1
Michael A Ogrinc, Robert A Card, Chris R Burns, Charles P Clarke, Ronda L Collier, Kevin M Collins, Stephen E Crane, Clifford Hersh, Brian C Knittel, Steven T Mayer, Lawrence Stead, Andrew E Wade, Robert L Lay, Bradley G Stewart, Raymond Pon, Robert Leyland, John F Schlag, Sven Jensen: Real time video image processing system. New Microtime, Skjerven Morrill MacPherson Franklin & Friel, January 24, 1995: US05384912 (244 worldwide citation)

A video digital signal processing and display system that allows real time processing of video images with extensive filtering and inter-pixel interpolation. The system includes a front end user and program interface supported by a personal computer, and also includes a microprocessor for controllin ...


2
Steven T Mayer, Robert J Contolini, Anthony F Bernhardt: Method and apparatus for spatially uniform electropolishing and electrolytic etching. The United States of America represented by the United States Department of Energy, Henry P Sartorio, L E Carnahan, William R Moser, March 17, 1992: US05096550 (162 worldwide citation)

In an electropolishing or electrolytic etching apparatus the anode is separated from the cathode to prevent bubble transport to the anode and to produce a uniform current distribution at the anode by means of a solid nonconducting anode-cathode barrier. The anode extends into the top of the barrier ...


3
James L Kaschmitter, Steven T Mayer, Richard W Pekala: Supercapacitors based on carbon foams. November 9, 1993: US05260855 (111 worldwide citation)

A high energy density capacitor incorporating a variety of carbon foam electrodes is described. The foams, derived from the pyrolysis of resorcinol-formaldehyde and related polymers, are high density (0.1 g/cc-1.0 g/cc) electrically conductive and have high surface areas (400 m.sup.2 /g-1000 m.sup.2 ...


4
Steven T Mayer, Evan E Patton, Robert L Jackson, Jonathan D Reid: Copper electroplating apparatus. Novellus Systems, Beyer Weaver & Thomas, March 4, 2003: US06527920 (108 worldwide citation)

An electroplating apparatus prevents anode-mediated degradation of electrolyte additives by creating a mechanism for maintaining separate anolyte and catholyte and preventing mixing thereof within a plating chamber. The separation is accomplished by interposing a porous chemical transport barrier be ...


5
Steven T Mayer, Timothy Patrick Cleary, Michael John Janicki, Edmund B Minshall, Thomas A Ponnuswamy: Electrochemical treatment of integrated circuit substrates using concentric anodes and variable field shaping elements. Novellus Systems, Patton Boggs, June 29, 2004: US06755954 (90 worldwide citation)

An apparatus for electrochemical treatment of a substrate, in particular for electroplating an integrated circuit wafer. An apparatus preferably includes dynamically operable concentric anodes and dielectric shields in an electrochemical bath. Preferably, the bath height of an electrochemical bath, ...


6
Steven T Mayer: Lithium nickel cobalt oxides for positive electrodes. PolyStor Corporation, Beyer & Weaver, July 21, 1998: US05783333 (88 worldwide citation)

Positive electrodes including a lithium nickel cobalt metal oxide are disclosed. The lithium nickel cobalt metal oxides have the general formula Li.sub.x Ni.sub.y CO.sub.z M.sub.n O.sub.2, where M is selected from the group consisting of aluminum, titanium, tungsten, chromium, molybdenum, magnesium, ...


7
Steven T Mayer, Jay G Miner, Douglas G Neubauer, Joseph C Decuir: Data processing system with programmable graphics generator. Atari, Townsend and Townsend, October 20, 1981: US04296476 (82 worldwide citation)

A microprocessor based data processing system including a microprocessor, a memory unit, and display unit is provided with a programmable graphics generator that transfers graphics information from the memory unit to the display unit in response to and control of a set of display instructions also s ...


8
Jonathan D Reid, Steven T Mayer, R Marshall Stowell, Evan E Patton, Jeff A Hawkins: Clamshell apparatus for electrochemically treating wafers. Novellus Systems, Beyer Weaver & Thomas, October 5, 2004: US06800187 (82 worldwide citation)

An apparatus for engaging a work piece during plating facilitates electrolyte flow during a plating operation. The apparatus helps to control the plating solution fluid dynamics and electric field shape to keep the wafer's local plating environment uniform and bubble free. The apparatus holding ...


9
Steven T Mayer, Richard Hill, Alain Harrus, Evan Patton, Robert Contolini, Steve Taatjes, Jon Reid: Method and apparatus for uniform electroplating of integrated circuits using a variable field shaping element. Thomas Swenson, Lathrop & Gage L C, June 11, 2002: US06402923 (77 worldwide citation)

An electrochemical reactor is used to electrofill damascene architecture for integrated circuits. A shield is used to screen the applied field during electroplating operations to compensate for potential drop along the radius of a wafer. The shield establishes an inverse potential drop in the electr ...


10
Steven T Mayer, Evan E Patton, Brian Paul Blackman, Jonathan D Reid, Thomas Anand Ponnuswamy, Harold D Perry: Method and apparatus for uniform electroplating of thin metal seeded wafers using multiple segmented virtual anode sources. Novellus Systems, Beyer Weaver & Thomas, August 10, 2004: US06773571 (76 worldwide citation)

The present invention pertains to methods and apparatus for electroplating a substantially uniform layer of a metal onto a work piece having a seed layer thereon. The total current of a plating cell is distributed among a plurality of anodes in the plating cell in order to tailor the current distrib ...