1
Takehiro Saitoh: Semiconductor device molded in plastic package free from crack by virtue of organic stress relaxation layer. NEC Corporation, March 16, 1999: US05883439 (9 worldwide citation)

A semiconductor chip is mounted on a die pad of a lead-frame, and the semiconductor chip mounted on the die pad is sealed in a plastic package; a side surface of the semiconductor chip and an exposed upper surface and a side surface of the die pad are covered with an organic stress relaxation layer ...


2
Takehiro Saitoh: Semiconductor device and method of fabricating the same. NEC Corporation, Scully Scott Murphy & Presser PC, February 27, 2003: US20030040158-A1 (6 worldwide citation)

A semiconductor device improves the electron mobility in the n-channel MOSFET and reduces the bend or warp of the semiconductor substrate or wafer. The fist nitride layer having a tensile stress is formed on the substrate to cover the n-channel MOSFET. The tensile stress of the first nitride layer s ...