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Rumiko Hayase, Yasunobu Onishi, Hirokazu Niki, Naohiko Oyasato, Yoshihito Kobayashi, Shuzi Hayase: Resist for forming patterns comprising an acid generating compound and a polymer having acid decomposable groups. Kabushiki Kaisha Toshiba, Oblon Spivak McClelland Maier & Neustadt, April 4, 1995: US05403695 (58 worldwide citation)

Disclosed herein is a resist for forming patterns, which is greatly sensitive to ultraviolet rays an ionizing radiation, and which can therefore form a high-resolution resist pattern if exposed to ultra violet rays or an unionizing radiation. Hence, the resist is useful in a method of manufacturing ...


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Shuzi Hayase, Yoshihiko Nakano, Rikako Kani, Mao Ito, Satoshi Mikoshiba, Takeshi Okino, Sawako Fujioka: Silicone polymer composition, method of forming a pattern and method of forming an insulating film. Kabushiki Kaisha Toshiba, Oblon Spivak McClelland Maier & Neustadt P C, October 5, 1999: US05962581 (37 worldwide citation)

A method of forming a pattern comprising the steps of forming a film of an organosilane compound comprising a polysilane having a repeating unit represented by the following general formula (1) on a substrate, irradiating an actinic radiation onto a predetermined portion of the film of the organosil ...


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Hideyuki Nishizawa, Shuichi Uchikoga, Yoshihiko Nakano, Shuzi Hayase: Organic field effect element having organic layers with different carrier concentrations. Kabushiki Kaisha Toshiba, Oblon Spivak McClelland Maier & Neustadt, October 11, 1994: US05355235 (33 worldwide citation)

There is disclosed an organic field effect element having an large ON/OFF current ratio. The organic field effect element includes a source electrode and a drain electrode formed separately to each other, a first organic layer constituting a channel between the source and drain electrodes, a second ...


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Hisayasu Mitsui, Ryozi Kumazawa, Yoshiyuki Inoue, Shuichi Suzuki, Takeo Ito, Sinichi Sanada, Shuzi Hayase: Electrically insulated coil. Tokyo Shibaura Denki Kabushiki Kaisha, Oblon Fisher Spivak McClelland & Maier, June 15, 1982: US04335367 (31 worldwide citation)

An electrically insulated coil is composed of a coil and a mica tape containing a first resinous composition, wound upon the coil; the resinous composition containing a maleimide compound, an epoxy resin, a curing catalyst consisting of an aluminum compound, and a curing accelerator selected from th ...


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Shuzi Hayase, Yasunobu Onishi, Shuichi Suzuki, Moriyasu Wada: Photopolymerizable epoxy resin composition. Kabushiki Kaisha Toshiba, Foley & Lardner Schwartz Jeffery Schwaab Mack Blumenthal & Evans, May 30, 1989: US04835193 (23 worldwide citation)

A photopolymerizable epoxy resin composition comprising (a) an epoxy resin and (b) a heteropoly-acid aromatic sulfonium salt or a heteropoly-acid aromatic iodonium salt as a photocuring catalyst exhibits rapid photopolymerization, with the cured product being great in hardness, the corrosive action ...


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Shuzi Hayase, Shuichi Suzuki, Moriyasu Wada: Photo-curable epoxy resin type composition. Kabushiki Kaisha Toshiba, Foley & Lardner Schwartz Jeffery Schwaab Mack Blumenthal & Evans, December 4, 1990: US04975471 (22 worldwide citation)

A photo-curable epoxy resin type composition which comprises (a) an epoxy resin, (b) at least one compound selected from the group consisting of (i) a compound having a group, other than an imido group, which is represented by the formula --CONH and (ii) an aromatic amine, (c) an organic metal compo ...


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Masayuki Oba, Rumiko Hayase, Naoko Kihara, Shuzi Hayase, Yukihiro Mikogami, Yoshihiko Nakano, Naohiko Oyasato, Shigeru Matake, Kei Takano: Photosensitive resin composition for forming polyimide film pattern comprising an o-quinone diazide photosensitive agent. Kabushiki Kaisha Toshiba, Oblon Spivak McClelland Maier & Neustadt, September 20, 1994: US05348835 (18 worldwide citation)

Disclosed is a photosensitive resin composition, containing a polyamic acid derivative having a repeating unit represented by general formula (1) given below and a photosensitive agent: ##STR1## where, R.sup.1 represents a tetravalent organic group, R.sup.2 represents a divalent organic group, and R ...


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Shuzi Hayase, Yasunobu Onishi, Shuichi Suzuki: Photo-curable epoxy resin composition. Tokyo Shibaura Denki Kabushiki Kaisha, Schwartz Jeffery Schwaab Mack Blumenthal & Koch, January 22, 1985: US04495042 (17 worldwide citation)

There is disclosed a photo-curable epoxy resin composition comprising an epoxy resin and a combination of an organic aluminum compound and a silicon compound having an o-nitrobenzyloxy group as a catalyst.