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Tetsuzo Yoshimura, Yashuhito Takahashi, Masaaki Inao, Michael G Lee, William Chou, Solomon I Beilin, Wen chou Vincent Wang, James J Roman, Thomas J Massingill: Systems based on opto-electronic substrates with electrical and optical interconnections and methods for making. Fujitsu, Coudert Brothers, January 29, 2002: US06343171 (159 worldwide citation)

Opto-electrical systems having electrical and optical interconnections formed in thin layers with thin-film active devices are disclosed. In one embodiment, optical connections are made between the edge of one substrate and the surface of another substrate with the use of photorefractive materials. ...


2
Solomon I Beilin, Michael G Peters, Michael G Lee, Wen chou V Wang: Through hole interconnect substrate fabrication process. Fujitsu, Christie Parker & Hale, October 3, 1995: US05454161 (146 worldwide citation)

A high density through-hole interconnect with high aspect ratio vias is formed by sequentially forming layers of dielectric material on a previous dielectric layer. After each layer is formed, a plurality of through holes are etched through each layer and filled or metalized with an electrically con ...


3
David G Love, Larry L Moresco, William T Chou, David A Horine, Connie M Wong, Solomon I Beilin: Wire interconnect structures for connecting an integrated circuit to a substrate. Fujitsu, McCubbrey Bartels & Ward, August 2, 1994: US05334804 (128 worldwide citation)

An interconnect structure for connecting an integrated circuit (IC) chip to a supporting substrate is described. The supporting substrate serves to communicate signals between the IC chip and the "outside world," such as other IC chips. In one embodiment, the interconnect structure comprises an inte ...


4
Tetsuzo Yoshimura, Yasuhito Takahashi, James Roman, Mark Thomas McCormack, Solomon I Beilin, Wen chou Vincent Wang, Masaaki Inao: Optical coupling structures and the fabrication processes. Fujitsu, Sheppard Mullin Richter & Hampton, January 27, 2004: US06684007 (121 worldwide citation)

An optical apparatus including an optical substrate having an embedded waveguide and an optical device adapted to receive light transmitted from an end of the waveguide. The optical apparatus includes a coupling structure for coupling the optical device to the substrate. The coupling structure has a ...


5
Solomon I Beilin, William T Chou, David Kudzuma, Michael G Lee, Michael G Peters, James J Roman, Som S Swamy, Wen chou Vincent Wang, Larry L Moresco, Teruo Murase: Controlled impedence interposer substrate. Fujitsu, Coudert Brothers, December 29, 1998: US05854534 (113 worldwide citation)

An interposer substrate for mounting an integrated circuit chip to a substrate, and method of making the same, are shown. The interposer substrate comprises power supply paths and controlled impedance signal paths that are substantially isolated from each other. Power supply is routed though rigid s ...


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Tetsuzo Yoshimura, Yashuhito Takahashi, Masaaki Inao, Michael G Lee, William Chou, Solomon I Beilin, Wen chou Vincent Wang, James J Roman, Thomas J Massingill: Multi-layer opto-electronic substrates with electrical and optical interconnections and methods for making. Fujitsu, Sheppard Mullin Richter & Hampton, January 18, 2005: US06845184 (101 worldwide citation)

Opto-electrical systems having electrical and optical interconnections formed in thin layers are disclosed. In one set of preferred embodiments, optical signals are conveyed between layers by respective vertical optical couplers disposed on the layers. In other preferred embodiments, optical signals ...


7
Michael Guang Tzong Lee, Solomon I Beilin, Wen chou Vincent Wang: Chip and board stress relief interposer. Fujitsu, Coudert Brothers, April 18, 2000: US06050832 (95 worldwide citation)

An interposer structure permits a differential transverse displacement of contact pads on opposite sides of the interposer to reduce thermal stresses when the interposer is bonded to contact pads of a chip and a substrate with different thermal coefficients of expansion. The effective elasticity of ...


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Tetsuzo Yoshimura, Yashuhito Takahashi, Masaaki Inao, Michael G Lee, William Chou, Solomon I Beilin, Wen chou Vincent Wang, James J Roman, Thomas J Massingill: Three-dimensional opto-electronic modules with electrical and optical interconnections and methods for making. Fujitsu, Sheppard Mullin Richter & Hampton, February 10, 2004: US06690845 (82 worldwide citation)

Three-dimensional opto-electronic modules having a plurality of opto-electronic (O/E) layers, with optical signals being routed between O/E layers within one or more three-dimensional volumes, are disclosed. In preferred embodiments, the O/E layers are disposed over and above one another with at lea ...


9
William T Chou, Solomon I Beilin, Michael Guang Tzong Lee, Michael G Peters, Wen Chou Vincent Wang: Method of fabrication of multiple-layer high density substrate. Fujitsu, Coudert Brothers, February 13, 2001: US06187652 (72 worldwide citation)

A method of fabricating a multi-layer interconnected substrate structure. The inventive method includes forming a multi-layer structure from multiple, pre-fabricated power and/or signal substrates which are laminated together. A drill is then used to form a via through the surface of a ring-type pad ...


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Tetsuzo Yoshimura, Yashuhito Takahashi, Masaaki Inao, Michael G Lee, William Chou, Solomon I Beilin, Wen chou Vincent Wang, James J Roman, Thomas J Massingill: Opto-electronic substrates with electrical and optical interconnections and methods for making. Fujitsu, Coudert Brothers, August 26, 2003: US06611635 (72 worldwide citation)

Disclosed is device and/or material integration into thin opto-electronic layers, which increase room for chip-mounting, and reduce the total system cost by eliminating the difficulty of optical alignment between opto-electronic devices and optical waveguides. Opto-electronic devices are integrated ...