1
Meishi Tanaka, Shuji Sugiyama: Method of refining crude oil. Idemitsu Kosan, Frishauf Holtz Goodman Langer & Chick P C, December 22, 1998: US05851381 (64 worldwide citation)

A method of refining crude oil by distillation and desulfurization for the preparation of petroleum products can reduce cost of apparatus and cost of operation and can be operated with better stability by simplified control of operation. In the method, a naphtha fraction is separated from crude oil ...


2
Shuji Sugiyama, Shuji Syohda, Shinji Kuniyoshi: Optical exposer. Hitachi, Antonelli Terry & Wands, September 1, 1987: US04690529 (19 worldwide citation)

This invention relates to an optical exposer wherein a predetermined pattern is projected onto a work piece through a projector lens, and an alignment mark on the work piece is detected through the projector lens. It is desirable that a detection waveform of the alignment mark will not be deformed. ...


3
Hiroyuki Suzuki, Hiroyuki Shinada, Atsuko Takafuji, Yasutsugu Usami, Shuji Sugiyama: WORKPIECE HOLDER, SEMICONDUCTOR FABRICATING APPARATUS, SEMICONDUCTOR INSPECTING APPARATUS, CIRCUIT PATTERN INSPECTING APPARATUS, CHARGED PARTICLE BEAM APPLICATION APPARATUS, CALIBRATING SUBSTRATE, WORKPIECE HOLDING METHOD, CIRCUIT PATTERN INSPECTING METHOD, AND CHARGED PARTICLE BEAM APPLICATION METHOD. Hitachi, Kenyon & Kenyon, January 21, 2003: US06509564 (15 worldwide citation)

The present invention is intended to highly fast, stably acquire highly accurate images from irradiated positions with an electron beam on a circuit pattern in the step of fabricating a semiconductor device including an insulating material or a mixture of an insulating material and a conductive mate ...


4
Akihiro Takanashi, Norikazu Hashimoto, Hisashi Maejima, Shuji Sugiyama: Pattern exposing apparatus. Hitachi, Antonelli Terry & Wands, October 16, 1984: US04477182 (12 worldwide citation)

A pattern exposing apparatus comprising means for projecting a semiconductor device mask pattern onto the photoresist layer coated on a semiconductor substrate, and means for projecting an identification mark which is specific to each substrate onto a part of the photoresist layer.


5
Shuji Sugiyama: Projection aligner for fabricating semiconductor device having projection optics. Hitachi, Antonelli Terry Stout & Kraus, July 17, 1990: US04941745 (5 worldwide citation)

A projection aligner having a projection optics which project circuit patterns of reticles on a wafer next by step, comprising an X-Y stage mounting the wafer and moved to an X or Y direction by a stage controller, a developer for developing an alignment mark projected on the wafer by the projection ...


6
Shuji Sugiyama, Yoshimitsu Saze, Katsunori Onuki: Reduction exposure apparatus with correction for alignment light having inhomogeneous intensity distribution. Hitachi, Antonelli Terry Stout & Kraus, May 25, 1993: US05214493 (5 worldwide citation)

A diffraction grating shaped reference pattern having the same grating pitch as diffraction grating shaped alignment pattern formed on a wafer is irradiated by alignment light, and the diffracted light signal obtained from the reference pattern is stored in a memory. The diffraction grating shaped a ...


7
Hiroyuki Suzuki, Hiroyuki Shinada, Atsuko Takafuji, Yasutsugu Usami, Shuji Sugiyama: WORKPIECE HOLDER, SEMICONDUCTOR FABRICATING APPARATUS, SEMICONDUCTOR INSPECTING APPARATUS, CIRCUIT PATTERN INSPECTING APPARATUS, CHARGED PARTICLE BEAM APPLICATION APPARATUS, CALIBRATING SUBSTRATE, WORKPIECE HOLDING METHOD, CIRCUIT PATTERN INSPECTING METHOD, AND CHARGED PARTICLE BEAM APPLICATION METHOD. Hitachi, Kenyon & Kenyon, July 27, 2004: US06768113 (4 worldwide citation)

Heights of a sample are calibrated by setting a calibrating substrate on a stage and then irradiating a charged particle beam onto standard marks provided on at least two kinds of surfaces having different substrate heights. Secondary charged particles produced from said irradiated standard marks on ...


8
Yasuhiro Yoshitake, Yoshitada Oshida, Soichi Katagiri, Shuji Sugiyama, Yoshimitsu Saze: Method and apparatus for measuring minute displacement by subject light diffracted and reflected from a grating to heterodyne interference. Hitachi, Antonelli Terry Stout & Kraus, November 17, 1992: US05164789 (4 worldwide citation)

The present invention resides in method and apparatus for measuring a minute displacement, comprising applying a light of a first wavelength at a predetermined angle to a diffraction grating formed on an object whose position is to be detected, subjecting each of the resulting diffracted light and r ...


9
Shuji Sugiyama: Optical exposure apparatus. Hitachi, Antonelli Terry & Wands, October 7, 1986: US04615614 (3 worldwide citation)

An optical exposure apparatus which is suitable for the production of semiconductor devices. To minimize the regions which are not used for exposure around the periphery of a surface being exposed, such as the surface of a semiconductor wafer, a plurality of independent focusing detectors utilizing ...


10
Hiroyuki Suzuki, Hiroyuki Shinada, Atsuko Takafuji, Yasutsugu Usami, Shuji Sugiyama: Workpiece holder, semiconductor fabricating apparatus, semiconductor inspecting apparatus, circuit pattern inspecting apparatus, charged particle beam application apparatus, calibrating substrate, workpiece holding method, circuit pattern inspecting method, and charged particle beam application method. Hitachi, Kenyon & Kenyon, August 7, 2003: US20030146382-A1

Heights of a sample are calibrated by setting a calibrating substrate on a stage and then irradiating a charged particle beam onto standard marks provided on at least two kinds of surfaces having different substrate heights. Secondary charged particles produced from said irradiated standard marks on ...