1
Takashi Matsumoto, Shinichi Kazui, Hideaki Sasaki, Tateoki Miyauchi, Tatsuji Sakamoto: Laser cleavage cutting method and system. Hitachi, Fay Sharpe Beall Fagan Minnich & McKee, October 19, 1999: US05968382 (76 worldwide citation)

A cutting system for cutting a workpiece by laser emission relies upon local cooling of the workpiece at the point at which cutting starts and ends. Optionally, local cooling can also be provided at a cross point where two cutting lines intersect. Relying upon the difference in thermal stress betwee ...


2
Mitsugu Shirai, Shinichi Kazui, Hideaki Sasaki, Keiji Fujikawa, Makoto Matsuoka: Printed circuit board, IC card, and manufacturing method thereof. Hitachi, Mattingly Stanger & Malur P C, October 24, 2000: US06137687 (42 worldwide citation)

In a method for manufacturing a printed circuit board, this printed circuit board can be manufactured by executing a simple manufacturing step within a short time period at in low cost without requiring a complex manufacturing process. A conductive material is pattern-printed on a base board and the ...


3
Kenichi Okada, Kyoko Amemiya, Takao Terabayashi, Hideaki Sasaki, Kuninori Imai, Shinichi Kazui: Multi-chip-module. Hitachi, Antonelli Terry Stout & Kraus, September 22, 1992: US05150274 (38 worldwide citation)

A multi-channel module with a plurality of chips is mounted on a multilayer circuit board and has a simple and highly reliable structure cooling system for cooling the heat generated by the chips consuming a large amount of electric power. The cooling system uses in the horizontal direction a coolan ...


4
Midori Imura, Makoto Morijiri, Masanobu Hanazono, Shinichi Kazui, Youzi Miura, Hiroyuki Ogino: Electroless plating process and process for producing multilayer wiring board. Hitachi, Antonelli Terry & Wands, April 21, 1987: US04659587 (35 worldwide citation)

In a selective electroless plating process suitable for formation and correction of a minute pattern by plating film, irradiation of the surface of a workpiece with a laser beam serves to selectively activate the surface of the workpiece to allow an electroless plating film to deposited on only the ...


5
Midori Imura, Makoto Morijiri, Masanobu Hanazono, Shinichi Kazui: Selective working method. Hitachi, Antonelli Terry & Wands, August 23, 1988: US04766009 (21 worldwide citation)

A selective working method in which the surface to be worked of a workpiece is locally irradiated with energy beams and an electroless plating solution or an electroless etching solution is contacted with the irradiated workpiece surface, with the electroless plating solution or the electroless etch ...


6
Shigenobu Maruyama, Mikio Hongo, Haruhisa Sakamoto, Tateoki Miyauchi, Ryohei Satoh, Kiyoshi Matsui, Shinichi Kazui, Kaoru Katayama, Hiroshi Fukuda: Method of modifying conductive lines of an electronic circuit board and its apparatus. Hitachi, Fay Sharpe Beall Fagan Minnich & McKee, November 10, 1998: US05832595 (19 worldwide citation)

A method of modifying an electronic circuit board by performing disconnection or connection of conductive lines at a specified or an arbitrary position of the conductive lines of the electronic circuit board thereby changing an electric circuit and of completely modifying an open pattern defect of t ...


7
Kaoru Katayama, Shinichi Kazui, Yasuhiro Iwata, Hiroshi Fukuda, Toshihiko Ohta: Process for making electronic device. Hitachi, Fay Sharpe Beall Fagan Minnich & McKee, March 19, 1996: US05499668 (17 worldwide citation)

Oxide films, and residues of organic matters, carbons, if any, are removed from a metal surface simply without using complicated steps and without giving adverse effects on electronic parts or electronic devices by irradiating the metal surface with a laser beam of lower energy level than energy cap ...


8
Shinichi Kazui, Makoto Matsuoka, Hideyuki Fukasawa, Mitsunori Tamura, Mitsugu Shirai, Hideaki Sasaki: Method for forming conductive bumps. Hitachi, Evenson McKeown Edwards & Lenahan P L L C, September 3, 1996: US05551148 (14 worldwide citation)

A flexible film-like member having conductive metals filled in tapered holes extending through the thickness is positioned such that the holes of the member face to respective pad patterns on a circuit board on which bumps are to be formed, the conductive metals are then heated and fused so that the ...


9
Tsutomu Shibuya, Kaoru Katayama, Mitugu Shirai, Shinichi Kazui, Hideaki Sasaki, Yasuhiro Iwata: Surface reformation method of high polymer material. Hitachi, Fay Sharpe Beall Fagan Minnich & McKee, September 1, 1998: US05801350 (12 worldwide citation)

A surface reformation method of a high polymer material irradiates an excimer-laser beam to only a predetermined area in which electronic parts and the like are temporarily immobilized by a liquid on a substrate which has a high polymer layer on the surface. The wettability of the liquid for tempora ...


10
Yutaka Hashimoto, Hideaki Sasaki, Shinichi Kazui: Method and apparatus for measuring the height of an object. Hitachi, Fay Sharpe Beall Fagan Minnich & McKee, May 30, 2000: US06069701 (11 worldwide citation)

A method and an apparatus for measuring the height of an apex of an object with high accuracy without influence of the surface state of the object are disclosed. Correlation coefficients of respective positions of a waveform formed from digital data indicative of the height of the object detected by ...