1
Salman Akram, Alan G Wood, Warren M Farnworth: Single piece package for semiconductor die. Micron Technology, Stephen A Gratton, April 14, 1998: US05739585 (372 worldwide citation)

A method for packaging a bare semiconductor die using a one piece package body with a pattern of external conductors is provided. The package body includes a die mounting location and an interconnect opening that aligns with the bond pads on the die. Electrical interconnects, such as wire bonds, are ...


2
Salman Akram, Alan G Wood, Warren M Farnworth: Stackable chip scale semiconductor package with mating contacts on opposed surfaces. Micron Technology, Stephen A Gratton, January 11, 2000: US06013948 (337 worldwide citation)

A stackable chip scale semiconductor package and a method for fabricating the package are provided. The package includes a substrate having a die mounting site wherein a semiconductor die is mounted. The package also includes first contacts formed on a first surface of the substrate, and second cont ...


3
Salman Akram, Alan G Wood, Warren M Farnworth: Method for fabricating stackable chip scale semiconductor package. Micron Technology, Stephen A Gratton, May 22, 2001: US06235554 (314 worldwide citation)

A stackable chip scale semiconductor package and a method for fabricating the package are provided. The package includes a substrate having a die mounting site wherein a semiconductor die is mounted. The package also includes first contacts formed on a first surface of the substrate, and second cont ...


4
Salman Akram, Alan G Wood, Warren M Farnworth: Method of producing a single piece package for semiconductor die. Micron Technology, Stephen A Gratton, October 7, 1997: US05674785 (281 worldwide citation)

A method for packaging a bare semiconductor die using a one piece package body with a pattern of external conductors is provided. The package body includes a die mounting location and an interconnect opening that aligns with the bond pads on the die. Electrical interconnects, such as wire bonds, are ...


5
Salman Akram, Warren M Farnworth, Alan G Wood: Method for fabricating semiconductor components using focused laser beam. Micron Technology, Stephen A Graton, September 5, 2000: US06114240 (266 worldwide citation)

A method for fabricating semiconductor components, such as packages, interconnects and test carriers, is provided. The method includes laser machining conductive vias for interconnecting contacts on the component, using a laser beam that is focused to produce a desired via geometry. The vias can inc ...


6
Warren M Farnworth, Salman Akram, Alan G Wood: Method for forming contact pins for semiconductor dice and interconnects. Micron Technology, Stephen A Gratton, March 5, 1996: US05495667 (253 worldwide citation)

A method for forming contact pins adapted to form an electrical connection with a mating contact location is provided. In a first embodiment, the contact pins are formed on an interconnect used for testing a semiconductor die and are adapted to establish an electrical connection with the bond pads o ...


7
Salman Akram, Warren M Farnworth: Integrated circuit package and method of fabrication. Micron Technology, Dickstein Shapiro Morin & Oshinsky, February 22, 2000: US06028365 (252 worldwide citation)

The present invention is directed to a semiconductor package and its method of manufacture. Conductors mounted on a flexible polymer tape are used to connect a semiconductor chip to a substrate. The flexible polymer tape can be folded back under the chip to reduce the size necessary for mounting the ...


8
Salman Akram, David R Hembree, Warren M Farnworth: Micromachined chip scale package. Micron Technology, Task Britt & Rossa, June 6, 2000: US06072236 (240 worldwide citation)

A chip scale package comprised of a semiconductor die having a silicon blank laminated to its active surface. The bond pads of the die are accessed through apertures micromachined through the blank. The package may be employed with wire bonds, or solder or other conductive bumps may be placed in the ...


9
Salman Akram, Warren M Farnworth, Alan G Wood: Method for fabricating a self limiting silicon based interconnect for testing bare semiconductor dice. Micron Technology, Stephen A Gratton, January 16, 1996: US05483741 (222 worldwide citation)

A method for forming a self-limiting, silicon based interconnect for making temporary electrical contact with bond pads on a semiconductor die is provided. The interconnect includes a silicon substrate having an array of contact members adapted to contact the bond pads on the die for test purposes ( ...


10
Salman Akram: Semiconductor devices having protective layers thereon through which contact pads are exposed and stereolithographic methods of fabricating such semiconductor devices. Micron Technology, TraskBritt P C, December 4, 2001: US06326698 (209 worldwide citation)

A method for forming packaged substrates, including flip-chip dice individually or in a multi-die wafer. The method includes using a stereolithographic process to form a protective dielectric polymeric sealing structure on at least the active surface of the substrate. In addition, the invention enco ...



Click the thumbnails below to visualize the patent trend.