1
Shyam Venkataraman
Yuzhuo Li, Harvey Wayne Pinder, Shyam S Venkataraman: Chemical mechanical polishing (CMP) polishing solution with enhanced performance. BASF SE, Oblon Spivak McClelland Maier & Neustadt L, December 3, 2013: US08597539

This invention relates to a chemical composition for chemical mechanical polishing (CMP) of substrates that are widely used in the semiconductor industry. The inventive chemical composition contains additives that are capable of improving consistency of the polishing performance and extending the li ...


2
Shyam Venkataraman
Yuzhuo Li, Harvey Wayne Pinder, Shyam S Venkataraman: Chemical mechanical polishing (cmp) polishing solution with enhanced performance. Basf Se, November 3, 2011: US20110269312-A1

This invention relates to a chemical composition for chemical mechanical polishing (CMP) of substrates that are widely used in the semiconductor industry. The inventive chemical composition contains additives that are capable of improving consistency of the polishing performance and extending the li ...