1
Chuan Yi Lin, Song Bor Lee, Ching Kun Huang, Sheng Yuan Lin: Method of forming through-silicon vias. Taiwan Semiconductor Manufacturing Company, Slater & Matsil L, November 2, 2010: US07825024 (80 worldwide citation)

A method of forming a semiconductor device having a through-silicon via (TSV) is provided. A semiconductor device is provided having a first dielectric layer formed thereon. One or more dielectric layers are formed over the first dielectric layer, such that each of the dielectric layers have a stack ...


2
Ming Fa Chen, Sheng Yuan Lin: Isolation structure for protecting dielectric layers from degradation. Taiwan Semiconductor Manufacturing Company, Slater & Matsil L, November 8, 2011: US08053902 (17 worldwide citation)

An integrated circuit structure includes a semiconductor substrate; and an interconnect structure overlying the semiconductor substrate. A solid metal ring is formed in the interconnect structure, with substantially no active circuit being inside the solid metal ring. The integrated circuit structur ...


3
Chuan Yi Lin, Ching Chen Hao, Chen Cheng Chou, Sheng Yuan Lin: On-chip heat spreader. Taiwan Semiconductor Manufacturing Company, Slater & Matsil L, November 20, 2012: US08314483 (11 worldwide citation)

A three dimensional (3D) stacked chip structure with chips having on-chip heat spreader and method of forming are described. A 3D stacked chip structure comprises a first die having a first substrate with a dielectric layer formed on a front surface. One or more bonding pads and a heat spreader may ...


4
Ssu Hsuan Chou, Nien Ting Weng, Sheng Yuan Lin: Fingerprint sensor module. Cheng Uei Precision, Lin & Associates IP, November 3, 2015: US09177190 (10 worldwide citation)

A fingerprint sensor module includes a lens, a filter, a first reflector, an image capturing module for capturing a first fingerprint image and a second fingerprint image, and at least one first light source for providing the needed light source at the time of the image capturing module capturing th ...


5
Chuan Yi Lin, Ching Chen Hao, Chen Cheng Chou, Sheng Yuan Lin: Forming seal ring in an integrated circuit die. Taiwan Semiconductor Manufacturing Company, Slater & Matsil L, May 1, 2012: US08168529 (9 worldwide citation)

The formation of a seal ring in a semiconductor integrated circuit (IC) die is described. Through-silicon vias (TSVs) are typically formed in a semiconductor IC die to facilitate the formation of a three dimensional (3D) stacking die structure. The TSVs may be utilized to provide electrical connecti ...


6
Fu Ji Yang, Chun Lin Tsai, Chien Chih Chou, Ting Jia Hu, Sheng Yuan Lin: Method of reducing NMOS device current degradation via formation of an HTO layer as an underlying component of a nitride-oxide sidewall spacer. Taiwan Semiconductor Manufacturing Company, George O Saile, Stephen B Ackerman, March 9, 2004: US06703282 (5 worldwide citation)

A method of forming an NMOS device with reduced device degradation, generated during a constant current stress, has been developed. The reduced device degradation is attributed to the use of a high temperature oxide (HTO), layer, used as an underlying component of composite insulator spacers, formed ...


7
Sheng yuan Lin: Multi-interface conversion device. Genesys Logic, October 6, 2009: US07600069 (3 worldwide citation)

A multi-interface conversion device includes a USB-to-IDE interface bridging unit, an IDE-to-SATA interface bridging unit, an IDE switching unit, and a switching logic unit. The USB-to-IDE interface bridging unit provides USB to IDE bridging and conversion. The IDE-to-SATA interface bridging unit pr ...


8
Chuan Yi Lin, Ching Chen Hao, Chen Cheng Chou, Sheng Yuan Lin: On-chip heat spreader. Taiwan Semiconductor Manufacturing Company, Slater & Matsil L, December 17, 2013: US08609506 (1 worldwide citation)

A three dimensional (3D) stacked chip structure with chips having on-chip heat spreader and method of forming are described. A 3D stacked chip structure comprises a first die having a first substrate with a dielectric layer formed on a front surface. One or more bonding pads and a heat spreader may ...


9
Chuan Yi Lin, Ching Chen Hao, Chen Cheng Chou, Sheng Yuan Lin: Seal ring in an integrated circuit die. Taiwan Semiconductor Manufacturing Company, Slater and Matsil L, June 3, 2014: US08742583

The formation of a seal ring in a semiconductor integrated circuit (IC) die is described. Through-silicon vias (TSVs) are typically formed in a semiconductor IC die to facilitate the formation of a three dimensional (3D) stacking die structure. The TSVs may be utilized to provide electrical connecti ...


10
Chuan Yi Lin, Ching Chen Hao, Chen Cheng Chou, Sheng Yuan Lin: On-chip heat spreader. Taiwan Semiconductor Manufacturing Company, Slater and Matsil L, July 15, 2014: US08779572

A three dimensional (3D) stacked chip structure with chips having on-chip heat spreader and method of forming are described. A 3D stacked chip structure comprises a first die having a first substrate with a dielectric layer formed on a front surface. One or more bonding pads and a heat spreader may ...