1
Scott L Jacobs, Perwaiz Nihal, Burhan Ozmat, Henri D Schnurmann: High performance integrated circuit packaging structure. International Business Machines Corporation, Steven J Meyers, Aziz M Ahsan, March 7, 1989: US04811082 (428 worldwide citation)

A high speed, high performance integrated circuit packaging structure that may be used for emulating wafer scale integration structures. The preferred embodiment comprises an interposer having a base substrate having alternating insulation and conductive layers thereon, wherein a plurality of the co ...


2
Scott L Jacobs: Extended integration semiconductor structure with wiring layers. Mosaic, Fleit Jacobson Cohn Price Holman & Stern, October 8, 1991: US05055907 (169 worldwide citation)

A low cost, lightweight, fast, dense and reliable extended integration semiconductor structure is provided by forming a thin film multilayer wiring decal on a support substrate and aligning and attaching one or more integrated chips to the decal. A support ring is attached to the decal surrounding t ...


3
Iwona Turlik, Arnold Reisman, Deepak Nayak, Lih Tyng Hwang, Giora Dishon, Scott L Jacobs, Robert F Darveaux, Neil M Poley: High performance integrated circuit chip package. MCNC, IBM Corporation, Northern Telecom, Bell Seltzer Park & Gibson, June 28, 1994: US05325265 (133 worldwide citation)

A high performance integrated circuit chip package includes a support substrate having conductors extending from one face to the opposite face thereof and a multilayer wiring substrate on the opposite face of the support substrate for connecting chips mounted thereon to one another and to the conduc ...


4
Scott L Jacobs, Maurice T McMahon Jr, Perwaiz Nihal, Burhan Ozmat, Henri D Schnurmann, Arthur R Zingher: Method of partitioning, testing and diagnosing a VLSI multichip package and associated structure. International Business Machines Corporation, Steven J Meyers, Yen S Yee, March 28, 1989: US04817093 (101 worldwide citation)

A self-contained method and structure for partitioning, testing and diagnosing a multi-chip packaging structure. The method comprises the steps of electronically inhibiting all chips in the multi-chip package except for the chip or chips under test, creating a signature of the chip or chips under te ...


5
Scott L Jacobs, Perwaiz Nihal, Burhan Ozmat, Henri D Schnurmann, Arthur R Zingher: Module for packaging semiconductor integrated circuit chips on a base substrate. International Business Machines Corporation, Aziz M Ahsan, Steven J Meyers, September 12, 1989: US04866507 (85 worldwide citation)

An integrated circuit chip packaging structure, preferably having a semiconductor base substrate, i.e., silicon or gallium arsenide, alternating insulation and conductive layers on the base structure, at least two conductive layers being patterned into thin film wiring (i.e., thin film copper of app ...


6
Scott L Jacobs: Method of making a extended integration semiconductor structure. Polylithics, Fleit Jacobson Cohn Price Holman & Stern, March 9, 1993: US05192716 (64 worldwide citation)

A low cost, lightweight, fast, dense and reliable extended integration semiconductor structure is provided by forming a thin film multilayer wiring decal on a support substrate and aligning and attaching one or more integrated chips to the decal. A support ring is attached to the decal surrounding t ...


7
Scott L Jacobs: Microelectronic packages including thin film decal and dielectric adhesive layer having conductive vias therein, and methods of fabricating the same. Virtual Integration, Daniels & Daniels P A, September 25, 2001: US06294407 (48 worldwide citation)

Microelectronic packages may be fabricated by forming a release layer on a process substrate. A thin film decal is formed on the release layer. The thin film decal includes first and second opposing decal faces, first decal input/output pads on the first decal face, second decal input/output pads on ...


8
Edward D Babich, Michael Hatzakis, Scott L Jacobs, Juri R Parasczcak, Jane M Shaw, David F Witman: Plasma-resistant polymeric material, preparation thereof, and use thereof. International Business Machines Corporation, Pollock Vande Sande & Priddy, November 1, 1988: US04782008 (22 worldwide citation)

Plasma-resistant polymeric materials are prepared by reacting a polymeric material containing reactive hydrogen functional groups with a multifunctional organometallic material containing at least two functional groups which are reactive with the reactive hydrogen functional groups of the polymeric ...


9
Edward D Babich, Michael Hatzakis, Scott L Jacobs, Juri R Parasczcak, Jane M Shaw, David F Witman: Plasma-resistant polymeric material, preparation thereof, and use thereof. International Business Machines Corporation, Pollock Vande Sande & Priddy, January 1, 1991: US04981909 (8 worldwide citation)

Plasma-resistant polymeric materials are prepared by reacting a polymeric material containing reactive hydrogen functional groups with a multifunctional organometallic material containing at least two functional groups which are reactive with the reactive hydrogen functional groups of the polymeric ...


10
William R Brunsvold, Willard E Conley, Scott L Jacobs, George L Mack, David P Merritt, Ann M Uptmor: Polyimide formulation for forming a patterned film on a substrate. International Business Machines Corporation, Perman & Green, May 9, 1989: US04828964 (3 worldwide citation)

A composition for use in a process for the deposition of patterned thin metal films on integrated circuit substrates, the composition comprising an admixture of a thermoplastic polyimide resin and a coumarin dye dissolved in a substituted phenol solvent. Optionally a polar solvent having a boiling p ...