1
Yan John, Du Yong, Symmon Bruce E: Multi-chip module and method of manufacture. Spansion, Yan John, Du Yong, Symmon Bruce E, DRAKE Paul S, November 2, 2006: WO/2006/115649 (5 worldwide citation)

A multi-chip module (10) and a method for manufacturing the multi-chip module (10). A first semiconductor chip (40) is mounted to a support substrate (12) and a second semiconductor chip (50) is mounted to the first semiconductor chip (40). The second semiconductor chip (50) has a smaller dimension ...


2
Yan John, Du Yong, Symmon Bruce E: Multi-chip module and method of manufacture. Spansion, gebo, April 9, 2008: CN200680012623

A multi-chip module (10) and a method for manufacturing the multi-chip module (10). A first semiconductor chip (40) is mounted to a support substrate (12) and a second semiconductor chip (50) is mounted to the first semiconductor chip (40). The second semiconductor chip (50) has a smaller dimension ...


3
Yan John, Du Yong, Symmon Bruce E: Multi-chip module and method of manufacture. Spansion, January 16, 2008: EP1878048-A2

A multi-chip module (10) and a method for manufacturing the multi-chip module (10). A first semiconductor chip (40) is mounted to a support substrate (12) and a second semiconductor chip (50) is mounted to the first semiconductor chip (40). The second semiconductor chip (50) has a smaller dimension ...


4
Yan John, Du Yong, Symmon Bruce E: Multi-chip module and method of manufacture. Spansion, December 13, 2007: KR1020077025006

A multi-chip module (10) and a method for manufacturing the multi-chip module (10). A first semiconductor chip (40) is mounted to a support substrate (12) and a second semiconductor chip (50) is mounted to the first semiconductor chip (40). The second semiconductor chip (50) has a smaller dimension ...