Sri M Sri Jayantha: Safe-snap computer cable. International Business Machines Corporation, Francis L Conte, August 24, 1999: US05941729 (110 worldwide citation)

An electrical cable for a portable computer includes a plurality of electrical leads bound together in a flexible sheath. A first snap connector is joined to the leads. A second snap connector is complementary to the first snap connector and is connected thereto for establishing electrical connectio ...

Hien P Dang, Sri M Sri Jayantha: Remote monitoring and servicing of computer data centers. International Business Machines Corporation, Eustus D Nelson, January 1, 2008: US07315768 (49 worldwide citation)

A method of controlling an environmental condition within a building space having a plurality of devices sensitive to an environmental condition. The method includes the steps of: (a) sensing an environmental condition with plurality of monitors, each monitor having (i) a sensor to detect the enviro ...

Sri M Sri Jayantha, Vijayeshwar Das Khanna, Gerard McVicker, Hien Dang, Arun Sharma, Kiyoshi Satoh, Tatsuo Nakamoto: Mounting system for disk drive having a rotary actuator. Hitachi Global Storage Technologies Netherlands, McGinn & Gibb, Thomas R Berthold, August 30, 2005: US06937432 (44 worldwide citation)

A system for mounting a hard disk enclosure (HDE), includes a casing pivotably mounted to minimize at least one of settle-out dynamics, external rotational vibration, and emitted vibration, the casing allowing the HDE to rotate substantially freely, wherein the center of gravity of the HDE is substa ...

Sri M Sri Jayantha, Vijayeshwar D Khanna, Gerard McVicker: Apparatus for a shock absorber that allows a disk drive to move with respect to the chassis of a computer system. Hitachi Global Storage Technologies Netherlands, July 24, 2007: US07248467 (41 worldwide citation)

Embodiments of the present invention pertain to an apparatus for a shock absorber that allows a disk drive to move with respect to the chassis of a computer system. In one embodiment, the disk drive shock absorber includes an assembly joint and a flexure. The flexure is capable of being coupled to t ...

Sri M Sri Jayantha, Hien P Dang, Arun Sharma: Method and system for real-time estimation and prediction of the thermal state of a microprocessor unit. International Business Machines Corporation, Vazken Alexanian, McGinn IP Law Group PLLC, March 25, 2008: US07347621 (35 worldwide citation)

A method (and system) of predicting a thermal state of a transient thermal system, includes combining sensor outputs and thermal parameters to construct a consistent set of estimates of internal temperature of a transient thermal system.

Sri M Sri Jayantha, Gerard McVicker, John U Knickerbocker: Electronic package with a thermal interposer and method of manufacturing the same. International Business Machines Corporation, McGinn Intellectual Property Law Group PLLC, August 24, 2010: US07781883 (22 worldwide citation)

An electronic package includes a die including a thermal interface material through which a primary heat flux path is enabled for conducting heat from the die, an organic substrate, and a thermal interposer provided between the organic substrate and the die, the thermal interposer having an area ext ...

Sri M Sri Jayantha, Gerard MoVicker, Vijayeshwar Das Khanna: Active heat sink for high power microprocessors. Hitachi Global Storage Technologies Netherlands, Michael J Buchenhorner, April 5, 2005: US06876550 (21 worldwide citation)

A cooling apparatus for cooling a heat source such as a microprocessor, comprising a mobile heat sink placed in close proximity to the heat source; and a thermal conductor for conducting heat generated by the heat source to the mobile heat sink.

Karan Kacker, Douglas O Powell, David L Questad, David J Russell, Sri M Sri Jayantha: Clustered stacked vias for reliable electronic substrates. International Business Macines Corporation, Michael J Buchenhorner, Vazken Alexanian, September 3, 2013: US08522430 (19 worldwide citation)

A method of fabricating a substrate via structure in a substrate/chip assembly includes steps of: disposing a center via stack for electrical interconnects in the substrate/chip assembly; and providing a plurality of stacked vias surrounding the center via stack. The plurality of stacked vias encirc ...

Vijayeshwar D Khanna, Alok K Lohia, Gerard McVicker, Sri M Sri Jayantha: Integrated heat spreader and exchanger. International Business Machines Corporation, Cantor Colburn, Casey August, January 13, 2009: US07477517 (18 worldwide citation)

Disclosed is an integrated active heat spreader and exchanger. The heat spreader cum exchanger includes a housing with a conductive heat spreader therein. A spreader plate of the heat spreader is in thermal contact with a microprocessor chip to be cooled and a plurality of spreader fins extending fr ...

Kerry Bernstein, Sri M Sri Jayantha: Silicon heat spreader mounted in-plane with a heat source and method therefor. International Business Machines Corporation, McGinn IP Law Group PLLC, April 19, 2011: US07928548 (16 worldwide citation)

A heat spreader attached to a heat source that includes a semiconductor chip includes a silicon structure that provides a plurality of heat flux paths, including a lateral, in-plane heat flux path. The heat spreader is mounted in-plane with the heat source.