1
Satoshi Odashima: Anisotropically electroconductive adhesive composition. Shin Etsu Polymer, McAulay Fisher Nissen Goldberg & Kiel, August 9, 1994: US05336443 (80 worldwide citation)

An improvement is proposed in an anisotropically electroconductive adhesive composition comprising an insulating adhesive resin as a matrix and electroconductive carbon particles dispersed in the matrix used for electrically connecting oppositely facing electrode terminals on various kinds of electr ...


2
Satoshi Odashima: Anisotropically electroconductive adhesive and adhesively bonded structure therewith. Shin Etsu Polymer, McAulay Fisher Nissen Goldberg & Kiel, February 2, 1993: US05183969 (36 worldwide citation)

A device is proposed to detect firm and reliable adhesive bonding and electrical connection between electrode arrays on two circuit boards by sandwiching a layer of an anisotropically electroconductive adhesive composition, in which the adhesive composition is formulated with an epoxy resin capable ...


3
Naoki Fujinami, Kazuyoshi Yoshida, Satoshi Odashima: Heat-sealable connector sheet. Shin Etsu Polymer, McAulay Fisher Nissen Goldberg & Kiel, December 6, 1994: US05371327 (17 worldwide citation)

Proposed is a novel heat-sealable connector sheet, by which very reliable electric connection can be obtained with electrode terminals on an electronic device or a circuit board, consisting of a flexible insulating plastic substrate sheet and a patterned electroconductive layer formed thereon from a ...


4
Toshihiko Egawa, Satoshi Odashima: Anti-glare covering for illuminate indicator. Shin Etsu Polymer, McAulay Fisher Nissen Goldberg & Kiel, April 9, 1991: US05005949 (11 worldwide citation)

The anti-glare covering for illuminate switch or indicator of the invention is formed of a covering member shaped from a transparent synthetic resin and a microlouver-type anti-glare sheet melt-bonded to the lower surface of the covering member. This structure is different from conventional anti-gla ...


5
Kiyofumi Tanaka, Satoshi Odashima, Noriyoshi Hosono, Hironobu Fujimoto, Takeshi Segawa: Holding jig, semiconductor wafer grinding method, semiconductor wafer protecting structure and semiconductor wafer grinding method and semiconductor chip fabrication method using the structure. Shin Etsu Polymer, Lintec Corporation, Buchanan Ingersoll & Rooney PC, January 25, 2011: US07875501 (8 worldwide citation)

A backgrinding machine 10 of a semiconductor wafer W includes: a table 13 set on the working plane of a mount 11; a multiple number of holding jigs 20 arranged via check tables 15 on table 13; a grinding machine 30 for performing a grinding process of the rear side of semiconductor wafer W held by h ...


6
Satoshi Odashima, Kazuyoshi Yoshida: Heat-sealable connector and method for the preparation thereof. Shin Etsu Polymer, McAulay Fisher Nissen Goldberg & Kiel, January 16, 1996: US05484648 (6 worldwide citation)

Proposed is an improved heat-sealable connector having aligned lines of an electroconductive paste formed by screen printing on the surface of a flexible substrate. Different from conventional heat-sealable connectors, the electroconductive lines are not formed directly on the surface of the substra ...


7
Satoshi Odashima, Kazuyoshi Yoshida: Heat-sealable connector and method for the preparation thereof. Shin Etsu Polymer, McAulay Fisher Nissen Goldberg & Kiel, November 28, 1995: US05470607 (3 worldwide citation)

Proposed is an improved heat-sealable connector having aligned lines of an electroconductive paste formed by screen printing on the surface of a flexible substrate. Different from conventional heat-sealable connectors, the electroconductive lines are not formed directly on the surface of the substra ...


8
Kiyofumi Tanaka, Satoshi Odashima, Noriyoshi Hosono, Hironobu Fujimoto, Takeshi Segawa: Holding jig, semiconductor wafer grinding method, semiconductor wafer protecting structure and semiconductor wafer grinding method and semiconductor chip fabrication method using the structure. Shin Etsu Polymer, Lintec Corporation, Buchanan Ingersoll & Rooney PC, July 3, 2012: US08212345 (2 worldwide citation)

A backgrinding machine 10 of a semiconductor wafer W includes: a table 13 set on the working plane of a mount 11; a multiple number of holding jigs 20 arranged via check tables 15 on table 13; a grinding machine 30 for performing a grinding process of the rear side of semiconductor wafer W held by h ...


9
Satoshi Odashima, Hidehiro Masuko: Injection molding die and injection molding method. Shin Etsu Polymer, Osha • Liang, May 15, 2012: US08178024 (1 worldwide citation)

A die is formed of a cavity mold having a hollow portion and a slidable core mold that allows a core to be inserted into hollow portion of cavity mold. An insert part that has been previously molded is fitted to and supported by the front end of core of core mold. Then, insert part is inserted into ...


10
Satoshi Odashima, Hidehiro Masuko: Lid body for substrate storage container and substrate storage container. Shin Etsu Polymer, Osha Liang, December 4, 2012: US08322533 (1 worldwide citation)

A substrate storage container includes a locking mechanism, provided in a lid for opening and closing an opened front portion of a container body which stores a substrate of three sheets or less, for locking the lid fitted into the front portion of the container body. The locking mechanism is suppor ...