1
Masahiko Ogino, Akira Nagai, Shuji Eguchi, Toshiaki Ishii, Masanori Segawa, Haruo Akahoshi, Akio Takahashi, Takao Miwa, Naotaka Tanaka, Ichirou Anjou: Semiconductor device having a stress relieving mechanism. Hitachi, Antonelli Terry Stout & Kraus, February 22, 2000: US06028364 (105 worldwide citation)

A semiconductor device has a multi-layered wiring structure having a conductor layer to be electrically connected to a packaging substrate, the structure being provided on a circuit formation surface of a semiconductor chip; and ball-like terminals disposed in a grid array on the surface of the mult ...


2
Shuji Eguchi, Akira Nagai, Haruo Akahoshi, Takumi Ueno, Toshiya Satoh, Masahiko Ogino, Asao Nishimura, Ichiro Anjo, Hideki Tanaka: Semiconductor module and method of mounting. Hitachi, Antonelli Terry Stout & Kraus, September 30, 2003: US06627997 (55 worldwide citation)

In a multi-chip module, a plurality of semiconductor chips are mounted on a single wiring board. Upper surfaces of the semiconductor chips are covered with a single heat spread plate, and the whole space around the semiconductor chips, sandwiched between the wiring board and the heat spread plate, i ...


3
Akira Nagai, Masatsugu Ogata, Shuji Eguchi, Masahiko Ogino, Toshiaki Ishii, Masanori Segawa, Hiroyoshi Kokaku, Ryo Moteki, Ichiro Anjoh: Laminate and multilayer printed circuit board. Hitachi, Pennie & Edmonds, September 5, 2000: US06114005 (45 worldwide citation)

A laminate capable of mounting semiconductor elements thereon; comprising an insulating layer which is constituted by a resin portion of sea-island structure and a woven reinforcement. The resin portion of sea-island structure is, for example, such that a resin as islands are dispersed in a resin as ...


4
Akira Nagai, Masatsugu Ogata, Shuji Eguchi, Masahiko Ogino, Toshiaki Ishii, Masanori Segawa, Hiroyoshi Kokaku, Ryo Moteki, Ichiro Anjoh: Laminate and multilayer printed circuit board. Hitachi, Pennie & Edmonds, October 14, 1997: US05677045 (39 worldwide citation)

A laminate capable of mounting semiconductor elements thereon; comprising an insulating layer which is constituted by a resin portion of sea-island structure and a woven reinforcement. The resin portion of sea-island structure is, for example, such that a resin as islands are dispersed in a resin as ...


5
Shigeharu Tsunoda, Junichi Saeki, Isamu Yoshida, Kazuya Ooji, Michiharu Honda, Makoto Kitano, Nae Yoneda, Shuji Eguchi, Kunihiko Nishi, Ichiro Anjoh, Kenichi Otsuka: Semiconductor device having a ball grid array package structure using a supporting frame. Hitachi, Fay Sharpe, Beall Minnich & McKee Fagan, June 22, 1999: US05914531 (28 worldwide citation)

A semiconductor plastic package, more particularly a preferred package structure and method for making a BGA package. A resin sealed BGA package where a supporting frame which fixedly supports semiconductor parts; i.e., an IC chip, a circuit board, or a circuit film, is sealed with resin, using a mo ...


6
Masatsugu Ogata, Teruo Kitamura, Shuji Eguchi, Kenji Akeyama: Stacked high mounting density semiconductor devices. Hitachi, Antonelli Terry Stout & Kraus, February 11, 1997: US05602420 (25 worldwide citation)

A semiconductor device is provided with a stack of a plurality of semiconductor elements each having a bump deposited on each of surface electrodes, and a plurality of leads disposed closely adjacent to the stacked semiconductor elements, the leads being bonded to the bumps respectively thereby stru ...


7
Akira Nagai, Shuji Eguchi, Masahiko Ogino, Masanori Segawa, Toshiak Ishii, Nobutake Tsuyuno, Hiroyoshi Kokaku, Rie Hattori, Makoto Morishima, Ichiro Anjoh, Kunihiro Tsubosaki, Chuichi Miyazaki, Makoto Kitano, Mamoru Mita, Norio Okabe: Circuit tape having adhesive film, semiconductor device, and a method for manufacturing the same. Hitachi, Hitachi Cable, Antonelli Terry Stout & Kraus, September 5, 2000: US06114753 (22 worldwide citation)

A semiconductor device having a superior connection reliability is obtained by providing a buffer body for absorbing the difference of thermal expansion between the mounting substrate and the semiconductor element in a semiconductor package structure, even if an organic material is used for the moun ...


8
Shuji Eguchi, Yasuhide Sugawara, Toshiaki Ishii, Hiroyoshi Kokaku, Akira Nagai, Ryou Moteki, Ogino Masahiko, Masanori Segawa, Rie Hattori, Nobutake Tsuyuno, Takumi Ueno, Atsushi Nakamura, Asao Nishimura: Resin sealed semiconductor devices and a process for manufacturing the same. Hitachi, Antonelli Terry Stout & Kraus, August 1, 2000: US06097100 (22 worldwide citation)

A resin encapsulated semiconductor element is encapsulated with resin composition containing an organic compound selected from the group consisting of organobromine compounds, organophosphorus compounds and organonitrogen compounds, an inorganic filler, and a metal borate. The obtained resin encapsu ...


9
Masahiko Ogino, Akira Nagai, Shuji Eguchi, Toshiaki Ishii, Masanori Segawa, Haruo Akahoshi, Akio Takahashi, Takao Miwa, Naotaka Tanaka, Ichirou Anjou: Method of making a semiconductor device having a stress relieving mechanism. Hitachi, Antonelli Terry Stout & Kraus, July 23, 2002: US06423571 (20 worldwide citation)

A method of forming a semiconductor device having a multi-layered wiring structure that includes a conductor layer to be electrically connected to a packaging substrate, with the multi-layered wiring structure being provided on a circuit formation surface of a semiconductor chip. Ball-like terminals ...


10
Seikichi Tanno, Noriaki Taketani, Shuji Eguchi, Hideki Asano, Yukio Shimazaki, Yuuetsu Takuma, Masahiko Ibamoto, Junji Mukai: Optical part including integral combination of optical fiber and light emitting or receiving element and method of manufacturing the same. Hitachi, Hitachi Cable, Antonelli Terry Stout & Kraus, August 7, 1990: US04946242 (17 worldwide citation)

An optical part for light transmission comprises a light conductor formed of a core of a transparent material and a clad of a material having a smaller refractive index than that of the core material, and a light emitting and/or receiving element, wherein the light emitting and/or receiving element ...