1
Stefano Sergio Oggioni, Vincenzo Condorelli, Nihad Hadzic: Method for manufacturing a tamper-proof cap for an electronic module. International Business Machines Corporation, Joseph Petrokaitis, September 7, 2010: US07788801 (13 worldwide citation)

A tamper-proof cap adapted to be mounted on a large assembly for shielding a selected area of the large assembly is disclosed. The tamper-proof cap comprises a laminate stack-up structure wherein at least one open chamber is formed. The stack-up structure comprises at least two layers wherein tamper ...


2
Stefano Sergio Oggioni, Vincenzo Condorelli, Nihad Hadzic, Kevin C Gotze, Tamas Visegrady: Method of embedding tamper proof layers and discrete components into printed circuit board stack-up. International Business Machines Corporation, Steve Capella, Joseph Petrokaitis, April 27, 2010: US07703201 (9 worldwide citation)

A method for embedding tamper proof layers and discrete components into a printed circuit board stack-up is disclosed. According to this method, a plating mask is applied on a base substrate to cover partially one of its faces. Conductive ink is then spread on this face so as to fill the gap formed ...


3
David Alcoe, Ronald Nowak, Francesco Preda, Stefano Sergio Oggioni: Electronic device carrier adapted for transmitting high frequency signals. International Business Machines Corporation, Richard M Kotulak, March 21, 2006: US07015574 (5 worldwide citation)

An electronic device carrier (110) adapted for transmitting high-frequency signals, including a circuitized substrate with a plurality of conductive layers (240a to 240g) insulated from each other, the conductive layers being arranged in a sequence from a first one of the conductive layers (240a) wh ...


4
Stephen Buchwalter, Michael Anthony Gaynes, Nancy C LaBianca, Stefano Sergio Oggioni, Son K Tran: Reworkable and thermally conductive adhesive and use thereof. International Business Machines Corporation, Daniel P Morris, Connolly Bove Lodge & Hutz, September 9, 2003: US06617698 (5 worldwide citation)

Reworkable thermally conductive adhesive composition comprising a cured reaction product from a diepoxide wherein the epoxy groups are connected through an acyclic acetal moiety, a cyclic anhydride and a thermally conductive filler are provided and used to bond semiconductive devices to a chip carri ...


5
Stefano Sergio Oggioni, Jonas R Weiss, Bert Jan Offrein: Electro-optical assembly fabrication. International Business Machines Corporation, Thomas E Tyson, Steven L Bennett, May 21, 2013: US08444328 (4 worldwide citation)

A flip-chip bonder fabricates an optical assembly by horizontally positioning a flexible portion of a substrate including a waveguide with the waveguide exposed at one end edge of the substrate; bending a portion of the flexible substrate to place the waveguide exposed end in approximately a vertica ...


6
Roger Dangel, Laurent Dellmann, Michel Despont, Bert Jan Offrein, Stefano Sergio Oggioni: Method for attaching a flexible structure to a device and a device having a flexible structure. International Business Machines Corporation, Ido Tuchman, Kenneth R Corsello, April 28, 2009: US07523547 (2 worldwide citation)

Techniques for producing a flexible structure attached to a device. One embodiment includes the steps of providing a first substrate, providing a second substrate with a releasably attached flexible structure, providing a bonding layer on at least one of the first substrate and the flexible structur ...


7
Stefano Sergio Oggioni: Tamper-proof structures for protecting electronic modules. International Business Machines Corporation, Yuanmin Cai, March 29, 2011: US07915540 (2 worldwide citation)

A tamper-proof structure for protecting an electronic module, comprising a pattern of signal lines having a highly unpredictable layout, which is an approximation of a space-filling curve obtained by the replication of at least one elementary space element having an inscribed base curve inscribed th ...


8
Stefano Sergio Oggioni, Jonas R Weiss, Bert Jan Offrein: Computer program product for electro-optical assembly. International Business Machines Corporation, Thomas E Tyson, Damion C Josephs, October 28, 2014: US08870472 (1 worldwide citation)

A computer program product for fabricating an optical assembly, having a computer readable storage medium having computer readable program code embodied therewith, the computer readable program code includes a first computer readable program code configured to horizontally position a flexible portio ...


9
Stefano Sergio Oggioni: Method and system for prototyping electronic devices with multi-configuration CHIP carriers. International Business Machines Corporation, Joseph Petrokaitis, August 24, 2010: US07783998 (1 worldwide citation)

A solution for prototyping electronic devices is proposed. The solution uses a carrier which allows mounting the desired components with different configurations. In order to achieve this result, for some of these components, such as discrete capacitors, the carrier includes more contacts than the c ...


10
Roger Dangel, Laurent Dellmann, Michel Despont, Bert Jan Offrein, Stefano Sergio Oggioni: Method for attaching a flexible structure to a device. International Business Machines Corporation, Ido Tuchman, William J Stock, October 16, 2012: US08286345 (1 worldwide citation)

Techniques for producing a flexible structure attached to a device. One embodiment includes the steps of providing a first substrate, providing a second substrate with a releasably attached flexible structure, providing a bonding layer on at least one of the first substrate and the flexible structur ...