1
Fred Pettinger, Carl White, Dave Marquardt, Sokol Ibrani, Eric Shero, Todd Dunn, Kyle Fondurulia, Mike Halpin: Process feed management for semiconductor substrate processing. ASM America, Snell & Wilmer, April 28, 2015: US09017481 (149 worldwide citation)

Embodiments related to managing the process feed conditions for a semiconductor process module are provided. In one example, a gas channel plate for a semiconductor process module is provided. The example gas channel plate includes a heat exchange surface including a plurality of heat exchange struc ...


2
Jeffrey D Womack, Vuong P Nguyen, Devendra Kumar, Jack S Kasahara, Sokol Ibrani: Thermal processing chamber for heating and cooling wafer-like objects. FSI International, Kagan Binder PLLC, October 23, 2001: US06307184 (36 worldwide citation)

A processing chamber and methods for employing this processing chamber to thermally treat wafer-like objects. The chamber comprises a double walled shell, a pedestal style heater, internal passages for the transport of cooling gases and removal of exhaust gases, independently variable gas introducti ...


3
Jeffrey D Womack, Vuong P Nguyen, Devendra Kumar, Jack S Kasahara, Sokol Ibrani: Thermal processing chamber for heating and cooling wafer-like objects. FSI International, Kagan Binder PLLC, July 23, 2002: US06423947 (11 worldwide citation)

A processing chamber and methods for employing this processing chamber to thermally treat wafer-like objects. The chamber comprises a double walled shell, a pedestal style heater, internal passages for the transport of cooling gases and removal of exhaust gases, independently variable gas introducti ...


4
Fred Pettinger, Carl White, Dave Marquardt, Sokol Ibrani, Eric Shero, Todd Dunn, Kyle Fondurulia, Mike Halpin: Process feed management for semiconductor substrate processing. ASM America, Snell & Wilmer, February 13, 2018: US09892908 (3 worldwide citation)

Embodiments related to managing the process feed conditions for a semiconductor process module are provided. In one example, a gas channel plate for a semiconductor process module is provided. The example gas channel plate includes a heat exchange surface including a plurality of heat exchange struc ...


5
Devendra Kumar, Jeffrey D Womack, Vuong P Nguyen, Jack S Kasahara, Sokol Ibrani: Thermal processing system and methods for forming low-k dielectric films suitable for incorporation into microelectronic devices. FSI International, Kagan Binder PLLC, January 4, 2005: US06838115 (3 worldwide citation)

Single wafer processing methods and systems for manufacturing films having low-k properties and low indices of refraction. The methods incorporate a processing station in which both curing and post-cure, in situ gas cooling take place.


6
Devendra Kumar, Jeffrey D Womack, Vuong P Nguyen, Jack S Kasahara, Sokol Ibrani: Thermal processing system and methods for forming low-k dielectric films suitable for incorporation into microelectronic devices. Kagan Binder Pllc, Suite 200 Maple Island Building, September 19, 2002: US20020132052-A1 (1 worldwide citation)

Single wafer processing methods and systems for manufacturing films having low-k properties and low indices of refraction. The methods incorporate a processing station in which both curing and post-cure, in situ gas cooling take place.


7
Sokol Ibrani: Local temperature control of susceptor heater for increase of temperature uniformity. ASM IP Holding, Sand & Sebolt, June 26, 2018: US10009961

The present disclosure relates to a substrate support and a heating assembly comprising heaters for controlling the temperature uniformity of a susceptor of the assembly and a substrate, which may be used for thin film deposition on a substrate such as semi-conductor wafer, and a method of using the ...


8
Jeffrey D Womack, Vuong P Nguyen, Devendra Kumar, Jack S Kasahara, Sokol Ibrani: Thermal processing chamber for heating and cooling wafer-like objects. FSI International, Mark W Binder Esq, Kagan Binder PLLC, November 15, 2001: US20010040155-A1

A processing chamber and methods for employing this processing chamber to thermally treat wafer-like objects. The chamber comprises a double walled shell, a pedestal style heater, internal passages for the transport of cooling gases and removal of exhaust gases, independently variable gas introducti ...


9
Devendra Kumar, Jeffrey D Womack, Vuong P Nguyen, Jack S Kasahara, Sokol Ibrani: Thermal processing system and methods for forming low-k dielectric films suitable for incorporation into microelectronic devices. Kagan Binder Pllc, March 11, 2004: US20040047993-A1

Single wafer processing methods and systems for manufacturing films having low-k properties and low indices of refraction. The methods incorporate a processing station in which both curing and post-cure, in situ gas cooling take place.