1
James W Wilson, Stephen R Engle, Scott P Moore: Thermally enhanced ball grid array package. International Business Machines Corporation, Calfee Halter & Griswold, November 5, 1996: US05572405 (68 worldwide citation)

A thermally enhanced ball grid array package for electronic components, with an electronic and a plurality of ceramic component carriers bonded to a metal heat sink, enhances thermal performance, reduces solder ball fatigue and reduces stresses between the ceramic component carriers and the heat sin ...


2
Stephen R Engle, Scott P Moore, Mukund K Saraiya: Ceramic chip carrier with lead frame or edge clip. International Business Machines, Bernard Tiegerman, September 7, 1993: US05243133 (55 worldwide citation)

A ceramic chip carrier is disclosed which includes a ceramic substrate having a circuitized surface, at least one semiconductor chip mounted on the circuitized surface, and a lead frame or edge clip which is mechanically and electrically connected to contact pads on the circuitized surface. Each mec ...


3
Lance A Bronson, Scott P Moore, John A Shriver III: Pinned ceramic chip carrier. International Business Machines, Bernard Tiegerman, February 22, 1994: US05288944 (30 worldwide citation)

A ceramic chip carrier is disclosed which preferably includes a ceramic substrate having a circuitized surface, at least one semiconductor chip mounted on the circuitized surface, and at least one pin which is mechanically and electrically connected to a contact pad on the circuitized surface. Each ...


4
John S Kresge, Scott P Moore, Robin A Susko, James W Wilson: Semiconductor structure interconnector and assembly. International Business Machines Corporation, Heslin & Rothenberg P C, May 9, 2000: US06059579 (7 worldwide citation)

An assembly and process for connecting opposed semiconductor structures (12,14) comprising at least two structures. An interconnect (16) between the structures (12,14) connects the structures in opposed spaced relation to each other. The interconnect comprises a first material (18) and a second mate ...


5
Stephen W MacQuarrie, Scott P Moore: Optimization of electronic package geometry for thermal dissipation. International Business Machines Corporation, Scully Scott Murphy & Presser P C, Carl Lanuti Esq, June 15, 2010: US07737550 (6 worldwide citation)

An electronic package device is disclosed including a microelectronic package and a heat sink positioned over the microelectronic package. A thermal interface element is positioned between the microelectronic package and the heat sink. The thermal interface element is elongated and has differing thi ...


6
Steven W Anderson, Scott P Moore, Cheryl L Palomaki, Son K Tran: Method of making a circuitized substrate having a plurality of solder connection sites thereon. Endicott Interconnect Technologies, Lawrence R Fraley, Hinman Howard & Kattell, April 26, 2007: US20070090170-A1

A method of making a circuitized substrate in which solder material (e.g., in paste form) is deposited through a screen onto individual conductors in a spaced pattern of individual solder “islands”. A solder flux is then deposited onto the “islands” causing these to spread out and form a continuous ...


7
Virendra R Jadhav, Scott P Moore: Structure for controlled collapse chip connection with a captured pad geometry. International Business Machines Corporation, Cantor Colburn IBM Fishkill, June 19, 2008: US20080142968-A1

A structure for controlled collapse chip connection disposed above a substrate. The substrate has two faces, with the second face being disposed substantially parallel to the first face. A contact pad in signal communication with the integrated circuit is disposed on the second face. A first passiva ...


8
Stephen W MacQuarrie, Scott P Moore: Optimization of electronic package geometry for thermal dissipation. International Business Machines Corporation, Scully Scott Murphy & Presser PC, March 5, 2009: US20090059537-A1

An electronic package device is disclosed including a microelectronic package and a heat sink positioned over the microelectronic package. A thermal interface element is positioned between the microelectronic package and the heat sink. The thermal interface element is elongated and has differing thi ...