1
Stefan Grötsch, Sergey Kudaev, Bryce Anton Moffat, Peter Schreiber: Light-emitting module, particularly for use in an optical projection apparatus. Osram Opto Semiconductors, Fish & Richardson P C, July 12, 2011: US07976205 (68 worldwide citation)

A light-emitting module is specified, comprising at least two light sources disposed on a common carrier. At least one of said light sources includes at least two LED chips. Each light source of the module is followed downstream by an optic body of an optical element, and the optic bodies are suitab ...


2
Stefan Grötsch, Georg Bogner: Light source. Osram Opto Semiconductors, Cohen Pontani Lieberman & Pavane, December 23, 2008: US07467885 (38 worldwide citation)

A light source, such as for a projection system, having a plurality of semiconductor chips and at least two different, electromagnetic-radiation-emitting chip types with different emission spectra, each semiconductor chip having a chip coupling-out area through which radiation is coupled out. Furthe ...


3
Stefan Grötsch, Patrick Kromotis: Housing for a radiation-emitting component, method for the production thereof, and radiation-emitting component. Osram Opto Semiconductors, Fish & Richardson P C, August 19, 2008: US07414269 (26 worldwide citation)

The invention proposes a housing for at least two radiation-emitting components, particularly LEDs, comprising a system carrier (1) and a reflector arrangement (2) disposed on said system carrier (1), the reflector arrangement comprising a number of reflectors each of which serves to receive at leas ...


4
Stefan Grötsch, Hans Ludwig Althaus, Werner Späth, Georg Bogner: Apparatus and method for producing a chip-substrate connection. Infineon Technologies, Herbert L Lerner, Laurence A Greenberg, Werner H Stemer, March 5, 2002: US06353202 (17 worldwide citation)

An apparatus for producing a chip-substrate connection, in particular by soldering a semiconductor chip on a substrate. The apparatus has a support, on which the substrate is temporarily supported, and a heating device which is provided for forming the chip-substrate connection. The heating device h ...


5
Josef Schmid, Stefan Grötsch, Michael Hiegler, Moritz Engl, Georg Bogner, Karlheinz Arndt, Markus Schneider: Housing for an electronic component. Osram Opto Semiconductors, Cohen Pontani Lieberman & Pavane, March 10, 2009: US07501660 (9 worldwide citation)

A housing is specified for an electronic component having at least two connecting parts (4a, 4b), which are partially in contact with the housing. The conductivity of at least subareas of the housing are set in a defined manner and current paths through the housing are formed between the connecting ...


6
Georg Bogner, Stefan Grötsch, Günter Waitl, Mario Wanninger: Light-emitting diode arrangement. Osram Opto Semiconductors, Fish & Richardson P C, August 23, 2011: US08003998 (8 worldwide citation)

A light-emitting diode arrangement is disclosed, comprising at least one light-emitting diode (LED) chip with a radiation decoupling surface through which a large portion of the electromagnetic radiation generated in the LED chip exits in a main direction of emission; a housing laterally surrounding ...


7
Stefan Grötsch, Berthold Hahn, Stefan Illek, Wolfgang Schnabel: Module comprising radiation-emitting semiconductor bodies. OSRAM Opto Semiconductors, Cozen O Connor, April 10, 2012: US08154031 (8 worldwide citation)

A module comprising a regular arrangement of individual radiation-emitting semiconductor bodies (1) which are applied on a mounting area (6) of a carrier (2), wherein a wire connection is fitted between two adjacent radiation-emitting semiconductor bodies (1) on a top side, opposite to the mounting ...


8
Stefan Grötsch, Moritz Engl, Florin Oswald, Michael Sailer, Alexander Wilm: Light-emitting module. Osram Opto Semiconductors, Fish & Richardson P C, November 24, 2009: US07621658 (8 worldwide citation)

A light-emitting module is specified that comprises a light source, a carrier for said light source, and an optical element, wherein the optical element comprises dowel pins that engage in corresponding recesses in the carrier. The light-emitting module is particularly well suited for use in optical ...


9
Georg Bogner, Moritz Engl, Stefan Grötsch, Patrick Joseph Kromotis: Optoelectronic component that emits electromagnetic radiation and illumination module. OSRAM Opto Semiconductors, Cozen O Connor, December 6, 2011: US08071990 (6 worldwide citation)

An optoelectronic component emitting electromagnetic radiation, comprising a housing body which has a cavity, the cavity being fashioned trenchlike and in the cavity a plurality of semiconductor chips being arranged in a linear arrangement. Two neighboring semiconductor chips have a distance from on ...


10
Georg Bogner, Stefan Grötsch, Joachim Reill: Headlight and headlight element. Osram Opto Semiconductors, Cohen Pontani Lieberman & Pavane, September 1, 2009: US07581860 (6 worldwide citation)

A headlight having a multitude of headlight elements, which each have at least one semiconductor chip which emits electromagnetic radiation; a primary optics element, which reduces the divergence of the light which is incident through the light input; and at least one headlight element output, which ...