1
Russell Rapport, Jeff Buchle: Clock driver with instantaneously selectable phase and method for use in data communication systems. Staktek Group, J Scott Denko, George &plus Donaldson, August 28, 2001: US06282210 (88 worldwide citation)

A clock driver providing a clock signal, from an input clock signal, that has instantaneously selectable phase and methods for synchronizing data transfers in a multi-signal bus communication system. A clock driver of the present invention generates an output clock signal from an input clock signal ...


2
Russell Rapport, James W Cady, James Wilder, David L Roper, James Douglas Wehrly Jr, Jeff Buchle: Memory expansion and chip scale stacking system and method. Staktek Group, Andrews Kurth, July 5, 2005: US06914324 (73 worldwide citation)

The present invention stacks chip scale-packaged integrated circuits (CSPs) into modules that conserve PWB or other board surface area. In another aspect, the invention provides a lower capacitance memory expansion addressing system and method and preferably with the CSP stacked modules provided her ...


3
Russell Rapport: Reflection-control system and method. Staktek Group, Andrews Kurth, J Scott Denko, January 31, 2006: US06992501 (70 worldwide citation)

A termination circuit changes impedance to match a transmission line impedance. The change is made after a signal driver applies a signal through the termination circuit to the transmission line but before a signal reflection returns from an end of the transmission line.


4
James W Cady, James Wilder, David L Roper, Russell Rapport, James Douglas Wehrly Jr, Jeffrey Alan Buchle: Integrated circuit stacking system and method. Staktek Group, Andrews Kurth L, September 6, 2005: US06940729 (26 worldwide citation)

The present invention stacks packaged integrated circuits into modules that conserve PWB or other board surface area. The invention provides techniques and structures for aggregating chip scale-packaged integrated circuits (CSPs) or leaded packages with other CSPs or with monolithic or stacked leade ...


5
James Douglas Wehrly Jr, Paul Goodwin, Russell Rapport: Flex circuit constructions for high capacity circuit module systems and methods. Entorian Technologies, Fish & Richardson P C, November 10, 2009: US07616452 (21 worldwide citation)

Provided circuit modules employ flexible circuitry populated with integrated circuitry (ICs). The flex circuitry is disposed about a rigid substrate. Contacts distributed along the flexible circuitry provide connection between the module and an application environment. A strain relief portion of the ...


6
Russell Rapport, James W Cady, James Wilder, David L Roper, James Douglas Wehrly Jr, Jeff Buchle: Memory expansion and chip scale stacking system and method. Staktek Group, Andrews Kurth, J Scott Denko, October 18, 2005: US06955945 (7 worldwide citation)

The present invention stacks chip scale-packaged integrated circuits (CSPs) into modules that conserve PWB or other board surface area. In another aspect, the invention provides a lower capacitance memory expansion addressing system and method and preferably with the CSP stacked modules provided her ...


7
John Thomas, Russell Rapport, Robert Washburn: Flex circuit apparatus and method for adding capacitance while conserving circuit board surface area. Entorian Technologies, Fish & Richardson P C, August 18, 2009: US07576995 (6 worldwide citation)

An apparatus and a method for adding capacitance while conserving circuit board surface area. An apparatus for adding capacitance while conserving circuit board surface area includes a flex capacitor circuit with an upper surface and a lower surface and a plurality of conductive layers and an integr ...


8
James W Cady, Russell Rapport: Rambus stakpak. Staktek Group, J Scott Denko, George & Donaldson L, June 11, 2002: US06404662 (6 worldwide citation)

The RAMBUS compatible configuration of the present invention is achieved by stacking one of the two modules in the stacked configuration in an upside-down position with respect to the other. This way, the corresponding electrical leads of each memory module will extend on opposite sides of the stack ...


9
Russell Rapport, James W Cady, James Wilder, David L Roper, James Douglas Wehrly Jr, Jeff Buchle, Julian Dowden: Stacking system and method. Entorian Technologies, Fish & Richardson P C, February 24, 2009: US07495334 (3 worldwide citation)

The present invention stacks chip scale-packaged integrated circuits (CSPs) into modules that conserve PWB or other board surface area. In a two-high CSP stack or module devised in accordance with a preferred embodiment of the present invention, two CSPs are stacked, with one CSP disposed above the ...


10
James W Cady, James Wilder, David L Roper, Russell Rapport, James Douglas Wehrly Jr, Jeffrey Alan Buchle: Integrated circuit stacking system. Enthorian Technologies, Fish & Richardson P C, October 20, 2009: US07606048 (3 worldwide citation)

The present invention stacks packaged integrated circuits into modules that conserve PWB or other board surface area. The present invention can be used to advantage with packages of a variety of sizes and configurations ranging from larger packaged base elements having many dozens of contacts to sma ...