1
Bernd Goller, Gerald Ofner, Josef Thumbs, Holger Wörner, Robert Christian Hagen, Christian Stümpfl, Stefan Wein: Electronic component with at least two stacked semiconductor chips and method for fabricating the electronic component. Infineon Technologies, Laurence A Greenberg, Werner H Stemer, Ralph E Locher, March 23, 2004: US06710455 (28 worldwide citation)

An electronic component is formed with at least two semiconductor chips that are disposed on a carrier substrate. Active chip surfaces of the semiconductor chips include central contact surfaces on which opposing solder contact surfaces are formed. These are conductively connected to an intermediate ...


2
Bernd Goller, Robert Christian Hagen, Gerald Ofner, Christian Stuempfl, Josef Thumbs, Stefan Wein, Holger Woerner: Electronic component with a plastic package and method for production. Infineon Technologies, Edell Shapiro & Finnan, October 2, 2007: US07276783 (26 worldwide citation)

An electronic component with a plastic package and to a method for its production, includes a semiconductor chip. An underside of the plastic package has external contacts. The external contacts are connected to contact areas on an active upper side of the semiconductor chip by contact pillars of th ...


3
Bernd Goller, Robert Christian Hagen, Christian Stuempfl, Stefan Wein, Holger Woerner: Electronic device configured as a multichip module, leadframe, panel with leadframe positions, and method for producing the electronic device. Infineon Technologies, Laurence A Greenberg, Werner H Stemer, Ralph E Locher, June 7, 2005: US06902951 (18 worldwide citation)

An electronic device has, as a multichip module, two or more semiconductor chips that are integrated into a leadframe such that a placement side of the leadframe and the active top sides of the circuit chips are flush and have a common fine wiring plane. The leadframe is arranged as an expanded semi ...


4
Bernd Goller, Robert Christian Hagen, Gerald Ofner, Christian Stuempfl, Stefan Wein, Holger Wörner: Universal package for an electronic component with a semiconductor chip and method for producing the universal package. Infineon Technologies, Laurence A Greenberg, Werner H Stemer, Gregory L Mayback, March 15, 2005: US06867471 (16 worldwide citation)

An electronic component has a semiconductor chip with chip contacts. The chip contacts are mechanically fixed on a wiring structure and electrically connected to the wiring structure. The wiring structure is formed as a region of a structured metal plate or as a region of a structured metal layer of ...


5
Bernd Goller, Robert Christian Hagen, Gerald Ofner, Christian Stümpfl, Josef Thumbs, Stefan Wein, Holger Wörner: Electronic component and process for producing the electronic component. Infineon Technologies, Laurence A Greenberg, Werner H Stemer, Ralph E Locher, January 27, 2004: US06683374 (12 worldwide citation)

An electronic component has at least a first semiconductor chip module, a second semiconductor chip module, and a substrate to accommodate the semiconductor chip modules. In this case, active chip surfaces of the two semiconductor chip modules each have a central contact area, which are disposed to ...


6
Bernd Goller, Robert Christian Hagen, Gerald Ofner, Christian Stuempfl, Stefan Wein, Holger Wörner: Method of producing a universal semiconductor housing with precrosslinked plastic embedding compounds. Infineon Technologies, Laurence A Greenberg, Werner H Stemer, Ralph E Locher, April 14, 2009: US07517722 (10 worldwide citation)

An electronic component and a blank have plastic embedding compounds of a first and a second plastic layer. Semiconductor chips are embedded in the first plastic layer in such a way that their marginal sides are surrounded by a bead. The second plastic layer compensates for the unevenness of a upper ...


7
Bernd Goller, Robert Christian Hagen, Gerald Ofner, Christian Stümpfl, Josef Thumbs, Stefan Wein, Holger Wörner: Electronic component with at least one semiconductor chip and method for its manufacture. Infineon Technologies, Laurence A Greenberg, Werner H Stemer, Gregory L Mayback, October 11, 2005: US06953992

The invention relates to an electronic component having at least one semiconductor chip and a flat chip carrier assigned to the semiconductor chip. Electrical connections between contact areas on an active chip surface of the semiconductor chip and contact terminal areas on an upper side of the chip ...


8
Bernd Goller, Robert Christian Hagen, Gerald Ofner, Christian Stuempfl, Josef Thumbs, Stefan Wein, Holger Woerner: Electronic component with a plastic housing and method for production thereof. Edell Shapiro Finnan & Lytle, November 25, 2004: US20040232543-A1

An electronic component with a plastic package and to a method for its production, includes a semiconductor chip. An underside of the plastic package has external contacts. The external contacts are connected to contact areas on an active upper side of the semiconductor chip by contact pillars of th ...


9
Bernd Goller, Robert Christian Hagen, Christian Stuempfl, Stefan Wein, Holger Woerner: Electronic device configured as a multichip module, leadframe, panel with leadframe positions, and method for producing the electronic device. Lerner And Greenberg Pa, July 22, 2004: US20040140559-A1

An electronic device has, as a multichip module, two or more semiconductor chips that are integrated into a leadframe such that a placement side of the leadframe and the active top sides of the circuit chips are flush and have a common fine wiring plane. The leadframe is arranged as an expanded semi ...


10
Bernd Goller, Robert Christian Hagen, Gerald Ofner, Christian Stuempfl, Stefan Wein, Holger Worner: Method of producing a universal semiconductor housing with precrosslinked plastic embedding compounds. Infineon Technologies, Lerner Greenberg Stemer, November 16, 2006: US20060258046-A1

An electronic component and a blank have plastic embedding compounds of a first and a second plastic layer. Semiconductor chips are embedded in the first plastic layer in such a way that their marginal sides are surrounded by a bead. The second plastic layer compensates for the unevenness of a upper ...