1
Masahiko Ogino, Akira Nagai, Shuji Eguchi, Toshiaki Ishii, Masanori Segawa, Haruo Akahoshi, Akio Takahashi, Takao Miwa, Naotaka Tanaka, Ichirou Anjou: Semiconductor device having a stress relieving mechanism. Hitachi, Antonelli Terry Stout & Kraus, February 22, 2000: US06028364 (109 worldwide citation)

A semiconductor device has a multi-layered wiring structure having a conductor layer to be electrically connected to a packaging substrate, the structure being provided on a circuit formation surface of a semiconductor chip; and ball-like terminals disposed in a grid array on the surface of the mult ...


2
Osamu Miura, Akio Takahashi, Takao Miwa, Masahiro Suzuki, Ryuji Watanabe, Junichi Katagiri, Yoichi Daiko, Tsutomu Imai, Haruo Akahoshi: LSI package board. Hitachi, Antonelli Terry Stout & Kraus, October 15, 1996: US05565706 (93 worldwide citation)

A thin and high-density package board used with general-purpose mainframe computers and high-speed processors is provided. On a ceramic substrate on which memory LSIs and a logic LSI with only elements formed without multilayer wiring are mounted, a multilayer wiring layer insuring signal transfer o ...


3
Toshiya Satoh, Masahiko Ogino, Tadanori Segawa, Takao Miwa, Akira Nagai, Akihiro Yaguchi, Ichiro Anjo, Asao Nishimura: Semiconductor apparatus having stress cushioning layer. Hitachi, Antonelli Terry Stout & Kraus, September 16, 2003: US06621154 (33 worldwide citation)

A miniature semiconductor apparatus is outstanding in reflow resistance, temperature cycle property, and PCT resistance corresponding to high density packing, high densification, and speeding up of processing. The semiconductor apparatus has at least one stress cushioning layer on a semiconductor el ...


4
Masahiko Ogino, Akira Nagai, Shuji Eguchi, Toshiaki Ishii, Masanori Segawa, Haruo Akahoshi, Akio Takahashi, Takao Miwa, Naotaka Tanaka, Ichirou Anjou: Method of making a semiconductor device having a stress relieving mechanism. Hitachi, Antonelli Terry Stout & Kraus, July 23, 2002: US06423571 (22 worldwide citation)

A method of forming a semiconductor device having a multi-layered wiring structure that includes a conductor layer to be electrically connected to a packaging substrate, with the multi-layered wiring structure being provided on a circuit formation surface of a semiconductor chip. Ball-like terminals ...


5
Takao Miwa: Insert-molded card key. Fuki Company, Colucci & Umans, September 10, 1991: US05046343 (21 worldwide citation)

An insert-molded card key in which a key and a card are mutually operatively connected, the card key comprising a key wherein a key support member formed of resin and a key body formed of metal are insert-molded, a card body having a key receiving portion formed in a portion of a card for the key, a ...


6
Osamu Shiono, Takao Ishikawa, Takashi Namekawa, Yasutaka Suzuki, Takashi Naito, Hiroki Yamamoto, Daigoro Kamoto, Ken Takahashi, Tadanori Segawa, Toshiya Sato, Takao Miwa, Shigehisa Motowaki: Wiring glass substrate for connecting a semiconductor chip to a printed wiring substrate and a semiconductor module having the wiring glass substrate. Renesas Technology, Dickstein Shapiro, February 27, 2007: US07183650 (20 worldwide citation)

A wiring glass substrate includes a glass substrate formed of glass and having a plurality of holes formed at predetermined positions, bumps so formed as to be connected to a conductive material filling the holes and wirings formed on a surface opposite to a surface having the bumps formed thereon a ...


7
Toshiya Satoh, Masahiko Ogino, Takao Miwa, Takashi Naitou, Takashi Namekawa: Semiconductor connection substrate. Hitachi, Crowell & Moring, August 23, 2005: US06933601 (17 worldwide citation)

A semiconductor connection substrate which connects a semiconductor element to a mounting substrate such as a printed substrate comprises an insulator substrate, a plurality of electrodes having different areas provided on the insulator substrate, one or more elements selected from a capacitor eleme ...


8
Takeo Watanabe, Takao Miwa, Satoshi Jibiki, Masamichi Kezuka, Kensuke Matsuno: METHOD OF MANUFACTURING GLASS SUBSTRATE FOR INFORMATION RECORDING MEDIA, GLASS SUBSTRATE FOR INFORMATION RECORDING MEDIA MANUFACTURED USING THE METHOD, AND INFORMATION RECORDING MEDIUM USING THE GLASS SUBSTRATE. Hoya Corporation, Frishauf Holtz Goodman & Chick P C, January 25, 2005: US06845635 (17 worldwide citation)

There are provided a method of manufacturing a glass substrate for information recording media that allows the inner and outer peripheral edge surfaces of the glass substrate for information recording media to be smoothed easily and inexpensively, a glass substrate for information recording media ma ...


9
Osamu Miura, Kunio Miyazaki, Akio Takahashi, Motoyo Wajima, Ryuji Watanabe, Takao Miwa, Yuichi Satsu, Shigeo Amagi: Multi-layer wiring structure. Hitachi, Antonelli Terry Stout & Kraus, June 16, 1998: US05768108 (15 worldwide citation)

A multi-layer wiring structure for mounting electronic devices is provided to be used in an electronic computer, a work station or the like, and more particularly a multi-layer packaging board having microscopic wiring layers, which board has an excellent dimensional stability and a high reliability ...


10
Shunichi Numata, Ikeda Takayoshi, Koji Fujisaki, Takao Miwa, Noriyuki Kinjo: Method for forming polyimide film by chemical vapor deposition. Hitachi, Antonelli Terry & Wands, July 26, 1988: US04759958 (15 worldwide citation)

A method for forming a polyimide film on a substrate surface by chemical vapor deposition comprises evaporating an aromatic monomer compound having one amino group and two adjacent carboxyl groups or its derivative group, such as esters of 4-amino phthalic acid, and 4-(p-anilino) phthalic acid, thus ...