking brake system for motorcycle. Honda Giken Kogyo Kabushiki Kaisha, Birch Stewart Kolasch & Birch, June 25, 2002: US06409285 (23 worldwide citation)

To provide a front wheel and rear wheel interlocking brake system having a simple structure, which is capable of automatically performing brake control of the front and rear wheels on the basis of the running state of the motorcycle. A front wheel and rear wheel interlocking brake system is provided ...


9
Ichiro Mihara, Takeshi Wakabayashi, Toshihiro Kido, Hiroyasu Jobetto, Yutaka Yoshino, Nobuyuki Kageyama, Daita Kohno, Jun Yoshizawa: Semiconductor device and method of manufacturing the same. Casio Computer, CMK Corporation, Frishauf Holtz Goodman & Chick P C, February 27, 2007: US07183639 (22 worldwide citation)

A semiconductor device includes at least one semiconductor structure which has a plurality of external connection electrodes formed on a semiconductor substrate. An insulating sheet member is arranged on the side of the semiconductor structure. Upper interconnections have connection pad portions tha ...


10
Takeshi Wakabayashi, Makoto Igarashi: Wheel speed detecting device for a vehicle. Honda Giken Kogyo Kabushiki Kaisha, Birch Stewart Kolasch & Birch, December 10, 2002: US06492805 (19 worldwide citation)

To provide device capable of enhancing the detection accuracy of a wheel speed detecting device and reducing cost. A wheel speed detecting device for a rear wheel includes a pulsar ring mounted on a rear wheel hub, and a pulse counting sensor mounted on a swing arm. The pulsar ring includes a disc, ...